InvenSense Patent Grants

Reduction of chipping damage to MEMS structure

Granted: August 22, 2017
Patent Number: 9738511
A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with…

CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture

Granted: August 22, 2017
Patent Number: 9738512
An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two…

Transducer with enlarged back volume

Granted: August 22, 2017
Patent Number: 9738515
A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first…

Curvature-corrected bandgap reference

Granted: August 22, 2017
Patent Number: 9740229
A curvature-corrected bandgap reference comprising a first BJT device operating at a first current density that is substantially proportional to absolute temperature, the first BJT device having a first base-emitter voltage and a first base terminal and a second BJT device operating at a second current density that is substantially independent of temperature, the second BJT device having a second base-emitter voltage and a second base terminal. The first and second base terminals operate…


Granted: August 15, 2017
Patent Number: 9731961
A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of…

Method of increasing MEMS enclosure pressure using outgassing material

Granted: August 15, 2017
Patent Number: 9731963
Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes…

Microelectromechanical systems electret microphone

Granted: August 15, 2017
Patent Number: 9736594
Microelectromechanical systems (MEMS) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in MEMS electret acoustic sensors or microphones. Provided implementations include variations in electret acoustic sensor or microphone configuration and recharging of the electret.

Dual cavity pressure structures

Granted: August 8, 2017
Patent Number: 9725305
Provided herein is a method including forming a trench in a handle substrate, and a trench lining is formed in the trench. A first cavity and a second cavity are formed in the handle substrate, wherein the first cavity is connected to the trench. A first MEMS structure and the handle substrate are sealed for maintaining a first pressure within the trench and the first cavity. A second MEMS structure and the handle substrate are sealed for maintaining the first pressure within the second…

Multi-function pins for a programmable acoustic sensor

Granted: August 8, 2017
Patent Number: 9729963
A programmable acoustic sensor is disclosed. The programmable acoustic sensor includes a MEMS transducer and a programmable circuitry coupled to the MEMS transducer. The programmable circuitry includes a power pin and a ground pin. The programmable acoustic sensor also includes a communication channel enabling data exchange between the programmable circuitry and a host system. One of the power pin and the ground pin can be utilized for data exchange.

MEMS acoustic sensor comprising a non-perimeter flexible member

Granted: August 1, 2017
Patent Number: 9718671
A micro electro-mechanical system (MEMS) acoustic sensor is disclosed. The acoustic sensor comprises a backplate and a diaphragm. The acoustic sensor further comprises a flexible member and optional spacer member disposed between the backplate and the diaphragm resulting in a gap between the backplate and the diaphragm. The gap can vary in response to impinging pressure on the diaphragm based on the design of the flexible member and resulting in a variable capacitance between the…

Integrated heater for gettering or outgassing activation

Granted: August 1, 2017
Patent Number: 9718679
A Microelectromechanical Systems (MEMS) structure with integrated heater is disclosed. The MEMS structure with integrated heater comprises a first substrate with cavities, bonded to a second substrate, forming a plurality of sealed enclosures of at least two types. Each of the plurality of sealed enclosures is defined by the first substrate, the second substrate, and a seal-ring material, where the first enclosure type further includes at least one of a gettering element to decrease…

CMOS-MEMS integrated device including a contact layer and methods of manufacture

Granted: August 1, 2017
Patent Number: 9718680
A method for forming a MEMS device is disclosed. The MEMS device includes a MEMS substrate and a base substrate. The MEMS substrate, where includes a handle layer, a device layer and an insulating layer in between. The method includes the sequential steps of: providing a standoff on the device layer; etching a via through the device layer and the insulating layer; providing a contact layer within the via, wherein the contact layer provides electrical connection between the device layer…

Method and system for multiple pass smoothing

Granted: August 1, 2017
Patent Number: 9719787
The navigation solution of a device may be enhanced by perforating multiple pass smoothing. Forward and backward processing of the input data may be performed to derive interim navigation solutions. One or more quantities of the interim navigation solutions may be combined to smooth the quantities. At least one additional pass of forward and backward processing may then be performed using quantities of the navigation solution that were combined to enhance the interim navigation…

Method and system providing a self-test on one or more sensors coupled to a device

Granted: August 1, 2017
Patent Number: 9720794
A method and system for providing a self-test configuration in a device is disclosed. The method and system comprise providing a self-test mechanism in a kernel space of a memory and enabling a hook in a user space of the memory, wherein the hook is in communication with the self-test mechanism. The method and system also include running the self-test driver and utilizing the results.

Auto-detection and mode switching for digital interface

Granted: August 1, 2017
Patent Number: 9720874
A method of operating a microphone system includes the steps of monitoring an I/O terminal to detect whether a signal on that terminal achieves a pre-defined logic level during a monitoring period. The I/O terminal and a second I/O terminal are configured to one of a hardware mode or a communications-bus mode depending on whether the pre-defined logic level is detected. A microphone system includes two I/O terminals and an automatic detection and mode switching circuit, as well as a…

Systems and apparatus providing frequency shaping for microphone devices and methods of operation of the same

Granted: August 1, 2017
Patent Number: 9722561
A device is provided. The device includes: a sensor adapted to receive an acoustic wave and generate an electrical signal in response to receipt of the acoustic wave; clock frequency detection circuitry adapted to receive a clock signal, detect a frequency of the clock signal and generate information representative of the frequency; and digital filter circuitry coupled to the clock frequency detection circuitry. The digital filter circuitry is adapted to: receive the clock signal and the…

Gyroscope self test by applying rotation on coriolis sense mass

Granted: July 25, 2017
Patent Number: 9714842
A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency is applied to the actuation structures to rotate the proof mass of the gyroscope around the sensitive axis orthogonal to the drive axis. An output response of the gyroscope at the drive frequency is…

Method and apparatus for improving performance of digital microelectromechanical systems microphones

Granted: July 25, 2017
Patent Number: 9716933
A microphone device comprising a microelectromechanical systems (MEMS) acoustic sensors, an automatic gain compensation (AGC) component, and a direct current (DC) offset cancellation component is described. An microphone device can be configured for AGC of an analog gain stage or a digital gain stage associated with the MEMS acoustic sensor. Provided implementations can also be configured to compensate DC offset resulting from adjustment of the analog provided by the AGC component.…

MEMS sensor with high voltage switch

Granted: July 18, 2017
Patent Number: 9708176
A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).

High fidelity remote controller device for digital living room

Granted: July 11, 2017
Patent Number: 9703397
Described herein is an intelligent remote controlling device (e.g. a mobile phone). The device can include a six-axis motion sensor to accurately track three dimensional hand motions. For example, the sensors can include a three-axis accelerometer and a three-axis gyroscope. The remote control device can also include a processing unit integrated with the motion sensors in a single module. The processing unit can convert data regarding the hand motion to data regarding a cursor motion for…