Method and apparatus for inspecting defects on polishing pads to be used with chemical mechanical polishing apparatus

Granted: February 27, 2003
Application Number: 20030039387
The present invention provides an apparatus and method for detecting or inspecting defects on a polishing pad for use in performing chemical mechanical polishing of a wafer. The apparatus for detecting the defects on the pad comprises a pad driving device for loading the pad thereon and moving the pad, at least one camera installed to face the pad for converting an image of the pad into an electrical signal and outputting the converted electrical signal, a digital image data acquisition…