Direct reference subtraction system for control of optical transmitters
Granted: November 17, 2015
Patent Number:
9191104
An optical measurement system configured to determine whether an optical transmitter signal requires calibration is disclosed. In an implementation, the system includes an optical transmitter configured to emit electromagnetic radiation in limited spectrums of wavelengths at amplitudes based upon one or more transmission signals, and an optical sensor configured to detect the electromagnetic radiation in the limited spectrums of wavelengths and to generate a signal in response thereto.…
Three-dimensional chip-to-wafer integration
Granted: November 17, 2015
Patent Number:
9190391
An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold.
Single-inductor power converter with buck-boost capability
Granted: November 17, 2015
Patent Number:
9189002
A power converter includes an inductor, a first switch and a second switch. A summing module generates a voltage sum based on a ramp voltage and a first voltage based on a sensed inductor current. Error amplifier modules generate error voltages. A comparing and control signal generating module generates first and second switching signals and skip signals. A state machine module switches the first and second switches based on the first switching signal, the second switching signal and the…
Methods of forming coaxial feedthroughs for 3D integrated circuits
Granted: November 10, 2015
Patent Number:
9184113
Methods of forming coaxial feedthroughs for 3d integrated circuits that provide excellent isolation of signal paths from the substrate and from adjacent feedthroughs. One method is to form a recess in a substrate and deposit alternate layers of insulation and conductive layers and then thin the substrate to make the layers available from both sides of the substrate, with the first metal layer forming the coaxial conductor and the second metal layer forming the central conductor.…
Inductive bypass, storage and release improves buck response
Granted: November 3, 2015
Patent Number:
9178420
Various embodiments of the invention improve the dynamic response and output voltage accuracy in buck DC-DC converters. In certain embodiments, power efficiency is improved by storing and recycling energy that is otherwise lost during successive load transient events.
Transponder
Granted: November 3, 2015
Patent Number:
9177244
Proposed is a transponder for receiving a wireless electromagnetic interrogation signal and for transmitting a wireless electromagnetic response signal with a first coil acting as an antenna for generating a first wired electrical receive signal from the interrogation signal, and with at least one further coil acting as an antenna for generating a further wired electrical receive signal from the interrogation signal, wherein an axis of the first coil and an axis of the further coil are…
Systems and methods for secure access modules
Granted: November 3, 2015
Patent Number:
9177161
Various embodiments of the invention provide a strong logical link between a SAM and a secure terminal to combat SAM counterfeiting and misuse. The link is based on mutual validation methods using firmware and cryptographic protocols. Once the SAM is removed from a terminal that it has been tied to, or the link is broken by a tampering attempt of a potential intruder, the SAM and/or the terminal are disabled.
Micro-electromechanical structure with low sensitivity to thermo-mechanical stress
Granted: November 3, 2015
Patent Number:
9176157
The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of…
LDMOS with thick interlayer-dielectric layer
Granted: October 27, 2015
Patent Number:
9171916
Semiconductor devices, such as LDMOS devices, are described that include an interlayer-dielectric layer (ILD) region having a thickness of at least two and one half (2.5) microns to increase the maximum breakdown voltage. In one or more implementations, the semiconductor devices include a substrate having a source region and a drain region formed proximate to a surface of the substrate. A gate is positioned over the surface and between the source region and the drain region. An ILD…
DC-to-DC converter with adaptive dead-time control
Granted: October 27, 2015
Patent Number:
9172305
A DC-to-DC converter includes first and second switches connected to each other at a node and biased by PWM pulses. A timing module determines a first time difference between a first edge of a first signal at the node and a first edge of a second signal at a control terminal of the first switch, and a second time difference between a second edge of the first signal and a second edge of the second signal. The first and second edges of the second signal correspond to first and second edges…
Adaptive input current limiting for switch-mode chargers
Granted: October 20, 2015
Patent Number:
9166442
A system includes a voltage regulator module, a voltage comparator module, and a current limiting module. The voltage regulator module regulates an input voltage supplied by a power supply and supplies an output current to a load. The voltage comparator module compares the input voltage to a first threshold. The current limiting module decreases the output current when the input voltage decreases to less than or equal to the first threshold, decreases the output current until the input…
Daisy chain configuration for power converters
Granted: October 20, 2015
Patent Number:
9164560
A system includes a plurality of power supplies and a controller. The plurality of power supplies outputs power to a load. A serial bus connects the plurality of power supplies in a daisy chain. The controller is connected to first and last ones of the power supplies by the serial bus. The controller is connected to a management bus via a management bus interface. The controller monitors the plurality of power supplies via the serial bus. The controller transmits status information of…
Ambient light based gesture detection
Granted: October 20, 2015
Patent Number:
9163981
A gesture sensing device includes one or more sensors and a processor for processing sensed voltages output from the sensors based on ambient light and/or reflected light received by the sensors. The processor determines an ambient light level and/or a distance between the target and the sensors such that, if the ambient light level exceeds an ambient light threshold and/or the distance is less than a distance threshold, the processor determines the motion of a target relative to the…
Multi-LO band switched-core frequency mixer
Granted: October 13, 2015
Patent Number:
9160354
A frequency mixer is disclosed. In an implementation, the multi-LO band switched-core includes a single field-effect transistor (FET) ring having a first mixer core and a second mixer core. The first mixer core and the second mixer core configured to connect to a radio frequency (RF) port and an intermediate frequency (IF) port. The frequency mixer also includes a first local oscillator (LO) transformer and a second LO transformer. The first LO transformer is configured to furnish a…
Wafer-level packaged device having self-assembled resilient leads
Granted: October 13, 2015
Patent Number:
9159684
A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient…
Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
Granted: October 13, 2015
Patent Number:
9159586
A method of forming an integrated circuit (IC) package is disclosed comprising: (a) removing oxides from side surfaces of terminals of the IC package; (b) substantially covering an underside of the terminals of the IC package; and (c) forming a solder coating on the side surfaces of terminals of the IC packages while covering the underside of the terminals of the IC package. The solder coating on the side surfaces of the terminals protects the terminals from oxidation due to aging and…
Avalanche photo diode detector control systems and method
Granted: October 13, 2015
Patent Number:
9157797
An avalanche photo diode detector including an avalanche photo diode, an adjustable voltage source, a current mirror coupled to the voltage source output of the adjustable voltage source and having a current measurement output, and a processor coupled to the adjustable voltage source and the current mirror. The processor implements a process of obtaining a signal current measurement from the current mirror, computing an estimate of an input optical power level from the signal current…
Micro-gyroscope for detecting motions
Granted: October 13, 2015
Patent Number:
9157740
The invention relates to a micro-gyroscope for detecting motions relative to an X and/or Y and Z axis, particularly as a 3D, 5D, or 6D sensor. Sample masses are disposed uniformly about an anchor and can be driven radially relative to the central anchor. Anchor springs are disposed to attach the sample masses to a substrate, and these sample masses can be deflected both radially within and out of the X-Y plane. A sensor mass is disposed on one of the sample masses by means of sensor…
Maintain power signature (MPS) powered device (PD)
Granted: October 6, 2015
Patent Number:
9152161
A Maintain Power Signature (MPS) Powered Device (PD) is described. In one or more implementations, the MPS device comprises a current sensor configured to sense current flowing from Power Sourcing Equipment (PSE) to the PD. The current sense based MPS device also comprises a current generator configured to sink electrical current to prevent the PSE from removing power to the PD. Thus, the electrical current comprises a current amplitude characteristic selected based upon MPS requirements…
Mode-based secure microcontroller
Granted: October 6, 2015
Patent Number:
9152576
Various embodiments of the present invention are related to integrated circuits for processing data at a microcontroller interface. The microcontroller interfaces to a memory. The method is employed to process input data provided by the microcontroller during a memory write operation, or input data extracted from the memory during a memory read operation, respectively. A write/read control is used to indicate the memory write or read operation, and a logic address is translated to at…
