InvenSense Patent Grants

Low power bandgap circuit device with zero temperature coefficient current generation

Granted: January 17, 2017
Patent Number: 9547325
A low power bandgap circuit device that generates temperature independent reference voltages and/or zero temperature coefficient currents is disclosed. The circuit comprises a first pair of transistors, an amplifier, a star connected resistive network, and a second pair of transistors, wherein zero temperature coefficient currents are generated through mirroring and reuse of current from the star connected resistive network.

Distributed automatic level control for a microphone array

Granted: January 17, 2017
Patent Number: 9549251
A distributed automatic level control function is provided, in which information relating to a common automatic level control parameter is transmitted to each of a plurality of microphone devices, wherein the information transmitted to at least one microphone device is derived from an audio sample of at least one different microphone device. Each microphone device produces the common automatic level control parameter based on the information received by the microphone device and applies…

MEMS-CMOS device that minimizes outgassing and methods of manufacture

Granted: January 10, 2017
Patent Number: 9540228
A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation layer includes a plurality of layers. A top layer of the plurality of layers comprises an outgassing barrier layer. At least one second conductive pad and at least one…

Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

Granted: January 10, 2017
Patent Number: 9540230
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure…

Microphone with built-in speaker driver

Granted: January 10, 2017
Patent Number: 9544673
A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone…

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Granted: January 3, 2017
Patent Number: 9533880
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS…

Aluminum nitride (AlN) devices with infrared absorption structural layer

Granted: December 6, 2016
Patent Number: 9511994
A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal…

Magnetic sensors with permanent magnets magnetized in different directions

Granted: December 6, 2016
Patent Number: 9513346
A method and system for a device with a magnetic sensor includes a first permanent magnet and a second permanent magnet. The first permanent magnet and the second permanent magnet of the magnetic sensor have at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer. The first permanent magnet is magnetized in a first direction and the second permanent magnet is magnetized in a second direction which is substantially orthogonal to the first direction. The…

Device with magnetic sensors with permanent magnets

Granted: December 6, 2016
Patent Number: 9513347
A device with a magnetic sensor includes a substrate with a device layer. A magnetic sensor is formed on the device layer and includes a first permanent magnet. The first permanent magnet has at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer, with a barrier layer disposed between the FM layer and the AFM layer. The first permanent magnet is magnetized in a first direction at a temperature higher than a blocking temperature of the AFM layer. A plurality…

CMOS-MEMS integrated device with selective bond pad protection

Granted: November 29, 2016
Patent Number: 9505609
A method and system for preparing a semiconductor wafer are disclosed. In a first aspect, the method comprises providing a passivation layer over a patterned top metal on the semiconductor wafer, etching the passivation layer to open a bond pad in the semiconductor wafer using a first mask, depositing a protection layer on the semiconductor wafer, patterning the protective layer using a second mask, and etching the passivation layer to open other electrodes in the semiconductor wafer…

Low frequency response microphone diaphragm structures and methods for producing the same

Granted: November 29, 2016
Patent Number: 9505614
A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.

Duty-cycled gyroscope

Granted: November 29, 2016
Patent Number: 9506757
A gyroscope system comprises a MEMS gyroscope coupled to a drive system and a sense system. The drive system maintains the MEMS gyroscope in a state of oscillation and the sense system for receiving, amplifying, and demodulating an output signal of the MEMS gyroscope that is indicative of the rate of rotation. The gyroscope system further includes a phase-locked look (PLL) which receives a reference clock (REFCLK) from the drive system and produces a system clock (CLK). Finally, the…

Assembly and packaging of MEMS device

Granted: November 29, 2016
Patent Number: 9508663
A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

Microelectromechanical systems (MEMS) microphone having two back cavities separated by a tuning port

Granted: November 29, 2016
Patent Number: 9510106
Microelectromechanical systems (MEMS) microphones associated with a tunable back cavity are described. Provided implementations can comprise a MEMS acoustic sensor element associated with a first back cavity, which first back cavity can be separated and/or acoustically coupled by a tuning port to a second back cavity. In addition, various physical and acoustic filtering configurations of MEMS microphones and tunable back cavities are described.

Sound bases navigation using a portable communications device

Granted: November 22, 2016
Patent Number: 9503828
Sound based navigation using a portable communications device is presented herein. A portable communications device can include a speaker for generating a sound, and microphone(s) for receiving a reflection of the sound—the reflection including an acoustic wave that has been reflected from an object. Further, the portable communications device can include a timing component configured to determine a time of propagation of the acoustic wave from the speaker to the microphone(s), and a…

Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices

Granted: November 8, 2016
Patent Number: 9487396
Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer that can be damaged on contact with the release chemical. In one aspect, to protect the CMOS wafer and prevent exposure of the…

Method and apparatus for improved navigation of a moving platform

Granted: November 8, 2016
Patent Number: 9488480
A navigation module and method for providing an INS/GNSS navigation solution for a moving platform, comprising a receiver for receiving absolute navigational information from an external source (e.g., such as a satellite), means for obtaining speed or velocity information and an assembly of self-contained sensors capable of obtaining readings (e.g., such as relative or non-reference based navigational information) about the moving platform, and further comprising at least one processor,…

Round-robin sensing device and method of use

Granted: October 4, 2016
Patent Number: 9459274
A round-robin sensing device is disclosed. The round-robin sensing device comprises a MEMS device, wherein the MEMS device includes first and second sense electrodes. The round-robin sensing device also comprises a multiplexer coupled to the first and second sense electrodes, at least one sense amplifier coupled to the multiplexer, a demodulator coupled to the at least one sense amplifier, and an integrate and dump circuit coupled to the demodulator. Finally, the round-robin sensing…

Microelectromechanical system device with internal direct electric coupling

Granted: September 27, 2016
Patent Number: 9452920
A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises providing a MEMS substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer The MEMS substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at…

Method of increasing MEMS enclosure pressure using outgassing material

Granted: September 27, 2016
Patent Number: 9452925
Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes…