InvenSense Patent Grants

Integrated audio amplification circuit with multi-functional external terminals

Granted: October 10, 2017
Patent Number: 9787267
The present invention relates in one aspect to an audio amplification circuit comprising an input terminal for receipt of an input signal from a transducer. A signal processor is operatively coupled to the input terminal for receipt and processing of the input signal to generate a processed digital audio signal in accordance with a programmable configuration setting of the signal processor. A serial data transmission interface is configured for receipt of the processed digital audio…

Method and apparatus for navigation with nonlinear models

Granted: October 10, 2017
Patent Number: 9784582
A navigation module and method for providing an INS/GNSS navigation solution for a device that can either be tethered or move freely within a moving platform is provided, comprising a receiver for receiving absolute navigational information from an external source (e.g., such as a satellite), an assembly of self-contained sensors capable of obtaining readings (e.g. such as relative or non-reference based navigational information) about the device, and further comprising at least one…

Compressed firmware update

Granted: October 3, 2017
Patent Number: 9778928
It may be determined that a payment reader requires a firmware update, which may be transmitted to the payment reader as compressed firmware update blocks. The payment reader may receive a first portion of set of the compressed firmware update blocks. The payment reader may decompress the first portion and determine a partial firmware offset associated with the first portion. If the firmware update is incomplete, the payment reader may transmit that partial firmware offset to a second…

Anchor-tilt cancelling accelerometer

Granted: September 19, 2017
Patent Number: 9766264
Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be…

Microphone system with non-orthogonally mounted microphone die

Granted: September 19, 2017
Patent Number: 9769562
A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one…

CMOS-MEMS integration by sequential bonding method

Granted: September 12, 2017
Patent Number: 9761557
Methods for bonding two wafers are disclosed. In one aspect, a first wafer includes an integrated circuit and the second wafer including a MEMS device. The method comprises depositing a bond pad on a metal on the first wafer and sequentially bonding the first wafer to the second wafer utilizing first and second temperatures. The second wafer is bonded to the bond pad at the first temperature and the bond pad and the metal are bonded at the second temperature. In another aspect, a first…

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Granted: September 5, 2017
Patent Number: 9751752
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS…

System and method for estimating heading misalignment

Granted: September 5, 2017
Patent Number: 9752879
This disclosure relates to heading misalignment estimation with a portable device and more specifically to estimating misalignment between a portable device having a sensor assembly and a platform transporting the portable device when the platform is undergoing motion having periodic characteristics. In one aspect, a suitable method includes obtaining inertial sensor data for the portable device and determining an effective frequency characteristic of the inertial sensor data…

3D integration using Al—Ge eutectic bond interconnect

Granted: September 5, 2017
Patent Number: 9754922
Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second CMOS wafer. The eutectic bond includes combinations where the eutectic bonding temperature is lower than the maximum temperature a CMOS circuit can withstand without being damaged during processing.

Signal processing for an acoustic sensor bi-directional communication channel

Granted: August 29, 2017
Patent Number: 9749736
Signal processing for an acoustic sensor bi-directional communication channel is presented herein. The acoustic sensor can comprise a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, a signal…

Reduction of chipping damage to MEMS structure

Granted: August 22, 2017
Patent Number: 9738511
A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with…

CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture

Granted: August 22, 2017
Patent Number: 9738512
An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two…

Transducer with enlarged back volume

Granted: August 22, 2017
Patent Number: 9738515
A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first…

Curvature-corrected bandgap reference

Granted: August 22, 2017
Patent Number: 9740229
A curvature-corrected bandgap reference comprising a first BJT device operating at a first current density that is substantially proportional to absolute temperature, the first BJT device having a first base-emitter voltage and a first base terminal and a second BJT device operating at a second current density that is substantially independent of temperature, the second BJT device having a second base-emitter voltage and a second base terminal. The first and second base terminals operate…

MEMS-CMOS-MEMS platform

Granted: August 15, 2017
Patent Number: 9731961
A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of…

Method of increasing MEMS enclosure pressure using outgassing material

Granted: August 15, 2017
Patent Number: 9731963
Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes…

Microelectromechanical systems electret microphone

Granted: August 15, 2017
Patent Number: 9736594
Microelectromechanical systems (MEMS) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in MEMS electret acoustic sensors or microphones. Provided implementations include variations in electret acoustic sensor or microphone configuration and recharging of the electret.

Dual cavity pressure structures

Granted: August 8, 2017
Patent Number: 9725305
Provided herein is a method including forming a trench in a handle substrate, and a trench lining is formed in the trench. A first cavity and a second cavity are formed in the handle substrate, wherein the first cavity is connected to the trench. A first MEMS structure and the handle substrate are sealed for maintaining a first pressure within the trench and the first cavity. A second MEMS structure and the handle substrate are sealed for maintaining the first pressure within the second…

Multi-function pins for a programmable acoustic sensor

Granted: August 8, 2017
Patent Number: 9729963
A programmable acoustic sensor is disclosed. The programmable acoustic sensor includes a MEMS transducer and a programmable circuitry coupled to the MEMS transducer. The programmable circuitry includes a power pin and a ground pin. The programmable acoustic sensor also includes a communication channel enabling data exchange between the programmable circuitry and a host system. One of the power pin and the ground pin can be utilized for data exchange.

MEMS acoustic sensor comprising a non-perimeter flexible member

Granted: August 1, 2017
Patent Number: 9718671
A micro electro-mechanical system (MEMS) acoustic sensor is disclosed. The acoustic sensor comprises a backplate and a diaphragm. The acoustic sensor further comprises a flexible member and optional spacer member disposed between the backplate and the diaphragm resulting in a gap between the backplate and the diaphragm. The gap can vary in response to impinging pressure on the diaphragm based on the design of the flexible member and resulting in a variable capacitance between the…