SHOCK-ROBUST INTEGRATED MULTI-AXIS MEMS GYROSCOPE
Granted: November 19, 2015
Application Number:
20150330784
Various embodiments of the invention integrate multiple shock-robust single-axis MEMS gyroscopes into a single silicon substrate while avoiding the complexities typically associated with designing a multi-drive control system for shock immune gyroscopes. In certain embodiments of the invention, a shock immune tri-axial MEMS gyroscope is based on a driving scheme that employs rotary joints to distribute driving forces generated by two sets of driving masses to individual sensors, thereby,…
SYSTEMS AND METHODS FOR MEMS GYROSCOPE SHOCK ROBUSTNESS
Granted: November 19, 2015
Application Number:
20150330783
Various embodiments of the invention allow for increased shock robustness in gyroscopes. In certain embodiments, immunity against undesired forces that corrupt signal output is provided by a chessboard-pattern architecture of proof masses that provides a second layer of differential signals not present in existing designs. Masses are aligned parallel to each other in a two-by-two configuration with two orthogonal symmetry axes. The masses are driven to oscillate in such a way that each…
MEMS PRESSURE SENSOR WITH IMPROVED INSENSITIVITY TO THERMO-MECHANICAL STRESS
Granted: October 1, 2015
Application Number:
20150274505
This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention improve pressure sensor performance (e.g., absolute and relative accuracy) by increasing pressure insensitivity to changes in thermo-mechanical stress. The pressure insensitivity can be achieved by using the array of pressure sensing membranes, suspended…
METHOD AND SYSTEM FOR QUADRATURE ERROR COMPENSATION
Granted: September 24, 2015
Application Number:
20150268060
The present invention concerns an MEMS sensor and a method for compensation of a quadrature error on an MEMS sensor, which is intended for detection of movements of a substrate, especially accelerations and/or rotation rates. At least one mass arranged on the substrate and mounted to move relative to it is driven by means of drive electrodes. The mass/es execute a movement deviating from the prescribed movement due to a quadrature error. A deflection of the mass/es occurring due to…
ACCESSORY MANAGEMENT AND DATA COMMUNICATION USING AUDIO PORT
Granted: September 17, 2015
Application Number:
20150261641
A method for accessory management and data communication between a portable electronic device and an accessory via audio port is disclosed. The method involves using a microphone line of the accessory in different communication modes including a MIC data mode and a power mode. In the MIC data mode, the MIC line disconnects from a microphone load to operate on a voltage above a predetermined threshold whenever the accessory needs to communicate with the host electronic device. In the MIC…
PREDICTIVE SAMPLING FOR PRIMARY SIDE SENSING IN ISOLATED FLYBACK CONVERTERS
Granted: August 20, 2015
Application Number:
20150236602
A system comprises a pulse width modulator, a voltage sensing circuit, a pulse generator, and a sampling circuit. The pulse width modulator generates a control signal to control a switch connected to an input voltage via a primary winding and to regulate an output voltage across a secondary winding that is supplied to a load through a component connected in series with the secondary winding. The voltage sensing circuit senses a first voltage across the primary winding that represents the…
System and Method to Reduce Power Consumption in a Multi-Sensor Environment
Granted: July 23, 2015
Application Number:
20150206682
Various embodiments of the invention provide for fully-integrated, low-latency power reduction in multi-sensor systems. In certain embodiments, power consumption is minimized by modulating power and mode of operation of gyroscopes, magnetometers, and accelerometers under certain conditions. Certain embodiments provide for reduction of power consumption by the use of emulated gyroscope data.
ELIMINATING VISIBLE FLICKER IN LED-BASED DISPLAY SYSTEMS
Granted: July 9, 2015
Application Number:
20150194097
A system includes a driver circuit, a modulator circuit, and a reset circuit. The driver circuit drives a plurality of light emitting diodes via a switch. The switch is controlled by a first signal having a first frequency. The driver circuit controls brightness of the light emitting diodes based on a second signal including a plurality of pulses. The modulator circuit modulates the first signal using a direct sequence spread spectrum modulation. The direct sequence spread spectrum…
Systems and methods to monitor current in switching converters
Granted: May 21, 2015
Application Number:
20150137782
Various embodiments of the invention increase current monitoring accuracy in switching converters. In particular, certain embodiments of the invention allow reduce noise associated with transients that are typically generated at transitions when power FETs are turn on and off and allow to accurately sense inductor DC current of switching converters, thereby, increase current monitoring accuracy without requiring any blanking circuitry. In certain embodiments of the invention, this is…
Systems and methods to secure industrial sensors and actuators
Granted: April 30, 2015
Application Number:
20150121507
Various embodiments of the invention provide for secure data communication in industrial process control architectures that employ a network of sensors and actuators. In various embodiments, data is secured by a secure serial transmission system that detects and authenticates IO-Link devices that are equipped with secure transceivers circuits, thereby, ensuring that non-trusted or non-qualified hardware is prevented from connecting to a network and potentially compromising system…
WAFER LEVEL LENS IN PACKAGE
Granted: April 23, 2015
Application Number:
20150109785
A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for…
SYSTEMS AND METHODS FOR DISCHARGING INDUCTORS WITH TEMPERATURE PROTECTION
Granted: March 26, 2015
Application Number:
20150085418
An integrated circuit for demagnetizing an inductive load includes a first switch to control current supplied by a voltage supply to the inductive load. A Zener diode includes an anode connected to a control terminal of the first switch and a cathode connected to the voltage supply. A second switch includes a control terminal and first and second terminals. A temperature sensing circuit is configured to sense a temperature of the first switch and to generate a sensed temperature. A…
CONTINUOUS CUFFLESS BLOOD PRESSURE MEASUREMENT USING A MOBILE DEVICE
Granted: March 12, 2015
Application Number:
20150073239
A mobile blood pressure monitor is described that includes an integrated acoustic device, an optical sensor including at least one of a light source or a pulse oximeter device, and control circuitry coupled to the integrated acoustic device and the optical sensor. Additionally, a mobile electronic device configured to measure blood pressure is described that includes a mobile system and a mobile blood pressure monitor as disclosed above. In implementations, a process for measuring blood…
Time of arrival delay cancellations
Granted: March 5, 2015
Application Number:
20150061920
The invention relates to a ranging system for measuring the distance between an interrogator and a transponder. The transponder includes: a signal receiver for receiving a challenge signal from an interrogator; a signal processor for processing the challenge signal and generating a response signal in response to the challenge signal; a buffer for storing the response signal generated by the signal processor; and a signal transmitter for sending the response signal stored in the buffer…
Integrated circuit package having surface-mount blocking elements
Granted: February 19, 2015
Application Number:
20150050777
A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or…
GLASS BASED MULTICHIP PACKAGE
Granted: February 19, 2015
Application Number:
20150049498
In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed…
METHOD FOR VARIED TOPOGRAPHIC MEMS CAP PROCESS
Granted: January 29, 2015
Application Number:
20150028455
A device includes sidewalls formed in a wafer surface, where the sidewalls descend to a recessed surface. The recessed surface generally promotes resist coverage on the wafer surface, including corners (e.g., junctions between the wafer surface and various surface topographies, such as cavities, the recessed surface, and so forth) on the wafer. In one or more implementations, a wet etching procedure is used to form the sidewalls and recessed surface. A resist material (e.g., a…
TRANSPONDER
Granted: January 22, 2015
Application Number:
20150022318
A transponder for receiving a wireless electromagnetic query signal and for transmitting a wireless electromagnetic response signal with a coil acting as a first antenna for generating a first wired electrical incoming signal from the query signal and with at least one further coil acting as an antenna for generating a further wired electrical incoming signal from the query signal, and wherein an axis of the first coil and an axis of the further coil are differently aligned in space, and…
WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO FURNISH SHOCK ABSORBER FUNCTIONALITY
Granted: January 8, 2015
Application Number:
20150008576
Semiconductor devices are described that have bump assemblies configured to furnish shock absorber functionality. In an implementation, a wafer-levelchip-scale package devices include an integrated circuit chip having an array of bump assemblies disposed over the integrated circuit chip. The array of bump assemblies comprises a plurality of first bump assemblies that include solder bumps composed at least substantially of a solder composition (i.e., solder bumps that do not include a…
Electronic circuit arrangement for receiving low frequency electromagnetic waves with an adjustable attenuator element
Granted: January 8, 2015
Application Number:
20150011171
An electronic circuit arrangement for receiving low-frequency electromagnetic waves is proposed, having an inductor (L) acting as an antenna for generating a received signal, having a first receiver (2), connected to the inductor (L), for decoding a first component of the received signal and having a second receiver (3), connected to the inductor (L), for decoding a second component of the received signal, wherein at least the second receiver (3) is connected to the inductor (L) via an…
