Polishing head retaining ring tilting moment control
Granted: February 4, 2025
Patent Number:
12214469
Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring…
Isolated volume seals and method of forming an isolated volume within a processing chamber
Granted: February 4, 2025
Patent Number:
12217982
A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer…
Lid separation device for vacuum chamber
Granted: February 4, 2025
Patent Number:
12217981
Lid separators for vacuum processing chamber lid separation and vacuum processing chambers incorporating same are provided herein. In some embodiments, a lid separator for a vacuum processing chamber includes: a shaft having a first end and an opposing second end, wherein the shaft is threaded along at least a first portion of the shaft; and a contact pad having an outer diameter greater than an outer diameter of the shaft, a recess disposed in a first side of the contact pad, and a…
Localized stress modulation by implant to back of wafer
Granted: February 4, 2025
Patent Number:
12217974
Embodiments herein are directed to localized stress modulation by implanting a first side of a substrate to reduce in-plane distortion along a second side of the substrate. In some embodiments, a method may include providing a substrate, the substrate comprising a first main side opposite a second main side, wherein a plurality of features are disposed on the first main side, performing a metrology scan to the first main side to determine an amount of distortion to the substrate due to…
To an inductively coupled plasma source
Granted: February 4, 2025
Patent Number:
12217938
Disclosed herein is an apparatus for processing a substrate using an inductively coupled plasma source. An inductively coupled plasma source utilizes a power source, a shield member, and a coil coupled to the power source. In certain embodiments, the coils are arranged with a horizontal spiral grouping and a vertical extending helical grouping. The shield member, according to certain embodiments, utilizes a grounding member to function as a Faraday shield. The embodiments herein reduce…
Radio frequency source for inductively coupled and capacitively coupled plasmas in substrate processing chambers
Granted: February 4, 2025
Patent Number:
12217937
A radio frequency (RF) source may be used to generate a capacitively coupled plasma to perform a plasma-based process on a substrate in a plasma processing chamber. A controller may cause the RF source and a switching element to route an RF signal to electrodes in the pedestal that generate the plasma in the processing chamber as part of a recipe performed on a substrate during etch or deposition processes. Between processes, the controller may cause the same RF source to generate a…
Chamber component condition estimation using substrate measurements
Granted: February 4, 2025
Patent Number:
12216455
A substrate processing system includes a process chamber, one or more robot, a substrate measurement system, and a computing device. The process chamber may process a substrate that will comprise a film and/or feature after the processing. The one or more robot, to move the substrate from the process chamber to a substrate measurement system. The substrate measurement system may measure the film and/or feature on the substrate and generate a profile map of the film and/or feature. The…
Air-spaced encapsulated dielectric nanopillars for flat optical devices
Granted: February 4, 2025
Patent Number:
12216243
Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between…
MEMS resonator sensor substrate for plasma, temperature, stress, or deposition sensing
Granted: February 4, 2025
Patent Number:
12216015
Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
Methods and systems of optical inspection of electronic device manufacturing machines
Granted: February 4, 2025
Patent Number:
12215966
Implementations disclosed describe an inspection device capable of being transferred by a robot blade into a processing chamber of a manufacturing machine, the inspection device comprising an optical sensor to detect light reflected from a target located within the processing chamber, wherein the optical sensor is to output, to a processing device, a signal representative of a state of a region of a surface of the target.
Temperature control of chemical mechanical polishing
Granted: February 4, 2025
Patent Number:
12214468
A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to…
Patterning of optical device films via inkjet soluble mask, deposition, and lift-off
Granted: January 28, 2025
Patent Number:
12208637
Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing a patterned optical device film on an optical device substrate. According to certain embodiments, an inkjet deposition process is used to deposit a patterned inkjet coating layer on the optical device substrate. A deposition process may then be used to deposit an optical device material on the patterned inkjet…
Flowable chemical vapor deposition of metal oxides
Granted: January 28, 2025
Patent Number:
12211736
Exemplary deposition methods may include introducing a vapor of a metal alkoxide into a processing volume of a semiconductor processing chamber. A substrate defining a trench may be housed in the processing volume. The methods may include condensing the vapor into a liquid metal alkoxide within the trench on the substrate. The methods may include forming a plasma external to the processing volume of the semiconductor processing chamber. The methods may include introducing…
Electrostatic chuck design with improved chucking and arcing performance
Granted: January 28, 2025
Patent Number:
12211728
Aspects of the present disclosure relate to one or more implementations of a substrate support for a processing chamber. In one implementation, a substrate support includes a body having a center, and a support surface on the body configured to at least partially support a substrate. The substrate support includes a first angled wall that extends upward and radially outward from the support surface, and a first upper surface disposed above the support surface. The substrate support also…
Spatial pattern loading measurement with imaging metrology
Granted: January 28, 2025
Patent Number:
12211717
A method includes identifying first structure data of a first region of a substrate and receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber. The method further includes determining, based on the optical metrology data and the first structure data, a first growth rate of the first region of the substrate associated with the one or more substrate deposition processes. The method further includes predicting,…
System for automatic tumor detection and classification
Granted: January 28, 2025
Patent Number:
12211296
Certain aspects of the present disclosure provide techniques for automatically detecting and classifying tumor regions in a tissue slide. The method generally includes obtaining a digitized tissue slide from a tissue slide database and determining, based on output from a tissue classification module, a type of tissue of shown in the digitized tissue slide. The method further includes determining, based on output from a tumor classification model for the type of tissue, a region of…
Sealing member with lip seal
Granted: January 28, 2025
Patent Number:
12209663
A sealing member includes a monolithic body including a first portion adjoining a second portion. The first portion forms part of a circle. The second portion includes first and second lobes. Each lobe adjoins the first portion with a concave surface. In one example, each lobe includes a rounded tip, and a convex surface extends from one rounded tip to the other rounded tip.
Nanofiltration for wafer rinsing
Granted: January 28, 2025
Patent Number:
12209325
The present technology includes methods for rinsing an electroplating apparatus, a component thereof, and/or a substrate. The method includes removing at least a portion of a bath solution having a first pH from an electroplating bath. The method includes filtering the removed bath solution through a nanofiltration membrane, forming a permeating containing a recycled rinse agent, and a retentate. The method includes transferring the recycled rinse agent to the one or more nozzles and…
Zone-controlled rare-earth oxide ALD and CVD coatings
Granted: January 28, 2025
Patent Number:
12209307
Disclosed herein is a rare-earth oxide coating on a surface of an article with one or more interruption layers to control crystal growth and methods of its formation. The coating may be deposited by atomic layer deposition and/or by chemical vapor deposition. The rare-earth oxides in the coatings disclosed herein may have an atomic crystalline phase that is different from the atomic crystalline phase or the amorphous phase of the one or more interruption layers.
Apparatus for providing a liquefied material, dosage system and method for dosing a liquefied material
Granted: January 28, 2025
Patent Number:
12209303
A vapor deposition apparatus is provided. The vapor deposition apparatus includes a tank for providing a liquefied material, a first unit having an alterable first volume, the first unit including a first actuator and including a first line to be in fluid communication with the tank. Further, the vapor deposition apparatus includes a second unit having an alterable second volume, the second unit including a second actuator and including a second line to be in fluid communication with the…
