Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics
Granted: June 11, 2009
Application Number:
20090145225
Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X,…
INTEGRATED MICROELECTROMECHANICAL SYSTEMS (MEMS) VIBRATING MASS Z-AXIS RATE SENSOR
Granted: May 7, 2009
Application Number:
20090114016
A sensor that measures angular velocity about an axis that is normal to a sensing plane of the sensor. The sensor comprises a sensing subassembly that includes a planar frame parallel to the sensing plane, a first proof mass disposed in the sensing plane, a second proof mass disposed in the sensing plane laterally to the first proof mass, and a linkage within the frame and connected to the frame. The linkage is connected to the first proof mass and to the second proof mass. The sensor…
Integrated Motion Processing Unit (MPU) With MEMS Inertial Sensing And Embedded Digital Electronics
Granted: January 8, 2009
Application Number:
20090007661
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific…
VERTICALLY INTEGRATED 3-AXIS MEMS ACCELEROMETER WITH ELECTRONICS
Granted: December 25, 2008
Application Number:
20080314147
A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are…
METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM
Granted: November 20, 2008
Application Number:
20080283990
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS…
X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING
Granted: May 22, 2008
Application Number:
20080115579
An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity…
