Mattson Technology Profile

Mattson Technology Patent Grants

Inductively coupled plasma source for plasma processing

Patent Number 9653264 - May 16, 2017

Plasma processing apparatus and methods are disclosed. Embodiments of the present disclosure include a processing chamber having an interior…

Selective reflectivity process chamber with customized wavelength response and method

Patent Number 9633876 - April 25, 2017

A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer…

Methods and systems for supporting a workpiece and for heat-treating the workpiece

Patent Number 9627244 - April 18, 2017

Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece…

Low cost high throughput processing platform

Patent Number 9493306 - November 15, 2016

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

Repeatable heat-treating methods and apparatus

Patent Number 9482468 - November 1, 2016

A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to…

Mattson Technology Patent Applications

System and Method for Protection of Vacuum Seals in Plasma Processing Systems

Application Number 20160013025 - January 14, 2016

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber…

APPARATUS AND METHODS FOR GENERATING ELECTROMAGNETIC RADIATION

Application Number 20150035436 - February 5, 2015

An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of…

Heating Configuration for Use in Thermal Processing Chambers

Application Number 20140246422 - September 4, 2014

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear…

LOW COST HIGH THROUGHPUT PROCESSING PLATFORM

Application Number 20140151195 - June 5, 2014

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

METHODS, APPARATUS AND MEDIA FOR DETERMINING A SHAPE OF AN IRRADIANCE PULSE TO WHICH A WORKPIECE IS TO BE EXPOSED

Application Number 20130306871 - November 21, 2013

A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are…