Optical beam spectrometer with movable lens
Granted: February 28, 2012
Patent Number:
8125637
A spectroscopic system is described that provides at least one of focus of an excitation beam onto a sample, automatic focus of an optical system of the spectroscopic system for collecting a spectroscopic signal, and/or averaging of excitation intensity over a surface area of the sample.
Method of and apparatus utilizing carbon cord for evaporation of metals
Granted: February 14, 2012
Patent Number:
8114339
A high temperature evaporator is made using an electrically insulating crucible and a heating element made of woven graphite fibers. The crucible is manufactured out of an electrically insulating block to the required shape, and channels are machined on the walls of the crucible. The woven graphite cord is threaded through the channels and is used as heating elements. Since the heating cords are made of woven graphite, they are very flexible and do not embrittle. They can be manufactured…
Evaporative system for solar cell fabrication
Granted: January 3, 2012
Patent Number:
8087380
A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the…
Apparatus and methods for transporting and processing substrates
Granted: March 8, 2011
Patent Number:
7901539
There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following…
Processing thin wafers
Granted: November 3, 2009
Patent Number:
7611322
There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
Semiconductor die attachment for high vacuum tubes
Granted: October 27, 2009
Patent Number:
7607560
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
Semiconductor die attachment for high vacuum tubes
Granted: October 27, 2009
Patent Number:
7608533
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Photocathode structure and operation
Granted: May 12, 2009
Patent Number:
7531826
A novel photocathode employing a rectifying junction is described that permits color imaging extending applications for photocathodes in a variety of instruments and night vision devices.
Backside imaging through a doped layer
Granted: January 20, 2009
Patent Number:
7479686
Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for…
Backside thinning of image array devices
Granted: May 9, 2006
Patent Number:
7042060
Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped…
Semiconductor die attachment for high vacuum tubes
Granted: March 14, 2006
Patent Number:
7012328
There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Backside thinning of image array devices
Granted: February 28, 2006
Patent Number:
7005637
Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped…
Capacitance sensing for substrate cooling
Granted: February 21, 2006
Patent Number:
7000418
Described is a cooling system for use in the manufacture of substrates into magnetic disk memory in which cooling plates are positioned dynamically in relation to a substrate to be cooled. This enables positioning the cooling plates closer for more effective cooling. Positioning is controlled by capacitive measurements between the cooling plates and the substrate to be cooled.
Backthinned CMOS sensor with low fixed pattern noise
Granted: November 29, 2005
Patent Number:
6969839
This invention deals with the reduction in fixed pattern noise in backthinned CMOS imagers primarily for use in a vacuum environment. Reduction is achieved by effectively shielding the imager. This is done by depositing a conductive layer on the front surface prior to the attachment of a support member or by incorporating a conductive layer into the die at least extensive with the analog circuitry. This also may be achieved by leaving a void adjacent to the analog circuitry area. This…
Wavelength extension for backthinned silicon image arrays
Granted: September 13, 2005
Patent Number:
6943425
There is described a back thinned sensor in which a material is added on the front surface to extend the wavelength of the sensor into wavelengths it normally does not reach. In the preferred embodiment, the back-thinned layer comprises silicon and is the base for a CMOS device or a CCD. The photocathode in a night vision device comprises in the preferred unit GaAs.
Disk coating system
Granted: July 19, 2005
Patent Number:
6919001
There is described a disk processing and manufacturing equipment in which the processing chambers are stacked on top of each other and in which the disks move through the system on disk carriers which are adjustable to take disks of varying sizes. The disks enter the system through a load zone and are then installed into disk carriers. They move in the carriers sequentially through processing chambers at one level and then move to the other level in a lift or elevator. At this other…
Unitary vacuum tube incorporating high voltage isolation
Granted: January 4, 2005
Patent Number:
6837766
A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of the housing where the leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming…
Electron bombarded passive pixel sensor imaging
Granted: December 2, 2003
Patent Number:
6657178
A low light level image directed to a photocathode in a vacuum causes release of electron which bombard a CMOS imager including passive pixel sensors which in turn generates an electronic image which is fed out of the vacuum and is used to create useful images corresponding to the low level input image. A camera and other low light imaging devices are described.
Method and apparatus for multi-target sputtering
Granted: October 21, 2003
Patent Number:
6635154
Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motion between the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the…
Substrate processing system
Granted: February 11, 2003
Patent Number:
6517691
A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system…
