InvenSense Patent Grants

Method for tuning the resonant frequency of a piezoelectric micromachined ultrasonic transducer

Granted: March 26, 2024
Patent Number: 11938515
The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by…

Sensor output digitizer

Granted: March 19, 2024
Patent Number: 11933648
The described technology is generally directed towards a sensor output digitizer. The sensor output digitizer can comprise a multiplexer stage, a multi-stage analog to digital converter, and a digital output combiner. The multiplexer stage can be configured to sequentially select sensor outputs from one or more sensors, resulting in a stream of selected sensor outputs. The multi-stage analog to digital converter can be coupled with the multiplexer stage, and can be configured to convert…

HW programmable signal path event-based DSP for sensor mixed signal devices

Granted: March 12, 2024
Patent Number: 11928507
A hardware-programmable digital signal path component for processing events from sensor mixed signal devices. A system includes a mixed signal component and a reconfigurable signal path component. The mixed signal component includes a group of sensor devices and generates one or more events from among the group of sensor devices. The signal path component receives the event(s), and includes a control unit component and a digital signal processor (DSP) component. The control unit…

Sensor with dimple features and improved out-of-plane stiction

Granted: March 5, 2024
Patent Number: 11919769
A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed…

Round robin sensor device for processing sensor data

Granted: February 27, 2024
Patent Number: 11913788
A round robin sensor device for processing sensor data is provided herein. The sensor device includes a multiplexer stage configured to sequentially select sensor outputs from one or more sensors continuously. Continuously and sequentially selecting sensor outputs results in a stream of selected sensor outputs. The sensor device also includes a charge-to-voltage converter operatively coupled to the multiplexer stage and configured to convert a charge from a first sensor of the one or…

MEMS tab removal process

Granted: February 20, 2024
Patent Number: 11905170
A method includes tab dicing a region of a tab region disposed between a first die and a second die. The tab region structurally connects the first die to the second die each including a MEMS device eutecticly bonded to a CMOS device. The tab region includes a handle wafer layer disposed over a fusion bond oxide layer that is disposed on an ACT layer. The tab region is positioned above a CMOS tab region that with the first and second die form a cavity therein. The tab dicing cuts through…

Machine learning glitch prediction

Granted: January 30, 2024
Patent Number: 11888455
Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.

Motion sensor with sigma-delta analog-to-digital converter having resistive continuous-time digital-to-analog converter feedback for improved bias instability

Granted: January 23, 2024
Patent Number: 11881874
A motion sensor with sigma-delta analog-to-digital converter (ADC) having improved bias instability is presented herein. Differential outputs of a differential amplifier of the sigma-delta ADC are electrically coupled, via respective capacitances, to differential inputs of the differential amplifier. To minimize bias instability corresponding to flicker noise that has been injected into the differential inputs, the differential inputs are electrically coupled, via respective pairs of…

Inertial sensor sensing of vibration frequency

Granted: January 23, 2024
Patent Number: 11879906
A modified version of a MEMS self-test procedure is presented that can be used to detect the amplitude and frequency of an external vibration from an ambient environment. The method implements processing circuitry that correlates an output sense signal, s(t), with a plurality of periodic signal portions and a plurality of shifted periodic signal portions to generate a plurality of correlation values. A frequency associated with the external vibration is determined based on the plurality…

Robust method for gyroscope drive amplitude measurement

Granted: January 9, 2024
Patent Number: 11867509
A MEMS gyroscope includes a driven mass that moves in response to a drive force. A drive amplitude sense electrode is included as a feature of the drive mass and extends in a direction perpendicular to the drive direction. A change in capacitance is measured based on the relative location of the drive amplitude sense electrode to a known fixed position, which in turn is used to accurately determine a location of the driven mass.

Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

Granted: December 19, 2023
Patent Number: 11847851
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Low stress overtravel stop

Granted: December 19, 2023
Patent Number: 11846648
A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.

Piezoelectric micromachined ultrasonic transducer with a patterned membrane structure

Granted: December 12, 2023
Patent Number: 11844282
A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form a central portion…

Drive and sense balanced, fully-coupled 3-axis gyroscope

Granted: December 12, 2023
Patent Number: 11841228
The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to…

Applying a positive feedback voltage to an electromechanical sensor utilizing a voltage-to-voltage converter to facilitate a reduction of charge flow in such sensor representing spring softening

Granted: December 5, 2023
Patent Number: 11835538
Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input…

Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling

Granted: December 5, 2023
Patent Number: 11834328
A semiconductor package with design features, including an isolation structure for internal components and a flexible electrical connection, that minimizes errors due to environmental temperature, shock, and vibration effects. The semiconductor package may include a base having a first portion surrounded by a second portion. A connector assembly may be attached to the first portion. The connector assembly may extend through an opening in the base. A lid attached may be attached to, at…

Minimizing a delay of a capacitance-to-voltage converter of a gyroscope by including such converter within a bandpass sigma-delta analog-to-digital converter of the gyroscope

Granted: November 21, 2023
Patent Number: 11821731
Facilitating minimization of non-linearity effects of a delay of a capacitance-to-voltage (C2V) converter on an output of a gyroscope is presented herein. A sense output signal of a sense mass of the gyroscope and a drive output signal of a drive mass of the gyroscope are electronically coupled to respective analog-to-digital converter (ADC) inputs of bandpass sigma-delta ADCs of the gyroscope. The bandpass sigma-delta ADCs include respective C2V converters that are electronically…

Programmable ultrasonic transceiver

Granted: November 21, 2023
Patent Number: 11819879
An ultrasonic transceiver system includes a transmitter block, a receiver block, a state machine, and a computing unit. The transmitter block contains circuitry configured to drive an ultrasound transducer. The receiver block contains circuitry configured to receive signals from the ultrasound transducer and convert the signals into digital data. The state machine is coupled to the transmitter and receiver blocks and contains circuitry configured to act as a controller for those blocks.…

Split electrode design for a transducer

Granted: November 21, 2023
Patent Number: 11819361
An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and…

Drive and sense balanced, semi-coupled 3-axis gyroscope

Granted: November 14, 2023
Patent Number: 11815354
In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis…