POWER LOSS PREVENTION CIRCUIT WITH MITIGATION FOR FAILED ENERGY STORAGE BANKS
Granted: October 12, 2023
Application Number:
20230324970
A power management integrated circuit (PMIC) chip provides power loss protection to an application device. The PMIC chip has several storage pins that each receives a set of storage capacitors that are charged using power from a power source during normal operation. An application device receives power from the power source during normal operation and receives power from an operational set of storage capacitors during power loss. A failing set of storage capacitors is disconnected from…
LOW-PROFILE POWER MODULE
Granted: August 24, 2023
Application Number:
20230268833
A power module has a substrate with a bottom side and a component side. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on the component side of the substrate. The power converters include output inductors that are disposed within the substrate. An end of an output inductor is connected to a switch node of a monolithic IC switch block and another end of the output inductor is connected to an output voltage node…
LLC RESONANT CONVERTER WITH DIRECT POWER TRANSFORMER
Granted: March 2, 2023
Application Number:
20230061145
An LLC resonant converter includes a transformer, a switching half-bridge circuit, a resonant circuit, and a full-bridge rectifier. Both the switching half-bridge circuit and the full-bridge rectifier are on the same side of the transformer. The switching half-bridge circuit has a pair of switches, with one of the switches being connected to the output voltage node of the converter.
TRANS-INDUCTOR VOLTAGE REGULATOR WITH AVERAGING INDUCTOR DCR CURRENT SENSING
Granted: February 16, 2023
Application Number:
20230049859
A trans-inductor voltage regulator (TLVR) has regulator blocks and transformers. Secondary windings of the transformers are connected in series with a compensation inductor to form a trans-inductor loop, which is connected to the output voltage of the TLVR instead of to ground. Primary windings of the transformers serve as output inductors of the regulator blocks. The inductance of each output inductor and the output inductance of the TLVR are input to an averaging network of an…
TRANS-INDUCTOR VOLTAGE REGULATOR WITH AVERAGING INDUCTOR DCR CURRENT SENSING
Granted: February 16, 2023
Application Number:
20230049859
A trans-inductor voltage regulator (TLVR) has regulator blocks and transformers. Secondary windings of the transformers are connected in series with a compensation inductor to form a trans-inductor loop, which is connected to the output voltage of the TLVR instead of to ground. Primary windings of the transformers serve as output inductors of the regulator blocks. The inductance of each output inductor and the output inductance of the TLVR are input to an averaging network of an…
TRANS-INDUCTOR VOLTAGE REGULATOR WITH AVERAGING INDUCTOR DCR CURRENT SENSING
Granted: February 16, 2023
Application Number:
20230049859
A trans-inductor voltage regulator (TLVR) has regulator blocks and transformers. Secondary windings of the transformers are connected in series with a compensation inductor to form a trans-inductor loop, which is connected to the output voltage of the TLVR instead of to ground. Primary windings of the transformers serve as output inductors of the regulator blocks. The inductance of each output inductor and the output inductance of the TLVR are input to an averaging network of an…
JUNCTION FIELD EFFECT TRANSISTOR WITH INTEGRATED HIGH VOLTAGE CAPACITOR
Granted: October 27, 2022
Application Number:
20220344326
Junction field effect transistors (JFETs) and related manufacturing methods are disclosed herein. A disclosed four terminal JFET includes an integrated high voltage capacitor (HVC). The JFET includes a first terminal coupled to a drain region, a second terminal coupled to the source region, a third terminal coupled to the base region, and an integrated HVC terminal coupled to an integrated HVC electrode which forms an HVC with the drain region. The JFET also includes a channel formed by…
FABRICATION OF WIDE BANDGAP DEVICES
Granted: October 20, 2022
Application Number:
20220336215
A method of fabricating a wide bandgap device includes providing a thin native substrate. An epitaxial layer is grown on a surface of the native substrate. After growing the epitaxial layer, a handle substrate is attached to the opposite surface of the native substrate by way of an interface layer. With the handle substrate providing mechanical support, wide bandgap devices are fabricated in the epitaxial layer using a low-temperature fabrication process. The handle substrate is detached…
VERTICAL TRANSISTOR STRUCTURE WITH BURIED CHANNEL AND RESURF REGIONS AND METHOD OF MANUFACTURING THE SAME
Granted: March 24, 2022
Application Number:
20220093784
The present disclosure describes vertical transistor device and methods of making the same. The vertical transistor device includes substrate layer of first conductivity type, drift layer of first conductivity type formed over substrate layer, body region of second conductivity type extending vertically into drift layer from top surface of drift layer, source region of first conductivity type extending vertically from top surface of drift layer into body region, dielectric region…
Single Sided Channel Mesa Power Junction Field Effect Transistor
Granted: February 24, 2022
Application Number:
20220059706
Junction field effect transistors (JFETs) and related manufacturing methods are disclosed herein. A disclosed JFET includes a vertical channel region located in a mesa and a first channel control region located on a first side of the mesa. The first channel control region is at least one of a gate region and a first base region. The JEFT also includes a second base region located on a second side of the mesa and extending through the mesa to contact the vertical channel region. The…
CENTRAL PROCESSING UNIT VOLTAGE RAIL THAT IS INDEPENDENT OF POWER STATE COMMANDS
Granted: January 6, 2022
Application Number:
20220004248
Voltage regulators generate voltage rails that power a central processing unit (CPU). The CPU communicates power management instructions to a power supply controller that drives the voltage regulators. The power supply controller sets a voltage level of a voltage rail generated by a voltage regulator in accordance with a power management instruction received from the CPU. The power supply controller enables the voltage regulator to operate in discontinuous conduction mode (DCM)…
INDUCTORS WITH MAGNETIC CORE PARTS OF DIFFERENT MATERIALS
Granted: October 21, 2021
Application Number:
20210327628
An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.
INDUCTORS WITH MULTIPART MAGNETIC CORES
Granted: October 21, 2021
Application Number:
20210327627
An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.
SYMMETRICAL POWER STAGES FOR HIGH POWER INTEGRATED CIRCUITS
Granted: May 14, 2020
Application Number:
20200153341
A circuit assembly for a power converter includes a substrate, power stage integrated circuit (IC) dies, and output inductors that connect switch nodes of the power stage IC dies to an output node of the power converter. The power stage IC dies are mounted on one side of the substrate and the output inductors are mounted on an opposing side of the substrate. Two output inductors go through a magnetic core. A heatsink is attached to surfaces of the power stage IC dies. A power stage IC…
SYMMETRICAL POWER STAGES FOR HIGH POWER INTEGRATED CIRCUITS
Granted: September 26, 2019
Application Number:
20190296645
A circuit assembly for a power converter includes power stage blocks and heat-dissipating substrate. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of…
SYMMETRICAL POWER STAGES FOR HIGH POWER INTEGRATED CIRCUITS
Granted: April 11, 2019
Application Number:
20190109538
A circuit assembly for a power converter includes power stage blocks. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of the substrate that is opposite…
CURRENT DETECTION AND AVERAGING CIRCUIT FOR SWITCHING POWER SUPPLIES WITH A HALF-BRIDGE SWITCH CIRCUIT TOPOLOGY
Granted: November 23, 2017
Application Number:
20170338739
A power supply includes a half-bridge circuit. The power supply further includes an output inductor connected to a switch node that is common to a high side switch and a low side switch of the half-bridge. During a turn ON time of the low side switch, a current detection circuit of the power supply samples and holds in a capacitor a valley of an inductor current flowing through the output inductor. Also during the turn ON time of the low side switch, the current detection circuit samples…
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT CHIPS
Granted: November 16, 2017
Application Number:
20170330853
An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bump is disposed on the copper structure. The surface of the copper structure has a coating of intermetallic. The copper structure can be a redistribution layer and a copper pillar that is…
MONOLITHIC INTEGRATED CIRCUIT SWITCH DEVICE WITH OUTPUT CURRENT BALANCING FOR PARALLEL-CONNECTION
Granted: June 15, 2017
Application Number:
20170170655
An electrical circuit includes a monolithic integrated circuit (IC) switch device that includes a first pin, a second pin, and a power switch that connects the first pin to the second pin through the power switch when the electrical circuit is turned ON. The monolithic IC switch device includes an adaptive safe operating area (SOA) circuit that limits allowable current through the power switch based on temperature, such as the temperature of the power switch.
DIGITALLY CALIBRATED VOLTAGE REGULATORS FOR POWER MANAGEMENT
Granted: March 23, 2017
Application Number:
20170083649
A computer provides a graphical user interface for displaying a virtual representation of a voltage regulator and for accepting a user requirement for the voltage regulator. The computer automatically determines an internal calibration setting of the voltage regulator that meets the user requirement. The computer simulates operation of the voltage regulator as calibrated with the internal calibration setting. The internal calibration setting is downloaded to the voltage regulator. A…
