3-D INTEGRATED PACKAGE
Granted: September 12, 2013
Application Number:
20130235542
In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the…
HEAT-SWAP DEVICE AND METHOD
Granted: August 15, 2013
Application Number:
20130208745
A TOSA can include: a light emitting element; and one or more heating elements thermally coupled to the light emitting element so as to provide a substantially constant heat generation profile and/or temperature profile across the TOSA during a light emitting element dormant period and a light emitting element firing period. The TOSA can include a controller operably coupled with the one or more heating elements so as to control the substantially constant heat generation profile and/or…
INTEGRATED POWER SUPPLY FOR FIBER OPTIC COMMUNICATION DEVICES AND SUBSYSTEMS
Granted: August 8, 2013
Application Number:
20130200930
An example embodiment includes a fiber optic integrated circuit (IC). The fiber optic IC includes an integrated power supply. The integrated power supply includes a filter, an active switch, and a pulse width modulator (“PWM”). The filter is configured to convert a signal to an output signal of the integrated power supply. The active switch is configured to control introduction of the signal to the filter. The PWM is configured to generate a PWM output signal that triggers the active…
SYSTEM AND METHOD OF ELECTROMAGNETIC RADIATION CONTROL
Granted: August 8, 2013
Application Number:
20130200250
A method of compensating for electromagnetic radiation. The method may include measuring electromagnetic radiation emanating from circuitry at a first frequency and adjusting at least one of the electrical settings of the circuitry based on the measurement of the electromagnetic radiation to reduce the electromagnetic radiation at the first frequency emanating from the circuitry.
ELECTROMAGNETIC RADIATION DISSIPATING DEVICES
Granted: August 1, 2013
Application Number:
20130194000
Electromagnetic radiation (“EMR”) dissipating devices. One example embodiment includes an electrical circuit including an EMR source configured to generate an output signal at an operating bit rate. The output signal may include an EMR component. The electrical circuit may also include an EMR dissipating device electrically coupled to the EMR source and configured to have a resonance frequency corresponding to the operating bit rate.
THERMALLY CONDUCTIVE FLEXIBLE MEMBER FOR HEAT TRANSFER
Granted: July 18, 2013
Application Number:
20130182390
An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly…
LATCHING MECHANISM FOR A MODULE
Granted: July 11, 2013
Application Number:
20130178090
One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation.
MULTI-LASER TRANSMITTER OPTICAL SUBASSEMBLY FOR OPTOELECTRONIC MODULES
Granted: July 11, 2013
Application Number:
20130177320
A multi-laser transmitter optical subassembly may include N number of lasers, where each laser is configured to generate an optical signal with a unique wavelength. The transmitter optical subassembly may further include a focusing lens and a filter assembly. The filter assembly may combine the optical signals into a combined signal that is received by the focusing lens. The filter assembly may include N?1 number of filters. Each of the filters may pass at least one of the optical…
Systems And Methods For Reducing Off-Axis Optical Aberrations In Wavelength Dispersed Devices
Granted: July 11, 2013
Application Number:
20130177272
Through its higher refractive index, a silicon grism can be used to reduce the Described herein are systems and methods for reducing optical aberrations in an optical system to decrease polarization dependent loss. Embodiments are provided particularly to define beam trajectories through an optical switching system which reduce off-axis aberrations. In one embodiment, a silicon grism is provided for reducing the curvature of the focal plane at an LCOS device in a wavelength selective…
OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN
Granted: June 27, 2013
Application Number:
20130163917
An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the…
CHIP ON FLEX OPTICAL SUBASSEMBLY
Granted: June 20, 2013
Application Number:
20130156418
One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically…
MODULAR DEVICE FOR AN OPTICAL COMMUNICATION MODULE
Granted: June 13, 2013
Application Number:
20130148984
A modular device for an optical communication module configured to be coupled to an optical transmission medium. The modular device may include a first edge and a second edge and N number of electrical circuit channels between the first and second edges. Each electrical circuit channel may include at least one element configured to provide functionality for communicating optical signals through the optical transmission medium. The modular device may also have a width between the first…
CHIP IDENTIFICATION PADS FOR IDENTIFICATION OF INTEGRATED CIRCUITS IN AN ASSEMBLY
Granted: June 13, 2013
Application Number:
20130148978
Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical…
ELECTROMAGNETIC RADIATION SHIELD FOR AN ELECTRONIC MODULE
Granted: June 6, 2013
Application Number:
20130142490
An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and…
DUAL OPTICAL ELECTRICAL CONVERSION MODULE
Granted: May 23, 2013
Application Number:
20130129340
In an embodiment, a dual optical-electrical conversion (DOEC) module is described that includes an optical host interface, an optical network interface, and an integrated circuit. The optical host interface includes an optical transmitter and an optical receiver. The optical network interface includes an optical transmitter and an optical receiver. The integrated circuit conditions electrical signals communicated between the optical host interface and optical network interface. Optical…
Optical Transmitter With Tunable Chirp
Granted: April 18, 2013
Application Number:
20130094797
An optical transmitter with chirp control includes an input polarizer having an input that receives an optical signal. The input polarizer polarizes the optical signal along an input polarization axis. A Mach-Zehnder modulator includes an optical input that is coupled to an output of the input polarizer and an electrical input that receives a modulation signal. The Mach-Zehnder modulator modulates the optical signal with the modulation signal. The input polarization axis of the input…
ELECTROMAGNETIC RADIATION SHIELDING ON A PCI EXPRESS CARD
Granted: April 18, 2013
Application Number:
20130094153
An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured…
COMMUNICATION MODULE ASSEMBLY WITH HEAT SINK AND METHODS OF MANUFACTURE
Granted: March 28, 2013
Application Number:
20130077254
A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the…
Polarization-Independent LCOS Device
Granted: March 21, 2013
Application Number:
20130070326
Described herein is an optical phase modulator (20) including a liquid crystal element (22), disposed between a pair of opposing electrodes (24) and (26). The electrodes (24, 26) are electrically driven for supplying an electric potential V across the liquid crystal element (22) to drive the liquid crystals within element (22) in a predetermined configuration. Electrode (26) includes a grid of individually drivable pixel regions (28), at least some of which include a sub-wavelength…
PULSE VOLTAGE AGE ACCELERATION OF A LASER FOR DETERMINING RELIABILITY
Granted: March 7, 2013
Application Number:
20130057313
A method of accelerating the aging of a laser to thereby determine the reliability of the laser. The method includes an act of providing a laser die for reliability testing, an act of applying a plurality of short signal pulses to the laser die so as to simulate the aging of the laser die, and an act of ascertaining the reliability of the laser die based on its response to the plurality of short signal pulses.
