MULTILAYER OBJECT AND RELEASE AGENT COMPOSITION
Granted: May 11, 2023
Application Number:
20230143007
The invention provides a laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, characterized in that the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P) (wherein Ar represents an arylene group), a cross-linking…
SLIDABLE CENTER CONSOLE PROVIDED WITH SELECTOR SWITCH
Granted: May 4, 2023
Application Number:
20230136911
A slidable center console for a vehicle includes a console actuator for changing a slide position of the center console, a selector switch provided on the center console for changing an operation mode of the vehicle, and a console adjustment switch for adjusting the slide position of the center console by using the console actuator.
SOFTWARE UPDATING DEVICE, SOFTWARE UPDATING METHOD, AND SOFTWARE UPDATE PROCESSING PROGRAM
Granted: May 4, 2023
Application Number:
20230138932
Provided is a software updating device for executing processing for updating software causing an equipment mounted on a vehicle to operate. The software updating device includes a controller that acquires the software, and controls the equipment by applying the software to the equipment. The controller includes a first storage unit that stores acquired first software and a second storage unit that stores acquired second software. In a state where no driving force is output by a power…
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
Granted: May 4, 2023
Application Number:
20230137360
A composition for forming a resist underlayer film which enables to form a flat film with a favorable coating even on a so-called stepped substrate and a small film thickness difference after embedding, and also a polymer as an important component of the composition for forming a resist underlayer film, a resist underlayer film formed using the composition for forming a resist underlayer film, and a method of producing a semiconductor device. The composition for forming a resist…
INTERNAL COMBUSTION ENGINE
Granted: May 4, 2023
Application Number:
20230137241
An internal combustion engine includes a combustion chamber, a piston a plurality of piston rings. The combustion chamber has a bore wall. The piston is configured to move relative to the bore wall. The plurality of piston rings is provided to the piston. Each of the piston rings has a main body that is circular. Each of the pistons rings further has a stopper that protrudes from the main body.
SLIDABLE CENTER CONSOLE PROVIDED WITH SELECTOR SWITCH
Granted: May 4, 2023
Application Number:
20230136911
A slidable center console for a vehicle includes a console actuator for changing a slide position of the center console, a selector switch provided on the center console for changing an operation mode of the vehicle, and a console adjustment switch for adjusting the slide position of the center console by using the console actuator.
IRRADIATED RESIN MOLDING
Granted: May 4, 2023
Application Number:
20230136856
The invention provides a resin molding and a method of producing the same in which sterilizability thereof is secured and discoloration (yellowing) thereof is reduced even when the resin molding is radiation-irradiated under anaerobic conditions (deoxidation conditions). The radiation-irradiated and packaged resin molding is primarily packaged with a packaging material having oxygen permeability and then secondarily packaged with an oxygen impermeable packaging material together with a…
SOFTWARE UPDATING DEVICE, SOFTWARE UPDATING METHOD, AND SOFTWARE UPDATE PROCESSING PROGRAM
Granted: May 4, 2023
Application Number:
20230138932
Provided is a software updating device for executing processing for updating software causing an equipment mounted on a vehicle to operate. The software updating device includes a controller that acquires the software, and controls the equipment by applying the software to the equipment. The controller includes a first storage unit that stores acquired first software and a second storage unit that stores acquired second software. In a state where no driving force is output by a power…
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
Granted: May 4, 2023
Application Number:
20230137360
A composition for forming a resist underlayer film which enables to form a flat film with a favorable coating even on a so-called stepped substrate and a small film thickness difference after embedding, and also a polymer as an important component of the composition for forming a resist underlayer film, a resist underlayer film formed using the composition for forming a resist underlayer film, and a method of producing a semiconductor device. The composition for forming a resist…
INTERNAL COMBUSTION ENGINE
Granted: May 4, 2023
Application Number:
20230137241
An internal combustion engine includes a combustion chamber, a piston a plurality of piston rings. The combustion chamber has a bore wall. The piston is configured to move relative to the bore wall. The plurality of piston rings is provided to the piston. Each of the piston rings has a main body that is circular. Each of the pistons rings further has a stopper that protrudes from the main body.
IRRADIATED RESIN MOLDING
Granted: May 4, 2023
Application Number:
20230136856
The invention provides a resin molding and a method of producing the same in which sterilizability thereof is secured and discoloration (yellowing) thereof is reduced even when the resin molding is radiation-irradiated under anaerobic conditions (deoxidation conditions). The radiation-irradiated and packaged resin molding is primarily packaged with a packaging material having oxygen permeability and then secondarily packaged with an oxygen impermeable packaging material together with a…
RADIATION SENSITIVE COMPOSITION
Granted: April 27, 2023
Application Number:
20230125270
A compound of Formula (5-1) or Formula (5-3): where R17 and R21 are each an ethyl group; R22 and R23 are each a methyl group; and R16 and R20 are each a methoxy group.
METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND PEELING COMPOSITION
Granted: April 27, 2023
Application Number:
20230131533
The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, characterized in that the remover composition contains a solvent but no salt; the solvent includes one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a…
SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELING
Granted: April 27, 2023
Application Number:
20230131428
The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L1 and L2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L1 and that of the alkyl group L2…
RESIST UNDERLAYER FILM-FORMING COMPOSITION WITH SUPPRESSED DEGENERATION OF CROSSLINKING AGENT
Granted: April 27, 2023
Application Number:
20230131253
A resist underlayer film forming composition which has high storage stability, has a low film curing start temperature, can cause the generation of a sublimated product in a reduced amount, and enables the formation of a film that is rarely eluted into a photoresist solvent; a method for forming a resist pattern using the resist underlayer film forming composition; and a method for manufacturing a semiconductor device. The resist underlayer film forming composition includes a…
CLEANING AGENT COMPOSITION AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE
Granted: April 27, 2023
Application Number:
20230129238
The invention provides a cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt, a metal corrosion inhibitor, and an organic solvent, and the metal corrosion inhibitor is formed of a C7 to C40 saturated aliphatic hydrocarbon compound monocarboxylic acid, a C7 to C40 saturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride, a C7 to C40 unsaturated aliphatic hydrocarbon compound…
VEHICLE
Granted: April 27, 2023
Application Number:
20230127851
VEHICLE A vehicle includes a vehicle frame and a vehicle body. The vehicle body is supported on the vehicle frame. The vehicle body has a cabin and a cargo box. The cabin houses one or more vehicle seats of the vehicle. The cabin has a rear wall and the cargo box has a front wall that is adjacent to the rear wall. The rear wall of the cabin and the front wall of the cargo box together define a passthrough that connects a floor of the cargo box and a floor of the cabin. The passthrough is…
ANTISENSE OLIGONUCLEOTIDE OF ATN1
Granted: April 27, 2023
Application Number:
20230127437
The invention provides an antisense oligonucleotide capable of controlling ATN1 gene expression and treating dentatorubral-pallidoluysian atrophy. An inventive compound comprises a modified oligonucleotide consisting of 8 to 80 linked nucleosides and having a nucleobase sequence including at least 8 contiguous nucleobases that are complementary to a transcript of ATN1, or a pharmacologically acceptable salt thereof.
IMMUNOREGULATORY METHOD, NUCLEIC ACID COMPOSITION FOR IMMUNOREGULATION AND USE THEREOF
Granted: April 27, 2023
Application Number:
20230126199
The invention provides a polynucleotide including at least one of (a) a sequence encoding a fusion protein including an antigen-presenting MHC molecule capable of being presented extramembranously of an extracellular vesicle; (b) a sequence encoding a fusion protein including a T cell stimulating cytokine or a subunit thereof capable of being presented extramembranously of an extracellular vesicle; (c) a sequence encoding a fusion protein including a T cell co-stimulatory molecule…
METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND STRIPPING COMPOSITION
Granted: April 27, 2023
Application Number:
20230125907
A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).
