Alignment features in a probing device
Granted: July 14, 2009
Patent Number:
7560943
An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For example, such a feature may be a corner of one of the tips. An array of probes may be formed to have such alignment features.
Method and system for compensating thermally induced motion of probe cards
Granted: July 14, 2009
Patent Number:
7560941
The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling…
Method of making lithographic contact elements
Granted: July 7, 2009
Patent Number:
7555836
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and…
Method of expanding tester drive and measurement capability
Granted: July 7, 2009
Patent Number:
7557592
A probe card assembly can comprise an interface, which can be configured to receive from a tester test signals for testing an electronic device. The probe card assembly can further comprise probes for contacting the electronic device and electronic driver circuits for driving the test signals to ones of the probes.
Test assembly including a test die for testing a semiconductor product die
Granted: July 7, 2009
Patent Number:
7557596
One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. The test die may be designed according to a design methodology that includes the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry…
Spring interconnect structures
Granted: June 30, 2009
Patent Number:
7553165
An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second…
Integrated circuit assembly
Granted: June 23, 2009
Patent Number:
7550842
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.
Testing an electronic device using test data from a plurality of testers
Granted: June 16, 2009
Patent Number:
7548055
A method and apparatus for testing a set of electronic devices can comprise placing electronic devices into a test station. A plurality of testers can provide test data to the test station. The test station can test the electronic devices using test data received from the plurality of testers. One of the testers can communication with another of the testers regarding the testing of the electronic devices. Probes can be used to contact the electronic devices, and one of the electronic…
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
Granted: May 19, 2009
Patent Number:
7534654
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the…
Extended probe tips
Granted: May 5, 2009
Patent Number:
7528618
Probe tips, methods for making probe tips, and method for using such probe trips are described. The probe tips can include a pedestal portion connected to a beam of a cantilever structure and a contact portion that can contact an electronic component that to be tested. The pedestal portion and contact portions can have a generally trapezoidal shape. The probe tips can also include a rectangular-shaped extension portion located between the base and contact portions. The probe tips can be…
Lithographic type microelectronic spring structures with improved contours
Granted: April 28, 2009
Patent Number:
7524194
Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular,…
Method of estimating channel bandwidth from a time domain reflectometer (TDR) measurement using rise time and maximum slope
Granted: April 28, 2009
Patent Number:
7525302
Bandwidth of a test channel is determined from a single port Time Domain Reflectometer (TDR) measurement with the channel terminated in a short or an open circuit. Bandwidth is estimated by: (1) making a TDR measurement of a channel terminated in a short or open circuit; (2) determining a maximum slope of the reflection from the TDR measurement; (3) calculating an interpolated rise or fall time, for example by taking 80% of the applied voltage between the 10% and 90% points, and then…
Closed-grid bus architecture for wafer interconnect structure
Granted: March 24, 2009
Patent Number:
7508227
An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure includes a circuit board implementing an array of bus nodes, each corresponding to a separate one of the I/O pads. The circuit board includes at least two layers. Traces mounted on a first layer form a set of first…
Method and apparatus for making a determination relating to resistance of probes
Granted: March 3, 2009
Patent Number:
7498824
According to some embodiments, a method of determining a resistance of probes on a contactor device is disclosed. The contactor device can include a plurality of probes disposed to contact an electronic device to be tested. The method can include electrically connecting a pair of the probes to each other, and then forcing one of a voltage onto or a current through the pair of the probes. At a location on the contactor device, the other of a voltage across or a current through the pair of…
Probe card assembly with an interchangeable probe insert
Granted: March 3, 2009
Patent Number:
7498825
A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly…
Electric discharge machining of a probe array
Granted: February 10, 2009
Patent Number:
7488917
A method of forming a probe away includes forming a layer of tip material over a block of probe material. A first electric discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to…
System for measuring signal path resistance for an integrated circuit tester interconnect structure
Granted: February 3, 2009
Patent Number:
7486095
Resistances of signal paths within a interconnect structure for linking input/output (I/O) ports of an integrated circuit (IC) tester to test points of an IC are measured by the IC tester itself. To do so the interconnect structure is used to link the tester's I/O ports to a similar arrangement of test points linked to one another through conductors. Drivers within the tester, which normally transmit digital test signals to IC test points via the I/O ports when the IC is under test, are…
Apparatus and method for limiting over travel in a probe card assembly
Granted: January 27, 2009
Patent Number:
7482822
Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.
Methods for making plated through holes usable as interconnection wire or probe attachments
Granted: January 20, 2009
Patent Number:
7479792
Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method,…
Stiffener assembly for use with testing devices
Granted: December 30, 2008
Patent Number:
7471078
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the…
