Electrical contact for semiconductor package
Patent Number 11811180 - November 7, 2023
Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a…
Packaged fast inverse diode component for PFC applications
Patent Number 10319669 - June 11, 2019
A novel four-terminal packaged semiconductor device is particularly useful in a 400 volt DC output PFC boost converter circuit. Within the…
Packaged overvoltage protection circuit for triggering thyristors
Patent Number 10304970 - May 28, 2019
In a first embodiment, an ultra-fast breakover diode has a turn on time TON that is less than 0.3 microseconds, where the forward breakover…
Heat transfer plate having small cavities for taking up a thermal transfer material
Patent Number 10276472 - April 30, 2019
A power semiconductor device module includes, among other parts, a DMB structure. The DMB structure includes a ceramic sheet, a top metal…
IGBT assembly having saturable inductor for soft landing a diode recovery current
Patent Number 10249716 - April 2, 2019
A combination switch includes an Insulated Gate Bipolar Transistor (IGBT), an anti-parallel diode, and a saturable inductor. The diode and…
ELECTRICAL CONTACT FOR SEMICONDUCTOR PACKAGE
Application Number 20220085525 - March 17, 2022
Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a…
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH
Application Number 20200303281 - September 24, 2020
A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with…
FAST RECOVERY INVERSE DIODE
Application Number 20200287058 - September 10, 2020
An inverse diode die has a high reverse breakdown voltage, a short reverse recovery time Trr, and is rugged in terms of reverse breakdown…
Thin Profile Power Semiconductor Device Package Having Face-To-Face Mounted Dice And No Internal Bondwires
Application Number 20190189797 - June 20, 2019
A packaged semiconductor device has a thin profile, two face-to-face mounted power semiconductor device dice, and no internal bond wires. A…
FAST RECOVERY INVERSE DIODE
Application Number 20190115480 - April 18, 2019
An inverse diode die has a high reverse breakdown voltage, a short reverse recovery time Trr, and is rugged in terms of reverse breakdown…
GROCE v. IXYS CORPORATION et al
California Northern District Court - November 8, 2017
Horwitz v. IXYS Corporation et al
California Northern District Court - November 7, 2017
Franchi v. IXYS Corporation et al
Delaware District Court - November 6, 2017
Fox v. IXYS Corporation et al
California Northern District Court - November 3, 2017
Sanchez v. IXYS Corporation et al
California Northern District Court - November 3, 2017
Sanchez v. IXYS Corporation et al
California Northern District Court - October 2, 2018
Order by Judge William H. Orrick granting 48 Motion to Dismiss. Sanchez may have leave to amend within 20 days of the date of this Order. …
Sanchez v. IXYS Corporation et al
California Northern District Court - February 26, 2018
ORDER APPOINTING LEAD COUNSEL by Judge William H. Orrick re (4) Motion to Appoint Lead Plaintiff and Lead Counsel in case…
