Always-On Low-Power Keyword spotting
Granted: September 18, 2014
Application Number:
20140281628
The invention relates to an electronic device that includes a wake-up system that operates at a substantially low power level and is applied to wake up the electronic device from a sleep mode. The wake-up system comprises a sound transducer that converts a received sound signal to an electrical signal and a keyword detection logic that preliminarily identifies a speech energy profile that corresponds to at least one of a plurality of keywords in a part of the electrical signal. In some…
System and Method to Securely Transfer Data
Granted: September 18, 2014
Application Number:
20140281484
Various embodiments of the invention achieve optimal data security by adding a security layer to data at the point of generation. Some embodiments add a security feature to data that controls or configures a device at a physical interface.
Method and device for contactless sensing rotation and angular position using orientation tracking
Granted: September 18, 2014
Application Number:
20140278224
Method and device for contactless sensing rotation and angular position using orientation tracking. 2.1 To improve the accuracy and possible resolution of a magnetic positioning system, a method and a device using a special tracking technique is proposed. 2.2 The method and the device are using multiple magnetic field sensing elements at different positions below a magnetic target. The sensed signals are used to select or combine the sensing elements for a best approach to the actual…
PLANAR DIFFRACTIVE OPTICAL ELEMENT LENS AND METHOD FOR PRODUCING SAME
Granted: September 18, 2014
Application Number:
20140268341
A planar diffractive optical element (DOE) lens is described herein. The planar DOE lens includes a substrate. The planar DOE lens further includes a first layer, the first layer being formed upon the substrate. The planar DOE lens further includes a diffractive optical element, the diffractive optical element being formed upon the first layer. The planar DOE lens further includes a second layer, the second layer being formed upon the first layer. The second layer is also formed over the…
MULTI-LEVEL STEP-UP CONVERTER TOPOLOGIES, CONTROL AND SOFT START SYSTEMS AND METHODS
Granted: September 18, 2014
Application Number:
20140266135
A multi-level, step-up converter circuit includes an inductor including one terminal in communication with an input voltage supply. N transistor pairs are connected in series, where N is an integer greater than one. First and second transistors of a first pair of the N transistor pairs are connected together at a node. The node is in communication with another terminal of the inductor. Third and fourth transistors of a second pair of the N transistor pairs are connected to the first and…
SOFT START SYSTEMS AND METHODS FOR MULTI-STAGE STEP-UP CONVERTERS
Granted: September 18, 2014
Application Number:
20140266134
A control circuit for a step-up converter includes a soft start module configured to control states of N transistor pairs of the step-up converter, where N is an integer greater than two. A driver module is in communication with the soft start module and configured to generate a first signal when N transistor pairs of the step-up converter are ready to switch. A first charging circuit is configured to charge (N?1) capacitors of the step-up converter to an input voltage of the step-up…
LIGHT SENSOR WITH VERTICAL DIODE JUNCTIONS
Granted: September 18, 2014
Application Number:
20140264711
Light sensors are described that include a trench structure integrated therein. In an implementation, the light sensor includes a substrate having a dopant material of a first conductivity type and multiple trenches disposed therein. The light sensor also includes a diffusion region formed proximate to the multiple trenches. The diffusion region includes a dopant material of a second conductivity type. A depletion region is created at the interface of the dopant material of the first…
WAFER-LEVEL PACKAGE MITIGATED UNDERCUT
Granted: September 11, 2014
Application Number:
20140252571
A wafer-level package device and techniques are described that include utilizing a dry-etch process for mitigating metal seed layer undercut. In an implementation, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, depositing a metal seed layer on the substrate, depositing and patterning a resist layer, depositing a redistribution layer structure, removing the photoresist layer, and dry-etching…
CHIP-ON-GLASS FOR TOUCH APPLICATIONS
Granted: September 11, 2014
Application Number:
20140253459
A touch panel assembly device implementing chip-on-glass technology and a method (e.g., process) for making same are described herein. The touch panel assembly includes a touch panel (e.g., a capacitive touch panel). The touch panel includes a substrate formed of insulator material (e.g., glass). The touch panel also includes a plurality of conductors (e.g., transparent conductors, indium tin oxide traces) formed on the substrate. The touch panel assembly further includes an integrated…
PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE
Granted: September 11, 2014
Application Number:
20140252592
A device and fabrication techniques are described that employ wafer-level packaging techniques for fabricating semiconductor devices that include a pad defined contact. In implementations, the wafer-level package device that employs the techniques of the present disclosure includes a substrate, a passivation layer, a top metal contact pad, a thin film with a via formed therein, a redistribution layer structure configured to contact the top metal contact pad, and a dielectric layer on the…
SYSTEMS AND METHODS FOR FEED-FORWARD CONTROL OF LOAD CURRENT IN DC TO DC BUCK CONVERTERS
Granted: September 4, 2014
Application Number:
20140247032
A system for controlling load current in a voltage converter includes a current normalization module that receives a first measurement corresponding to the load current, receives a second measurement corresponding to an inductor current, and matches a first gain of the first measurement corresponding to the load current to a second gain of the second measurement corresponding to the inductor current to generate a normalized load current. A feed-forward generation module receives the…
TOUCH PANEL SENSOR HAVING DUAL-MODE CAPACITIVE SENSING FOR DETECTING AN OBJECT
Granted: August 28, 2014
Application Number:
20140240280
An apparatus configured to determine an approximate position of an object utilizing mutual-capacitance sensing capabilities during a first mode of operation and determining one or more attributes of the object utilizing self-capacitance sensing capabilities during a second mode of operation is disclosed. The apparatus includes a touch panel controller configured to operatively couple to a touch panel sensor. The touch panel sensor includes a plurality of drive electrodes and at least one…
Fast-Settling Capacitive-Coupled Amplifiers
Granted: August 21, 2014
Application Number:
20140232456
Fast-settling capacitive-coupled amplifiers are disclosed. The amplifiers use two Capacitive Coupled paths embedded in a Multipath Hybrid Nested Miller Compensation topology. One path is a direct high frequency path and the other path is a slower stabilization path. This combination results in a flat frequency response to and through the chopper frequency, and a fast settling response. Various exemplary embodiments are disclosed, including operational amplifier and instrumentation…
MULTICHIP WAFER LEVEL PACKAGE (WLP) OPTICAL DEVICE
Granted: August 21, 2014
Application Number:
20140231635
Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein. One or more optical component devices are disposed within the respective cavities in a predetermined arrangement. A cover is disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical…
Accelerometer with Low Sensitivity to Thermo-Mechanical Stress
Granted: August 21, 2014
Application Number:
20140230550
The invention relates to a microelectro-mechanical structure (MEMS), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate. At least one elastic element is incorporated into…
Low Distortion MOS Attenuator
Granted: July 31, 2014
Application Number:
20140210539
An attenuation circuit uses a voltage controlled variable resistance transistor as a signal attenuator for receivers operating in the zero Hz to about 30 MHz range. The transistor functions in the linear region to linearize the transistor resistance characteristics used for signal attenuation. In an exemplary application, the attenuation circuit is used as an RF attenuator for AM radio broadcast receivers and amplifiers with automatic gain control. Multiple attenuation circuits can be…
SYSTEM AND METHOD FOR DISCERNING COMPLEX GESTURES USING AN ARRAY OF OPTICAL SENSORS
Granted: July 17, 2014
Application Number:
20140198025
A method for gesture determination (e.g., discerning complex gestures) via an electronic system (e.g., a gesture sensing system) including an array of optical sensors is described herein. The method includes detecting a plurality of sub-gestures (e.g., simple gestures provided by a target located proximate to the system) via the array of optical sensors. The sensors generate signals based upon the detected (e.g., received) sub-gestures and transmit the signals to a processor of the…
MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE
Granted: July 3, 2014
Application Number:
20140183747
Wafer-level package semiconductor devices for high-current applications are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to…
LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WAFER-LEVEL PACKAGING (WLP) PACKAGES
Granted: June 19, 2014
Application Number:
20140167252
Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like.
CURRENT-STEERING DIGITAL-TO-ANALOG CONVERTER WITH CANCELLATION OF DYNAMIC DISTORTION
Granted: June 19, 2014
Application Number:
20140167996
A digital-to-analog converter (DAC) includes, in a segment of the DAC, a first switch and a second switch. The first switch includes a first pair of transistors having a first set of inputs and has a first output connected to an output of the DAC. The second switch includes second and third pairs of transistors having second and third sets of inputs, respectively, and has a second output that is connected to the output of the DAC. A driver module generates control signals to drive the…
