POWER TRANSISTOR WITH INCREASED AVALANCHE CURRENT AND ENERGY RATING
Granted: July 5, 2012
Application Number:
20120168861
A field-effect transistor involves a drain electrode, a drift region, a body region, a source region, a gate insulator layer, and a gate electrode. The drift region is disposed above the drain electrode. The body region extends down into the drift region from a first upper semiconductor surface. The source region is ladder-shaped and extends down in the body region from a second upper semiconductor surface. The first and second upper semiconductor surfaces are substantially planar and…
System and Method for Processing and Forwarding Transmitted Information
Granted: May 17, 2012
Application Number:
20120119656
A system involves a plurality of RF-enabled occupancy detectors. Each occupancy detector communicates with and controls an associated plurality of RF-enabled fluorescent lamp starter units. A network master has an RF transceiver used to communicate with the occupancy detectors using a first protocol, thereby retrieving status information from the starter units. The network master also has a second RF transceiver for communicating directly with a cellular telephone using a second…
Vertical Power MOSFET and IGBT Fabrication Process with Two Fewer Photomasks
Granted: December 22, 2011
Application Number:
20110312137
A process for fabrication of a power semiconductor device is disclosed in which a single photomask is used to define each of p-conductivity well regions and n-conductivity type source regions. In the process a single photomask is deposited on a layer of polysilicon on a wafer, the polysilicon layer is removed from first regions of the power semiconductor device where the p-conductivity well regions and the n-conductivity type source regions are to be formed, and both p-conductivity type…
Method for the Manufacture of Double-Sided Metallized Ceramic Substrates
Granted: December 15, 2011
Application Number:
20110303348
The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic…
MOTHER AND DAUGHTER BOARD CONFIGURATION TO IMPROVE CURRENT AND VOLTAGE CAPABILITIES OF A POWER INSTRUMENT
Granted: September 29, 2011
Application Number:
20110235271
An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually…
METHODS AND APPARATUSES FOR CONVERTING CARBON DIOXIDE AND TREATING WASTE MATERIAL
Granted: December 9, 2010
Application Number:
20100307912
Methods and apparatuses for converting carbon dioxide and treating waste material using a high energy electron beam are disclosed. For example, carbon dioxide and an aqueous reaction solution having a reactant can be combined to form an aqueous reaction mixture, and the aqueous reaction mixture can then be subjected to a high energy electron beam that initiates a reaction between carbon dioxide and the reactant to form a reaction product. Solid or liquid waste material can be treated by,…
1-WIRE COMMUNICATION PROTOCOL AND INTERFACE CIRCUIT
Granted: November 4, 2010
Application Number:
20100277104
A 1-wire communication protocol and interface circuitry for communication between a host controller and a LED driver is provided. The 1-wire communication protocol is configured such that both PWM signals and DC current setting commands for programming the LED driver may be transmitted from the host controller to the LED driver via the same 1-wire interface. The 1-wire communication protocol uses the length of the pulses (pulse width), rather than the number of pulses, to distinguish…
LEAD AND LEAD FRAME FOR POWER PACKAGE
Granted: September 9, 2010
Application Number:
20100224982
A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both the main portion and the end portion. A bonding pad may also be included. The end portion may include a raised portion, bonded portion, and connecting portion. At least part of the bonded portion…
SOLAR CELL DEVICE HAVING A CHARGE PUMP
Granted: May 6, 2010
Application Number:
20100109759
A solar cell device includes a solar cell section configured to output a first voltage upon receiving light. A charge pump circuit includes a first charge pump. The first charge pump includes a first terminal and a second terminal. The first terminal is configured to receive the first voltage from the solar cell section, and the second terminal is configured to output a second voltage that is higher than the first voltage. An output section is configured to receive an output voltage…
INSULATED GATE BIPOLAR TRANSISTOR
Granted: April 1, 2010
Application Number:
20100078674
A trench structure of an insulated gate bipolar transistor (IGBT) is formed as a trench net in a P region and extends into an N? layer. The trench net separates the P region into P wells and floating P layers. The P wells contact an emitter electrode while the floating P layers are not in direct contact with the emitter electrode. A gate formed of conductive material and having a surrounding insulation oxide layer is formed in the trench net. An N+ layer may be formed above each floating…
SYSTEM AND METHOD FOR CONSERVING POWER APPLIED TO AN ELECTRICAL APPARATUS
Granted: February 18, 2010
Application Number:
20100042857
A usage pattern identifies time periods when an electrical apparatus is likely to be powered-up or not in use. Power provided to an electrical apparatus is increased during time periods that the electrical apparatus is likely to be powered-up. Similarly, the power provided to the electrical apparatus is reduced or removed during time periods that the electrical apparatus is likely to be out of use or idle. The usage pattern is continually updated and refined by collecting usage data…
SOLAR CELL FOR IMPLANTABLE MEDICAL DEVICE
Granted: December 31, 2009
Application Number:
20090326597
An implantable medical device includes a solar cell configured to provide energy to recharge a power source such as a battery. The power source is coupled to a control circuit of the medical device and provides power to the circuit. The solar cell may be coupled to the power source via a wire and may be distanced from a housing of the medical device. The solar cell may also be attached to the housing or may be disposed in the housing. The medical device may be implanted in the body of a…
ARRANGEMENT OF AT LEAST ONE POWER SEMICONDUCTOR MODULE AND A PRINTED CIRCUIT BOARD
Granted: November 27, 2008
Application Number:
20080293261
An arrangement between a power semiconductor module and a printed circuit board is disclosed, A printed circuit board includes strip conductors, and a power semiconductor module includes a module housing and power terminals. The power terminals extend to the exterior of the module housing and into contact with the strip conductors. A heat sink is disposed on a side of the power semiconductor module opposite the circuit board. A deformable means is disposed between the module housing and…
VIDEO AND CONTENT CONTROLLED BACKLIGHT
Granted: February 14, 2008
Application Number:
20080036398
A display device includes a display panel; and a backlight panel provided below the display panel and defining a plurality of regions. A first array of light emitting diodes (LEDs) is provided along a first direction, each LED of the first array being coupled to a first line. A driver is coupled to the first line to drive the LEDs coupled to the first line. A second array of LEDs is provided along a second direction, each LEDs of the second array being coupled to a second line. A…
INDUCTION HEATING CIRCUIT AND WINDING METHOD FOR HEATING COILS
Granted: October 25, 2007
Application Number:
20070246458
A heating circuit for heating a conductive bowl includes a voltage source; a first heating coil provided between first and second nodes and being configured to heat the conductive bowl; a second heating coil provided between the second node and a third node and being configured to heat the conductive bowl; first capacitor and first switch provided in parallel between the first node and a fourth node; and second capacitor and second switch provided in parallel between the third node and…
INDUCTION HEATING CIRCUIT
Granted: October 18, 2007
Application Number:
20070241101
A heating circuit includes a first heating coil provided adjacent to an object to be heated. A first capacitor is provided in parallel to the first heating coil, the first capacitor being a resonant component. An inductor is coupled to the first heating coil and the first capacitor.
SIGNAL DIFFERENTIATION WITH DIFFERENTIAL CONVERSION CIRCUIT
Granted: August 23, 2007
Application Number:
20070194831
A circuit for transmitting signals includes a transformer having an input side and an output side, the input side having a first end and a second end. A first transistor is coupled to the first end of the transformer, the first transistor being configured to provide a first signal to the first end in response to an input signal transitioning to a first state. A second transistor is coupled to the second end of the transformer; the second transistor being configured to provide a second…
OVER CHARGE PROTECTION DEVICE
Granted: June 7, 2007
Application Number:
20070126024
An over-voltage protection device includes a substrate including an upper surface and a lower surface; a first electrode provided on the upper surface of the substrate; a second electrode provided on the lower surface on the substrate; a first conductive layer overlying the lower surface of the substrate, the first conductive region being a conductive region of a first type; a plurality of first conductive regions provided proximate the upper surface of the substrate, the plurality of…
Current sensor using level shift circuit
Granted: February 1, 2007
Application Number:
20070024324
A circuit for sensing a current includes a first upper resistor having a first end coupled to a first end of a sense resistor, the sense resistor being configured to receive an input current. A second upper resistor has a first end coupled to a second end of the sense resistor, so that the sense resistor defines a first potential between the first and second ends of the sense resistor. A first lower resistor is provided between the first upper resistor and the ground. A second lower…
Encapsulated power semiconductor assembly
Granted: November 30, 2006
Application Number:
20060267185
The invention relates to an encapsulated power semiconductor assembly comprising a substrate consisting of an insulation material (ceramic), provided with a plurality of islands, which are composed of a thermal conductive material, in particular of partial surfaces of a metal layer. Power semiconductor chips are soldered onto said islands. Electric connections that run from the chips to the connecting elements are produced in the form of bonding pads on additional islands or in the form…
