TRANSISTORS HAVING INCREASED EFFECTIVE CHANNEL WIDTH
Granted: September 30, 2021
Application Number:
20210305299
Image sensors include a photodiode disposed in a semiconductor substrate and a transistor operatively coupled to the photodiode. The transistor includes a nonplanar structure disposed in the semiconductor substrate, which is bounded by two outer trench structures formed in the semiconductor substrate. Isolation deposits are disposed within the two outer trench structures formed in the semiconductor substrate. A gate includes a planar gate and two fingers extending into one of two inner…
TRANSISTORS HAVING INCREASED EFFECTIVE CHANNEL WIDTH
Granted: September 30, 2021
Application Number:
20210305298
Image sensors include a photodiode disposed in a semiconductor substrate and a transistor operatively coupled to the photodiode. At least three substrate trench structures are formed in the semiconductor substrate, defining two nonplanar structures, each having a plurality of sidewall portions. An isolation layer includes at least three isolation layer trench structures, each being disposed in a respective one of the three substrate trench structures. A gate includes three fingers, each…
MEDICAL MICRO-CABLE STRUCTURE AND CONNECTION METHOD WITH MINI CAMERA CUBE CHIP
Granted: August 26, 2021
Application Number:
20210259528
A novel endoscope includes a camera module, an electrical cable, and an electrical connector. The camera module includes an analog image signal output terminal. The cable includes an analog image signal line having a first end connected to the analog image signal output terminal of the camera module. The electrical connector includes a set of electrical contacts configured to engage a complimentary set of electrical contacts of a host system. The set of electrical contacts includes at…
Image Sensor With Voltage Buffer For Self-Test
Granted: August 19, 2021
Application Number:
20210258563
A test voltage sample and hold circuitry is disclosed in a readout circuitry of an image sensor. This circuitry samples a voltage at demand value based on a ramp voltage shared by the ADC comparators of the readout circuitry. The value of the sampled voltage is controlled by a control circuitry which is able to predict and calculate at what time a ramp generator may carry the demand voltage value. The sampled voltage is held by a hold capacitor during readout of one row and is accessed…
DAM OF IMAGE SENSOR MODULE HAVING SAWTOOTH PATTERN AND INCLINED SURFACE ON ITS INNER WALL AND METHOD OF MAKING SAME
Granted: July 22, 2021
Application Number:
20210225914
An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing…
Determining Depth Information From A Single Camera
Granted: June 10, 2021
Application Number:
20210176447
An optical system comprises an imaging lens for imaging an object to an image and a sensing pixel array for detecting lights from the object toward the image. The sensing pixel array comprises a first sensing pixel and a second sensing pixel, each sensing pixel comprising a microlens covering a one-dimensional series of photodiodes having n photodiodes. A photodiode at an end of the one-dimensional series of photodiodes of the first sensing pixel detects a first light from the object…
Subrange ADC for Image Sensor
Granted: April 8, 2021
Application Number:
20210105422
A subrange analog-to-digital converter (ADC) converts analog image signal received from a bitline to a digital signal through an ADC comparator. The comparator is shared by a successive approximation register (SAR) ADC coupled to provide M upper output bits (UOB) of the subrange ADC and a ramp ADC coupled to provide N lower output bits (LOB). The digital-to-analog converter (DAC) of the SAR ADC comprises M buffered bit capacitors connected to the comparator. Each buffered bit capacitor…
VERSATILE IMAGE SENSOR CIRCUIT
Granted: March 4, 2021
Application Number:
20210067714
A photodiode array circuit includes a plurality of photodiode circuits, binning circuitry, and a plurality of output circuits. Each of the plurality of photodiode circuits is coupled to receive a different one of the plurality of transfer control signals as a proximate photodiode circuit, proximate in a first direction. The binning circuitry is coupled to electrically connect the plurality of photodiode circuits into groups of photodiode circuit sense nodes in response to a binning…
3D IMAGING USING PHASE DETECTION AUTOFOCUS (PDAF) IMAGE SENSOR
Granted: February 25, 2021
Application Number:
20210055502
A 3D imaging system comprises a phase detection autofocus (PDAF) image sensor, a lens for imaging a cross-section of a 3D object on the PDAF image sensor and an actuator for driving the lens for focusing each cross-section of the 3D object on the PDAF image sensor. The actuator drives the lens until the PDAF image sensor identifies an image of a first cross-section of the 3D object in-focus and records the image of the first cross-section. The PDAF image sensor records images of…
FULLY BURIED COLOR FILTER ARRAY OF IMAGE SENSOR
Granted: February 18, 2021
Application Number:
20210051250
An image sensor includes a substrate. An array of photodiodes is disposed in the substrate. A plurality of spacers is arranged in a spacer pattern. At least one spacer of the plurality of spacers has an aspect ratio of 18:1 or greater. A buffer layer is disposed between the substrate and the spacer pattern. An array of color filters is disposed in the spacer pattern.
Digital CDS Readout with 1.5 ADC Conversions Per Pixel
Granted: January 28, 2021
Application Number:
20210029320
A CMOS image sensor comprises an array of pixels. A column of the pixel array is coupled to a readout column. The readout column is couple to a readout circuitry (RC) that reads out image data from the pixel array. The RC comprises a sampling switch which is coupled to a 1-column successive approximation register (SAR) analog-to-digital converter (ADC). The 1-column SAR ADC comprises a differential comparator, a local SAR control, and a digital-to-analog converter (DAC). The sampling…
Enhanced Shutter Efficiency Time-of-Flight Pixel
Granted: January 28, 2021
Application Number:
20210029311
A time-of-flight pixel array comprises multiple pixel cells. The pixel cell comprises a light collection region, a light shielded region, and a deep trench isolation (DTI) structure that encircles the light collection region to prevent light from entering the light shielded region. Photogate in the light collection region is disposed above a photodiode to accumulate the photo-generated electrical charges. A doped region disposed near the photogate collects the attracted charges. The…
DIFFRACTIVE OPTICAL ELEMENTS MADE OF CONDUCTIVE MATERIALS
Granted: December 10, 2020
Application Number:
20200387002
A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of…
IMAGE SENSOR MODULE HAVING PROTECTIVE STRUCTURE THAT BLOCKS INCIDENT LIGHT TO ARRIVE AT BONDING WIRES AND PADS
Granted: November 12, 2020
Application Number:
20200357842
An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the…
ANTI-REFLECTIVE COATING WITH HIGH REFRACTIVE INDEX MATERIAL AT AIR INTERFACE
Granted: October 22, 2020
Application Number:
20200335534
An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may…
LCOS PIXEL FILM LAYER DESIGN FOR REFLECTION RATE IMPROVEMENT
Granted: August 6, 2020
Application Number:
20200249536
A novel liquid crystal on silicon (LCoS) device includes an array of pixel electrodes having a highly reflective material formed thereon. In a particular embodiment, the pixel electrodes are aluminum and have silver pixel mirrors electroplated thereon. In a more particular embodiment, the LCoS device includes auxiliary circuitry facilitating the electroplating of the pixel mirrors.
CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP
Granted: July 30, 2020
Application Number:
20200243472
A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern of a first group and at least one code pattern of a second group formed on the first side of the semiconductor substrate in a space free from the plurality of conductive…
LASER MARKED CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP
Granted: July 30, 2020
Application Number:
20200243384
A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder…
LED FLICKER REDUCTION FOR HIGH DYNAMIC RNAGE IMAGING
Granted: June 4, 2020
Application Number:
20200177788
A system for capturing a high dynamic range (HDR) image comprises an image sensor comprising a split pixel including a first pixel having higher effective gain and a second pixel having lower effective gain. The second pixels exposed with a capture window capture at least a pulse emitted by a light emitting diode (LED) controlled by a pulse width modulation. A first HDR image is produced by a combination including an image produced by the second pixels, and images produced by multiple…
LCOS DISPLAY WITH LIGHT ABSORBING LAYER
Granted: April 23, 2020
Application Number:
20200124902
An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example…
