Image sensor testing probe card
Granted: September 15, 2020
Patent Number:
10775413
A method of increasing uniformity in light from a light source at a plurality of targets of the light includes locating a plurality of movable aperture elements between the light source and the targets. Each aperture element defines an aperture through which the light passes from the light source to an associated one of the plurality of targets associated with the aperture element along a longitudinal axis of the aperture element. The method also includes moving at least one of the…
Liquid crystal on silicon panel having less diffraction
Granted: September 1, 2020
Patent Number:
10761385
A liquid crystal on silicon (LCOS) panel comprises: a silicon substrate having silicon circuit within the silicon substrate; a plurality of metal electrodes disposed on the silicon substrate, where the plurality of metal electrodes are periodically formed on the silicon substrate; a dielectric material disposed in and filling gaps between adjacent metal electrodes; and an oxide layer disposed on the plurality of metal electrodes and the dielectric material in the gaps between adjacent…
Electromagnetic interference (EMI) evaluation system for image sensors
Granted: August 25, 2020
Patent Number:
10753967
An apparatus configured to measure electromagnetic radiation coupled from an image sensor integrated circuit (IC) to a nearby cell phone antenna has an image sensor PCB with the image sensor IC on a first side and image sensor decoupling capacitors disposed on a second side, the image sensor PCB disposed within a shielding box. The apparatus also has an image processor PCB with an image processor IC on a first side and at least one image processor decoupling capacitors, the image…
CMOS image sensor with divided bit lines
Granted: August 18, 2020
Patent Number:
10750111
An image sensor includes a pixel array including a plurality of pixels. A bit line coupled to a column of pixels is separated in to a plurality of electrically portions that are coupled to corresponding portions of rows of the pixel array. A first switching circuit of a readout circuit is coupled to the bit line. A first switching circuit is configured to couple a bit line current source to the bit line to provide a DC current coupled to flow through the bit line and through the first…
Image sensor with correction of non-uniform dark current
Granted: August 18, 2020
Patent Number:
10750108
An imaging system comprises an image pixel array, a dark pixel array, and a controller. The image pixel array includes a plurality of pixel clusters adapted to generate image signals. The dark pixel array is adapted to generate one or more black reference signals corresponding to a global black level value of the imaging system. The controller includes logic that when executed by the controller causes the system to perform operations including determining local black level values for…
Endoscope having camera module and LED on flexible printed circuit
Granted: August 18, 2020
Patent Number:
10750061
An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side…
Vertical transfer gate storage for a global shutter in an image sensor
Granted: August 11, 2020
Patent Number:
10741593
A pixel cell includes a photodiode disposed in a semiconductor material layer to accumulate image charge photogenerated in the photodiode in response to incident light. A storage transistor is coupled to the photodiode to store the image charge photogenerated in the photodiode. The storage transistor includes a storage gate disposed proximate a first surface of the semiconductor material layer. The storage gate includes a pair of vertical transfer gate (VTG) portions. Each one of the…
Quality-driven dynamic frequency scaling for energy optimization of smart camera systems
Granted: August 11, 2020
Patent Number:
10739838
A smart camera system including an image sensor and a controller is presented. The image sensor generates video data that is initially at a bit rate of a pre-determined bit rate value. The controller is coupled to the image sensor to transmit the video data. The controller includes a processor operating at a clock rate of a first frequency. The processor is coupled to memory, the memory including instructions, which when executed by the controller causes the smart camera system to…
Liquid crystal on silicon device mirror metal process
Granted: August 11, 2020
Patent Number:
10739646
A reflective semiconductor device includes integrated circuitry disposed in a semiconductor layer. A first plurality of mirrors is formed in a mirror layer over the semiconductor layer, and each of the first plurality of mirrors is spaced apart from one another by at least a uniform width. A thin dielectric film layer covers sidewalls of the first plurality of mirrors and the semiconductor layer in the regions between the spaced apart first plurality of mirrors. A second plurality of…
Dram with staggered word line transitions for hybrid-bonded photosensor arrays
Granted: August 4, 2020
Patent Number:
10735682
An image sensor has multiple blocks each with multiple pixels; each block uses a separate analog-to-digital converter (ADC). The ADCs feed digitized images into an image DRAM, and the image DRAM feeds digitized images to an alignment buffer in turn providing images to an image processor. The ADCs feed digitized image data into the image DRAM in hyperlong words, using staggered, overlapping, word lines to write each hyperlong word. A method of imaging includes exposing a photosensor array…
Interposer and chip-scale packaging for wafer-level camera
Granted: August 4, 2020
Patent Number:
10734437
A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the…
Vertical overflow drain combined with vertical transistor
Granted: August 4, 2020
Patent Number:
10734434
An image sensor pixel includes a photodiode disposed in a semiconductor material to generate image charge in response to light incident on a backside of the semiconductor material, and a pinning layer disposed in the semiconducting material and coupled to the photodiode. The pixel also includes a vertical overflow drain disposed in the semiconductor material and coupled to the pinning layer such that the pinning layer is disposed between the vertical overflow drain and the photodiode. A…
Flexible printed circuit board return path design with aligned companion trace on ground plane
Granted: July 14, 2020
Patent Number:
10716206
A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible first layer and coupled to a first circuit block at a first end of the flexible PCB and coupled to a second circuit block at a second end of the flexible PCB such that the first circuit block is coupled to the second circuit block through the conductive traces. Companion traces re arranged in the flexible second layer to provide a…
Linear-logarithmic image sensor
Granted: June 16, 2020
Patent Number:
10687003
A pixel array for use in a high dynamic range image sensor includes a plurality of pixels arranged in a plurality of rows and columns in the pixel array. Each one of the pixels includes a linear subpixel and a log subpixel disposed in a semiconductor material. The linear subpixel is coupled to generate a linear output signal having a linear response, and the log subpixel is coupled to generate a log output signal having a logarithmic response in response to the incident light. A bitline…
Near-eye display device and methods with coaxial eye imaging
Granted: June 16, 2020
Patent Number:
10684477
A near-eye display device includes (a) a display unit for displaying a display image, (b) a viewing unit for presenting the display image to the eye and transmitting ambient light from an ambient scene toward the eye, and (c) an eye imaging unit including (i) an illumination module for generating at least three infrared light beams propagating along at least three different, non-coplanar directions, respectively, (ii) a first beamsplitter interface, disposed between the display unit and…
Image sensor with boosted photodiodes for time of flight measurements
Granted: June 16, 2020
Patent Number:
10684373
An image sensor including a photodiode, a first doped region, a second doped region, a first storage node, a second storage node, a first vertical transfer gate, and a second vertical transfer gate is presented. The photodiode is disposed in a semiconductor material to convert image light to an electric signal. The first doped region and the second doped region are disposed in the semiconductor material between a first side of the semiconductor material and the photodiode. The first…
Time of flight camera with photon correlation successive approximation
Granted: June 9, 2020
Patent Number:
10681295
A time of flight camera includes a light source, a first pixel, a time-to-digital converting, and a controller. The light source is configured to emit light towards an object to be reflected back to the time of flight camera as image light. The first pixel includes a photodetector to detect the image light and to convert the image light into an electric signal. The time-to-digital converter is configured to generate timing signals representative of when the light source emits the light…
Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
Granted: June 9, 2020
Patent Number:
10677964
A method for manufacturing a stepped spacer wafer for a wafer-level camera includes a step of measuring a plurality of focal lengths f1,2, . . . , N of a respective one of a plurality of lenses L1,2, . . . , N of a lens wafer. The method also includes a step of fabricating a stepped spacer wafer including (i) a plurality of apertures A1,2, . . . , N therethrough, and (ii) a plurality of thicknesses T1,2, . . . , N defining a respective thickness of the stepped spacer wafer at least…
DRAM with simultaneous read and write for multiwafer image sensors
Granted: June 2, 2020
Patent Number:
10672101
A bond-per-pixel-block image sensor has a pixel array including multiple pixel blocks with selection circuitry to couple signals to an ADC. The image sensor has an image RAM of DRAM superblocks, each superblock with multiple DRAM blocks each having tristate output driving an image RAM output bus, and data input from several of the ADCs. Each DRAM block has an address multiplexor coupled to read and write addresses. DRAM blocks of each superblock are written simultaneously with data wider…
Two stage gray code counter with a redundant bit
Granted: May 19, 2020
Patent Number:
10659055
An N bit counter includes a lower counter having a first output having M bits that operates a first counting frequency. An upper counter having a second output having N?M+L bits operates a second counting frequency. The second counting frequency is equal to the first counting frequency divided by 2(M-L). An error correction controller is coupled to receive the first and second outputs and perform operations that include comparing the L least significant bits (LSBs) of the second output…
