Electromagnetically coupled interconnect system architecture
Granted: February 15, 2011
Patent Number:
7889022
An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.
Method and apparatus for testing devices using serially controlled resources
Granted: February 15, 2011
Patent Number:
7888955
Methods and apparatus for testing devices using serially controlled resources have been described. Examples of the invention can relate to an apparatus for testing a device under test (DUT). In some examples, an apparatus can include an integrated circuit (IC) having a serialized input coupled to test circuits, the test circuits selectively communicating test signals with the DUT responsive to a test control signal on the serialized input.
Method to build a wirebond probe card in a many at a time fashion
Granted: February 8, 2011
Patent Number:
7884006
Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The…
Stiffener assembly for use with testing devices
Granted: February 8, 2011
Patent Number:
7884627
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of…
Method and apparatus for increasing operating frequency of a system for testing electronic devices
Granted: February 1, 2011
Patent Number:
7880486
A test system includes a communications channel that terminals in a probe, which contacts an input terminal of an electronic device to be tested. A resistor is connected between the communications channel near the probe and ground. The resistor reduces the input resistance of the terminal and thereby reduces the rise and fall times of the input terminal. The channel may be terminated in a branch having multiple paths in which each path is terminated with a probe for contacting a terminal…
Printing of redistribution traces on electronic component
Granted: February 1, 2011
Patent Number:
7880489
A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.
Composite motion probing
Granted: January 11, 2011
Patent Number:
7868632
An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second…
Probe card cooling assembly with direct cooling of active electronic components
Granted: January 4, 2011
Patent Number:
7863915
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
Rotating contact element and methods of fabrication
Granted: December 14, 2010
Patent Number:
7851794
Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
Sharing resources in a system for testing semiconductor devices
Granted: December 14, 2010
Patent Number:
7852094
Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the…
Method and apparatus for adjusting a multi-substrate probe structure
Granted: December 7, 2010
Patent Number:
7845072
A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,”…
Spring interconnect structures
Granted: November 30, 2010
Patent Number:
7841863
An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second…
Apparatus for testing devices
Granted: November 30, 2010
Patent Number:
7843202
Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
Method of repairing a contactor apparatus
Granted: November 23, 2010
Patent Number:
7836587
An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach…
Alignment features in a probing device
Granted: November 16, 2010
Patent Number:
7834647
An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For example, such a feature may be a corner of one of the tips. An array of probes may be formed to have such alignment features.
Method and apparatus for remotely buffering test channels
Granted: November 2, 2010
Patent Number:
7825652
A system is provided to enable leakage current measurement or parametric tests to be performed with an isolation buffer provided in a channel line. Multiple such isolation buffers are used to connect a single signal channel to multiple lines. Leakage current measurement is provided by providing a buffer bypass element, such as a resistor or transmission gate, between the input and output of each buffer. The buffer bypass element can be used to calibrate buffer delay out of the test…
Probe card configuration for low mechanical flexural strength electrical routing substrates
Granted: November 2, 2010
Patent Number:
7825674
A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3)…
Method and apparatus for providing active compliance in a probe card assembly
Granted: November 2, 2010
Patent Number:
7825675
A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.
Test system with wireless communications
Granted: October 26, 2010
Patent Number:
7821255
A test system for testing electronic devices can include a plurality of testers and a test station. The test station can include probes to contact the devices and the tester can control testing. Test data can be received by the test station from the testers using wireless communications links.
Process and apparatus for finding paths through a routing space
Granted: October 12, 2010
Patent Number:
7814453
An initial graph of nodes is created within a routing space, and the number and locations of the nodes in the graph are adjusted. Links are created between nodes of the graph, and traces between specified nodes are created through the linked graph.
