InvenSense Patent Grants

Magnetometer using magnetic materials on accelerometer

Granted: March 28, 2017
Patent Number: 9606191
A MEMS device including a first proof mass, a first magnetized magnetic material disposed partially on a surface of the first proof mass, a first spring anchored to a substrate to support the first proof mass, and a first sensing element coupled to the first proof mass and operable to sense the motion of the first proof mass caused by an ambient acceleration. The MEMS device further includes a second sensing element coupled to the first proof mass and operable to sense the motion of the…

Microphone with programmable frequency response

Granted: March 21, 2017
Patent Number: 9602924
Methods and apparatus automatically cancel or attenuate an unwanted signal (such as low frequencies from wind buffets) from, and/or control frequency response of, a condenser microphone, or control the effective condenser microphone sensitivity before the signal reaches an ASIC or other processing circuit. As a result, the maximum amplitude signal seen by the processing circuit is limited, thereby preventing overloading the input of the processing circuit. Remaining (wanted) frequencies…

MEMS sensor including an over-travel stop and method of manufacture

Granted: March 14, 2017
Patent Number: 9593008
A MEMS sensor is disclosed. The MEMS sensor includes a MEMS structure and a substrate coupled to the MEMS structure. The substrate includes a layer of metal and a layer of dielectric material. The MEMS structure moves in response to an excitation. A first over-travel stop is formed on the substrate at a first distance from the MEMS structure. A second over-travel stop on the substrate at a second distance from the MEMS structure. At least one electrode on the substrate at a third…

Wearable device assisting smart media application and vice versa

Granted: March 14, 2017
Patent Number: 9595181
A system includes a wearable device connected to a user and a smart media in remote communication with the wearable device. The wearable device is operable to track movement of the user and transmit the track movement information to the smart media. The smart media is operable to receive the track movement information and to use the received track movement information in an independent application.

MEMS microphone with spring suspended backplate

Granted: March 14, 2017
Patent Number: 9596547
A MEMS microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate.

Systems and methods for pressure sensor calibration

Granted: March 7, 2017
Patent Number: 9588006
Systems and methods are disclosed for calibrating a pressure sensor associated with a mobile device. Location information may be determined for the mobile device and used to obtain reference pressure information. The reference pressure information may then be used to calibrate the pressure sensor. Additionally, when the pressure sensor of the mobile device has been calibrated, output from the pressure sensor may be used as reference pressure information by another device.

Pressure sensor with deformable membrane and method of manufacture

Granted: February 28, 2017
Patent Number: 9581512
A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane…

Pre-molded MEMS device package having conductive column coupled to leadframe and cover

Granted: February 21, 2017
Patent Number: 9573800
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit…

Cavity pressure modification using local heating with a laser

Granted: January 31, 2017
Patent Number: 9556019
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate…

Low power bandgap circuit device with zero temperature coefficient current generation

Granted: January 17, 2017
Patent Number: 9547325
A low power bandgap circuit device that generates temperature independent reference voltages and/or zero temperature coefficient currents is disclosed. The circuit comprises a first pair of transistors, an amplifier, a star connected resistive network, and a second pair of transistors, wherein zero temperature coefficient currents are generated through mirroring and reuse of current from the star connected resistive network.

Distributed automatic level control for a microphone array

Granted: January 17, 2017
Patent Number: 9549251
A distributed automatic level control function is provided, in which information relating to a common automatic level control parameter is transmitted to each of a plurality of microphone devices, wherein the information transmitted to at least one microphone device is derived from an audio sample of at least one different microphone device. Each microphone device produces the common automatic level control parameter based on the information received by the microphone device and applies…

MEMS-CMOS device that minimizes outgassing and methods of manufacture

Granted: January 10, 2017
Patent Number: 9540228
A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation layer includes a plurality of layers. A top layer of the plurality of layers comprises an outgassing barrier layer. At least one second conductive pad and at least one…

Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

Granted: January 10, 2017
Patent Number: 9540230
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure…

Microphone with built-in speaker driver

Granted: January 10, 2017
Patent Number: 9544673
A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone…

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Granted: January 3, 2017
Patent Number: 9533880
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS…

Aluminum nitride (AlN) devices with infrared absorption structural layer

Granted: December 6, 2016
Patent Number: 9511994
A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal…

Magnetic sensors with permanent magnets magnetized in different directions

Granted: December 6, 2016
Patent Number: 9513346
A method and system for a device with a magnetic sensor includes a first permanent magnet and a second permanent magnet. The first permanent magnet and the second permanent magnet of the magnetic sensor have at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer. The first permanent magnet is magnetized in a first direction and the second permanent magnet is magnetized in a second direction which is substantially orthogonal to the first direction. The…

Device with magnetic sensors with permanent magnets

Granted: December 6, 2016
Patent Number: 9513347
A device with a magnetic sensor includes a substrate with a device layer. A magnetic sensor is formed on the device layer and includes a first permanent magnet. The first permanent magnet has at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer, with a barrier layer disposed between the FM layer and the AFM layer. The first permanent magnet is magnetized in a first direction at a temperature higher than a blocking temperature of the AFM layer. A plurality…

CMOS-MEMS integrated device with selective bond pad protection

Granted: November 29, 2016
Patent Number: 9505609
A method and system for preparing a semiconductor wafer are disclosed. In a first aspect, the method comprises providing a passivation layer over a patterned top metal on the semiconductor wafer, etching the passivation layer to open a bond pad in the semiconductor wafer using a first mask, depositing a protection layer on the semiconductor wafer, patterning the protective layer using a second mask, and etching the passivation layer to open other electrodes in the semiconductor wafer…

Low frequency response microphone diaphragm structures and methods for producing the same

Granted: November 29, 2016
Patent Number: 9505614
A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.