Applied Materials Patent Applications

OXIDE ETCH SELECTIVITY ENHANCEMENT

Granted: June 22, 2017
Application Number: 20170178924
A method of etching exposed silicon oxide on patterned heterogeneous structures is described and includes a gas phase etch using plasma effluents formed in a remote plasma. The remote plasma excites a fluorine-containing precursor in combination with an oxygen-containing precursor. Plasma effluents within the remote plasma are flowed into a substrate processing region where the plasma effluents combine with water vapor or an alcohol. The combination react with the patterned heterogeneous…

EXOTHERMIC POWDERS FOR ADDITIVE MANUFACTURING

Granted: June 15, 2017
Application Number: 20170165865
A method of additive manufacturing to form a component comprises successively depositing a plurality of layers to form the component. Depositing at least one of the plurality of layers includes depositing a layer of a first particulate precursor over a platen, depositing a second particulate precursor on portions of the platen over the layer of the first particulate precursor specified by a controller, and directing energy to the second particulate precursor deposited on the portion of…

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS IN CHEMICAL MECHANICAL POLISHING

Granted: June 1, 2017
Application Number: 20170151647
A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing…

CORROSION CONTROL FOR CHAMBER COMPONENTS

Granted: June 1, 2017
Application Number: 20170152968
Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon…

SELF-ALIGNED SHIELDING OF SILICON OXIDE

Granted: May 25, 2017
Application Number: 20170148642
Methods of etching silicon nitride faster than silicon or silicon oxide are described. Methods of selectively depositing additional material onto the silicon nitride are also described. Exposed portions of silicon nitride and silicon oxide may both be present on a patterned substrate. A self-assembled monolayer (SAM) is selectively deposited over the silicon oxide but not on the exposed silicon nitride. Molecules of the self-assembled monolayer include a head moiety and a tail moiety,…

ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY

Granted: May 4, 2017
Application Number: 20170125313
A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the…

APPLYING DIMENSIONAL REDUCTION TO SPECTRAL DATA FROM POLISHING SUBSTRATES

Granted: April 27, 2017
Application Number: 20170113320
A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.

RADIAL WAVEGUIDE SYSTEMS AND METHODS FOR POST-MATCH CONTROL OF MICROWAVES

Granted: April 20, 2017
Application Number: 20170110290
A system provides post-match control of microwaves in a radial waveguide. The system includes the radial waveguide, and a signal generator that provides first and second microwave signals that have a common frequency. The signal generator adjusts a phase offset between the first and second signals in response to a correction signal. The system also includes first and second electronics sets, each of which amplifies a respective one of the first and second microwave signals. The system…

Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance

Granted: April 20, 2017
Application Number: 20170110293
A bulk, sintered solid solution-comprising ceramic article useful in semiconductor processing, which is resistant to erosion by halogen-containing plasmas and provides advantageous mechanical properties. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide and zirconium oxide. The bulk, sintered solid solution-comprising article is formed from zirconium oxide at a molar concentration ranging from about 96 mole % to about 94 mole %, and yttrium oxide…

HIGH ASPECT RATIO 3-D FLASH MEMORY DEVICE

Granted: April 20, 2017
Application Number: 20170110475
Methods of selectively etching tungsten from the surface of a patterned substrate are described. The etch electrically separates vertically arranged tungsten slabs from one another as needed, for example, in the manufacture of vertical flash memory devices. The tungsten etch may selectively remove tungsten relative to films such as silicon, polysilicon, silicon oxide, aluminum oxide, titanium nitride and silicon nitride. The methods include exposing electrically-shorted tungsten slabs to…

POLISHING APPARATUS HAVING OPTICAL MONITORING OF SUBSTRATES FOR UNIFORMITY CONTROL AND SEPARATE ENDPOINT SYSTEM

Granted: April 13, 2017
Application Number: 20170100814
A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.

STRUCTURE AND METHOD OF FABRICATING THREE-DIMENSIONAL (3D) METAL-INSULATOR-METAL (MIM) CAPACITOR AND RESISTOR IN SEMI-ADDITIVE PLATING METAL WIRING

Granted: April 13, 2017
Application Number: 20170104056
Methods of processing a substrate include: providing a substrate having a polymer dielectric layer, a metal pad formed within the polymer dielectric layer and a first metal layer formed atop the polymer dielectric layer; depositing a polymer layer atop the substrate; patterning the polymer layer to form a plurality of openings, wherein the plurality of openings comprises a first opening formed proximate the metal pad; depositing a first barrier layer atop the polymer layer; depositing a…

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

Granted: March 30, 2017
Application Number: 20170092551
A method of polishing includes storing a predetermined location and a predetermined number as criteria for detecting an end point, polishing a substrate, measuring a sequence of current spectra of light reflected from the substrate while the substrate is being polished, identifying a plurality of peaks or valleys that persist with an evolving location through at least some of the sequence of current spectra, counting a number of peaks or valleys that were identified that pass the…

SCANNING AN OBJECT USING MULTIPLE MECHANICAL STAGES

Granted: March 23, 2017
Application Number: 20170084425
A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage…

SELECTIVELY OPENABLE SUPPORT PLATEN FOR ADDITIVE MANUFACTURING

Granted: March 16, 2017
Application Number: 20170072466
An apparatus for forming an object includes a platform to support the object. The platform includes a first support plate including first holes and a second support plate arranged below the first support plate and including second holes. The second support plate is movable relative to the first support plate between an aligned configuration and a misaligned configuration. The apparatus further includes a dispensing system overlying the support plate to dispense a powder over the top…

FABRICATION OF BASE PLATE, FABRICATION OF ENCLOSURE, AND FABRICATION OF SUPPORT POSTS IN ADDITIVE MANUFACTURING

Granted: March 16, 2017
Application Number: 20170072467
An apparatus for forming an object includes a platform and a dispensing system overlying the platform to dispense successive layers of powder. The successive layers include support layers and object layers on the support layers. The apparatus further includes an energy source to fuse the powder. A controller is configured to cause the energy source to fuse a support region of each of the support layers to form a part support base. The controller is further configured to cause the energy…

SUBSTRATE CARRIER SYSTEM AND METHOD FOR USING THE SAME

Granted: March 16, 2017
Application Number: 20170076968
A substrate carrier system is provided. The substrate carrier system includes a substrate carrier body, an electrode assembly, a support base, and a controller. The substrate carrier body has a substrate supporting surface, and an electrode assembly is disposed in the substrate carrier body. The electrode assembly includes a plurality of laterally spaced apart electrode sets. Each electrode set includes a first electrode interleaved with a second electrode. The support base supports the…

SYSTEM TO DETECT WAFER ARCING IN SEMICONDUCTOR MANUFACTURING EQUIPMENT

Granted: March 16, 2017
Application Number: 20170077002
Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.

APPARATUS AND METHOD FOR THIN-FILM PROCESSING APPLICATIONS

Granted: March 9, 2017
Application Number: 20170067149
According to the present disclosure, a flexible substrate coating apparatus is provided. The flexible substrate coating apparatus includes a vacuum process chamber for processing a flexible substrate. The vacuum process chamber includes one or more deposition units and a cleaning unit positioned directly downstream of the one or more deposition units. In another aspect, a method for depositing a thin-film on a flexible substrate is provided. The method for depositing a thin-film on a…

PLASMA ETCHING SYSTEMS AND METHODS WITH SECONDARY PLASMA INJECTION

Granted: March 2, 2017
Application Number: 20170062184
An apparatus for plasma processing includes a first plasma source, a first planar electrode, a gas distribution device, a plasma blocking screen and a workpiece chuck. The first plasma source produces first plasma products that pass, away from the first plasma source, through first apertures in the first planar electrode. The first plasma products continue through second apertures in the gas distribution device. The plasma blocking screen includes a third plate with fourth apertures, and…