OPTICAL BUS
Granted: December 22, 2011
Application Number:
20110311230
An optical bus. Optical sub-assemblies are used to connect lengths of optical fiber to form a single optical fiber that is a bus. A master transceiver may be connected to one end of the fiber and nodes can be connected to the optical sub-assemblies. Each optical sub-assembly includes a center fiber with a mirror that enables each connector to reflect optical signals out of the fiber and that enables a node to launch optical signals on the optical bus. The optical bus can also be…
OPTICAL TRANSCEIVERS WITH CLOSED-LOOP DIGITAL DIAGNOSTICS
Granted: December 15, 2011
Application Number:
20110305454
Systems and methods for performing closed-loop diagnostics in optical transceiver. The TOSA of an optical receiver includes a primary transmit module and a secondary receiver module. The transmit module transmits a data signal to a ROSA of another optical transceiver. The ROSA has a secondary transmit module that can transmit a diagnostic data signal back to the secondary receiver module of the TOSA. The TOSA can use the diagnostic data received from the ROSA to automatically adjust…
SURFACE GRATINGS ON VCSELS FOR POLARIZATION PINNING
Granted: December 15, 2011
Application Number:
20110306156
Methods for manufacturing a polarization pinned vertical cavity surface emitting laser (VCSEL). Steps include growing a lower mirror on a substrate; growing an active region on the lower mirror; growing an upper mirror on the active region; depositing a grating layer on the upper minor; and etching a grating into the grating layer.
TRANSCEIVER MODULE AND INTEGRATED CIRCUIT WITH DUAL EYE OPENERS
Granted: December 1, 2011
Application Number:
20110293285
A transceiver module having integrated eye diagram opening functionality for reducing jitter is described. The transceiver module may include a transmitter eye opener and a receiver eye opener integrated in a single circuit. The transceiver module may also include serial control and various other integrated components. Other functionalities that may be integrated on the transceiver module include loopback modes, bypass features, bit error rate testing, and power down modes.
LATCHING MECHANISM FOR AN ELECTRONIC MODULE
Granted: November 3, 2011
Application Number:
20110267742
Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a…
BANDPASS COMPONENT DECIMATION AND TRANSMISSION OF DATA IN CABLE TELEVISION DIGITAL RETURN PATH
Granted: October 20, 2011
Application Number:
20110255878
A device for and a method of decreasing the data rate of a digital return path link in a Cable Television Hybrid Fiber-Coax system (CATV system) is disclosed. At the node of the CATV system, the bandwidth of the a digital data stream representative of an analog return signal is limited to a desired frequency band. The ba11dwidth-limited data stream is then digitally re-sampled at a predetermined multiple of a center frequency of the frequency band. The re-sampled data stream is then…
COMMUNICATIONS MODULE WITH A SHELL ASSEMBLY HAVING THERMAL MECHANICAL FEATURES
Granted: September 22, 2011
Application Number:
20110228483
In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel…
VCSEL WITH INTEGRAL RESISTIVE REGION
Granted: September 22, 2011
Application Number:
20110228803
In one embodiment, a VCSEL includes a plurality of semiconductor layers, an insulative region, a resistive region, and a remainder region. The semiconductor layers include a lower mirror, an active region, and an upper mirror. The active region is disposed over the lower mirror and includes a first lasing region. The upper mirror is disposed over the active region. The insulative region and the resistive region are integrally formed in the semiconductor layers. The remainder region…
REDUCING THERMAL EXPANSION EFFECTS IN SEMICONDUCTOR PACKAGES
Granted: September 22, 2011
Application Number:
20110229702
Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that…
CONSTRAINING BALL LENS IN AN OPTICAL SUBASSEMBLY
Granted: August 18, 2011
Application Number:
20110200287
In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the…
REINFORCED MULTI-BODY OPTICAL DEVICES
Granted: August 11, 2011
Application Number:
20110194810
Reinforced multi-body optical devices. In one example embodiment, a method for fabricating a reinforced multi-body optical device includes various acts. First, a supporting plate is bonded, using pressure and heat, to a multi-body optical device to form a reinforced multi-body optical device. The supporting plate has a coefficient of thermal expansion (CTE) that is within about 0.5 parts per million of the CTE of the multi-body optical device. Then, the multi-body optical device is…
DQPSK DEMODULATOR
Granted: August 4, 2011
Application Number:
20110188867
A phase shift keyed demodulator includes first and second beam splitters, a first optical path, a second optical path, and a wavelength tuner. The first beam splitter splits an input signal into first and second output signals. The second beam splitter splits each first and second output signal into a transmitted signal and a reflected signal. The first optical path includes an optical path of each transmitted signal from a beam splitting surface to a reflector and back to the beam…
OPTICAL TRANSCEIVER WITH CLOCK FOR PROVIDING MAINTENANCE AND LIFETIME INFORMATION
Granted: July 28, 2011
Application Number:
20110182571
An optoelectronic device uses microcode to perform an end of life calculation for the optoelectronic device. In a disclosed example, the optoelectronic device senses environmental and operational parameters under changing conditions during device operation. The optoelectronic device then calculates the end of life for itself based on one or more of the sensed environmental and/or operational parameters. The calculation can be done in real time and using digital logic. The calculation can…
OPTICAL DIFFERENTIAL PHASE-SHIFT KEYED SIGNAL DEMODULATOR
Granted: July 14, 2011
Application Number:
20110170171
A phase-shift keyed signal demodulator is disclosed including a filter positioned to receive an input beam, a first photodiode positioned to receive light reflected from the filter, and a second photodiode positioned to receive light transmitted through the filter. A difference between outputs of the first and second photodiodes is interpreted to determine a data value encoded in the input beam. In another embodiment N filters receive inputs from a splitter and include transmission…
VARIABLE OPTICAL ATTENUATOR INTEGRATION INTO TRANSMITTER OPTICAL SUBASSEMBLIES
Granted: July 14, 2011
Application Number:
20110170880
A small-scale VOA system includes a polarization rotator, a voltage multiplier circuit, and at least one transistor. The polarization rotator can be positioned within a TOSA along the emission axis of a corresponding optical signal source in addition to one or more polarizers. A microcontroller provides a first low voltage control signal to a voltage multiplier to generate a large voltage DC signal which is provided to the transistor. The transistor modulates the large voltage signal…
OPTICAL TRANSCIEVER
Granted: May 12, 2011
Application Number:
20110110669
An optical transceiver for detecting an incoming light beam and for transmitting an outgoing light beam along a common optical axis is provided. Such an optical transceiver provides a compact optical transceiver that is suitable for a wide variety of applications.
ASYMMETRIC DBR PAIRS COMBINED WITH PERIODIC AND MODULATION DOPING TO MAXIMIZE CONDUCTION AND REFLECTIVITY, AND MINIMIZE ABSORPTION
Granted: April 28, 2011
Application Number:
20110096803
An optical device for improving conduction and reflectivity and minimizing absorption. The optical device includes a first mirror comprising a first plurality of mirror periods designed to reflect an optical field at a predetermined wavelength, where the optical field has peaks and nulls. Each of the plurality of mirror periods includes a first layer of having a high carrier mobility, a second layer having lower carrier mobility, and a first compositional ramp between the first and…
VERTICAL CAVITY SURFACE EMITTING LASER WITH UNDOPED TOP MIRROR
Granted: April 21, 2011
Application Number:
20110090930
A VCSEL with undoped top mirror. The VCSEL is formed from an epitaxial structure deposited on a substrate. A doped bottom mirror is formed on the substrate. An active layer that includes quantum wells is formed on the bottom mirror. A periodically doped conduction layer is formed on the active layer. The periodically doped conduction layer is heavily doped at locations where the optical energy is at a minimum when the VCSEL is in operation. A current aperture is used between the…
LASER DRIVERS FOR CLOSED PATH OPTICAL CABLES
Granted: April 21, 2011
Application Number:
20110091219
Simplified laser drivers for closed path digital optical cables and digital optical cables including the simplified laser drivers. The laser driver can include less transistors than conventional laser drivers for optical communication cables. The laser can include a bias source and modulation source. The bias source can have a single constant current bias point for all laser diodes. The modulation current source can have a single temperature coefficient for all laser diodes. The laser…
SEMICONDUCTOR HAVING ENHANCED CARBON DOPING
Granted: April 14, 2011
Application Number:
20110086452
Methods for fabricating semiconductors with enhanced strain. One embodiment includes fabrication of a semiconductor device with an epitaxial structure. The epitaxial structure is formed with one or more semiconductor layers. One or more of the layers includes a dopant including small quantities of Al and repeated delta doping during expitaxial growth to form periods where surfaces are group III rich.
