Sensor linearization based upon correction of static and frequency-dependent non-linearities
Granted: April 4, 2023
Patent Number:
11619492
Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output…
Actuator layer patterning with topography
Granted: April 4, 2023
Patent Number:
11618674
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is…
Sensor linearization based upon correction of static and frequency-dependent non-linearities
Granted: April 4, 2023
Patent Number:
11619492
Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output…
Actuator layer patterning with topography
Granted: April 4, 2023
Patent Number:
11618674
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is…
Reducing delamination in sensor package
Granted: February 21, 2023
Patent Number:
11584638
A sensor can comprise a sensor die with a first sensor surface and a second sensor surface opposite to the first sensor surface. The sensor can further comprise a die pad component with a first pad surface and a second pad surface opposite to the first pad surface, wherein the sensor die is vertically stacked with the die pad component, with the second sensor surface oriented toward the first pad surface. The sensor can further comprise a lead frame component with a first frame surface…
Piezoelectric micromachined ultrasound transducer device with multi-layer etched isolation trench
Granted: February 14, 2023
Patent Number:
11577276
A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices…
Piezoelectric poling of a wafer with temporary and permanent electrodes
Granted: January 24, 2023
Patent Number:
11563166
An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied…
Piezoelectric poling of a wafer with temporary and permanent electrodes
Granted: January 24, 2023
Patent Number:
11563166
An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied…
Systems and methods for operating a MEMS device based on sensed temperature gradients
Granted: January 10, 2023
Patent Number:
11548780
An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are…
Ultrasonic beacon tracking
Granted: January 3, 2023
Patent Number:
11543486
Time of flight between two or more ultrasonic transceivers is measured using known delays. First and second transceivers are duty cycled, each having a respective receive period that is less than a measurement period during which the transceivers are configured to receive transmissions. An ultrasonic trigger pulse is transmitted by the first transceiver. The second transceiver, upon receiving the trigger pulse, transmits an ultrasonic response pulse after a first predefined delay time…
Sensor misalignment measuring device
Granted: January 3, 2023
Patent Number:
11543229
The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes,…
Sensor with dimple features and improved out-of-plane stiction
Granted: January 3, 2023
Patent Number:
11542154
A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed…
Method and system for estimating vehicle body tilt
Granted: December 20, 2022
Patent Number:
11529838
Vehicle body tilt, representing a difference between a vehicle body frame of reference and a wheel-base frame of reference, is determined by obtaining information from sensor assemblies for the vehicle body and for the wheel-base. Navigational solutions are generated for the sensor assemblies using motion sensor data from the assemblies and absolute navigational information. Correspondingly, vehicle body tilt is determined based at least in part on the vehicle body navigation solution…
Reflection minimization for sensor
Granted: December 6, 2022
Patent Number:
11517938
An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures…
Using a hearable to generate a user health indicator
Granted: December 6, 2022
Patent Number:
11517252
A hearable comprises at least one microphone coupled with a wearable structure and a sensor processing unit disposed within the wearable structure and coupled with the microphone. A portion of the wearable structure is configured to be disposed within a user's ear. The sensor processing unit acquires audio data from the at least one microphone and head motion data from at least one motion sensor of the sensor processing unit. The head motion data describes motions of the user's head and…
EMI reduction in piezoelectric micromachined ultrasound transducer array
Granted: November 29, 2022
Patent Number:
11515465
A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.
Miniature ultrasonic transducer package
Granted: November 22, 2022
Patent Number:
11508346
A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity…
Reconfigurable power sequencer for embedded sensors and mixed signal devices
Granted: November 22, 2022
Patent Number:
11507163
Facilitating powering up/down respective analog circuits of mixed-signal devices utilizing a reconfigurable power sequencer component and corresponding reconfigurable sequencer processing unit(s) is presented herein. A system can comprise a mixed-signal component comprising a group of analog circuits comprising respective inputs to facilitate a power-up and a power-down of respective portions of the analog circuits; and a reconfigurable power sequencer component that obtains, from a…
Liquid detection in a sensor environment and remedial action thereof
Granted: November 15, 2022
Patent Number:
11499884
A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the…
Edge patterns of microelectromechanical systems (MEMS) microphone backplate holes
Granted: November 1, 2022
Patent Number:
11490186
Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge…
