Optoelectronic Package
Granted: May 17, 2007
Application Number:
20070110372
An optoelectronic package having passive optical components that are configured to reduce the amount of optical back reflection that reaches an optoelectronic device housed within the optoelectronic package. In one example, the optoelectronic package includes an optoelectronic device, a wave plate, and a linear polarizer. The optoelectronic device is configured to emit an optical signal along an optical path. The wave plate is positioned in the optical path of the optoelectronic device.…
Z-AXIS ALIGNMENT OF AN OPTOELECTRONIC COMPONENT USING A SPACER TOOL
Granted: May 10, 2007
Application Number:
20070104423
A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during…
ELECTRONICALLY RESETTABLE CURRENT PROTECTION FOR DIE TESTING
Granted: May 3, 2007
Application Number:
20070096753
Electronically resettable test apparatus. The test apparatus includes an electronically operable current breaker connected to a test jig for testing semiconductor die. The electronically operable current breaker is connected through an interface that converts signals to signals appropriate for use on a computer bus to a computer system. The test apparatus can detect faults in the semiconductor die and open the electronically operable current breaker in response to detecting the fault.…
POLARIZATION CONTROL IN VERTICAL CAVITY SURFACE EMITTING LASERS USING OFF-AXIS EPITAXY
Granted: May 3, 2007
Application Number:
20070098032
A polarization pinned long wavelength vertical cavity surface emitting laser (VCSEL). The VCSEL includes a III V semiconductor substrate. A bottom DBR mirror is formed on the semiconductor substrate. An active region is formed in an off-axis orientation on the bottom DBR mirror. The active region includes a surfactant that suppresses unwanted three dimensional growth. A top DBR mirror formed on the active region.
TEMPERATURE CONTROL IN AN INTEGRATED CIRCUIT
Granted: April 12, 2007
Application Number:
20070080702
One example of a test board includes first and second communication ports configured for communication with a master device and a DUT, respectively. A bit error rate tester of the test board is arranged for communication with the master device and with the DUT by way of the first and second communication ports, respectively, and the bit error rate tester includes at least one IC whose maximum data rate is temperature sensitive. Finally, the test board includes a temperature control…
NETWORK TAP/AGGREGATOR CONFIGURED FOR POWER OVER ETHERNET OPERATION
Granted: April 12, 2007
Application Number:
20070081549
A network tap device array capable of being powered by a power-over Ethernet (“POE”) supply is disclosed. The array enables data from multiple nodes in a communications network to be tapped and forwarded to a plurality of monitoring devices. In one embodiment the network tap device array includes a chassis that is configured to receive a plurality of network tap devices that are each powered by a POE supply. Each network tap device includes network ports for receiving and…
NETWORK TAP DEVICE POWERED BY POWER OVER ETHERNET
Granted: April 12, 2007
Application Number:
20070081553
A network tap device that is configured for operation in a copper Gigabit Ethernet communications network using a power-over-Ethernet (“POE”) electrical supply is disclosed. In one embodiment, a network tap device powered by a POE supply is disclosed, comprising first and second network ports that are configured with receptacles for receiving communication cables. The communication cables are configured to carry both data signals and the POE supply to and from the network tap device.…
OPTICAL SWITCH HAVING A REFLECTIVE COMPONENT
Granted: April 12, 2007
Application Number:
20070081763
A reflective optical switch for use in optical systems, such as fiber optic communications networks, is disclosed. The optical switch includes not only signal transmission characteristics, but also signal reflection capability. The optical switch includes a semiconductor substrate having first and second optical signal waveguides disposed thereon. The two waveguides intersect one another at a selected angle to form an intersection region. A thermal element is disposed atop the…
ALIGNMENT OF OPTOELECTRONIC COMPONENTS USING A COMPOSITE ADHESIVE
Granted: March 15, 2007
Application Number:
20070058903
Optical components are aligned within an optoelectronic device using a composite adhesive material. An optical subassembly of the optoelectronic device includes a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance.…
Electronic Modules Having An Integrated Connector Detachment Mechanism
Granted: March 15, 2007
Application Number:
20070059953
Embodiments of the invention are concerned with optical and electrical transceiver modules and, more specifically, to transceiver modules having an integrated cable detachment mechanism. In one example embodiment, a transceiver module includes a housing, a connector receptacle disposed within the housing, and a transfer mechanism connected to the housing. In this example embodiment, the connector receptacle is configured to receive a cable connector having a hood which partially encloses…
VERTICAL CAVITY SURFACE EMITTING LASER INCLUDING TRENCH AND PROTON IMPLANT ISOLATION
Granted: March 8, 2007
Application Number:
20070053399
A VCSEL with nearly planar intracavity contact. A bottom DBR mirror is formed on a substrate. A first conduction layer region is formed on the bottom DBR mirror. An active layer, including quantum wells, is on the first conduction layer region. A trench is formed into the active layer region. The trench is formed in a wagon wheel configuration with spokes providing mechanical support for the active layer region. The trench is etched approximately to the first conduction layer region.…
SHAPED LEAD ASSEMBLY FOR OPTOELECTRONIC DEVICES
Granted: March 1, 2007
Application Number:
20070047882
An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable…
METHODS FOR MANUFACTURING OPTICAL MODULES HAVING AN OPTICAL SUB-ASSEMBLY
Granted: February 15, 2007
Application Number:
20070036490
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with…
Z-AXIS ALIGNMENT OF AN OPTOELECTRONIC COMPONENT USING A SPACER TOOL
Granted: February 15, 2007
Application Number:
20070036504
A spacer tool system is used with an optoelectronic package to properly align an optical component within the device. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The…
NETWORK DIAGNOSTIC SYSTEMS AND METHODS FOR ACCESSING STORAGE DEVICES
Granted: February 15, 2007
Application Number:
20070038881
A network diagnostic system may include one or more network diagnostic components. A network diagnostic component may include one or more storage devices and may be configured to perform one or more network diagnostic functions. The network diagnostic component and/or at least one other network diagnostic component may access the storage devices to help perform one or more network diagnostic functions and/or to help perform other processes.
WAFER LEVEL AC AND/OR DC TESTING
Granted: January 18, 2007
Application Number:
20070013400
AC and/or DC testing of an optoelectronic device at the wafer level. In one example embodiment, a method of testing one or more devices at a wafer level includes generating a test signal; supplying the test signal to a single device on a wafer; providing an output of the single device to each of a plurality of devices on the wafer by way of a common electrical connection between the single device and the plurality of devices; providing an output of each of the plurality of devices to a…
QUANTUM DOT VERTICAL LASING SEMICONDUCTOR OPTICAL AMPLIFIER
Granted: January 18, 2007
Application Number:
20070013996
This disclosure concerns a vertical lasing semiconductor optical amplifier (VLSOA) having a quantum dot active region. In one example, a VLSOA includes a quantum dot active region comprising a semiconductor gain medium. The semiconductor gain medium defines at least a portion of an amplifying path. The VLSOA also includes a laser cavity within which a portion of the semiconductor gain medium is disposed. The laser cavity has a gain characteristic, with respect to an optical signal…
IMPEDANCE-MATCHING ELECTRICAL CONNECTION APPARATUS FOR HIGH-SPEED DATA COMMUNICATIONS SYSTEM
Granted: January 18, 2007
Application Number:
20070015380
This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an electrical connection system is provided that includes a circuit board upon which are disposed a one or more signal contact pads, each of which is configured to communicate with a complementary element of an external electrical device such that a respective shunt capacitance is defined. One or more of the signal contact pads…
MEDIA CONVERTER
Granted: January 11, 2007
Application Number:
20070010132
Media converters for use in optical-to-electrical and electrical-to-optical conversion. A media converter includes an outer housing, an electrical plug disposed on one end of the outer housing, an optical cable disposed on an opposite end of the outer housing, and circuitry that connects to both the electrical plug and the optical cable. In this example, the circuitry receives electrical signals from the electrical plug and outputs corresponding optical signals to the optical cable. In…
TRANSCEIVER MODULE HAVING A DUAL SEGMENT LEAD FRAME CONNECTOR
Granted: January 4, 2007
Application Number:
20070003195
An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical…
