STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
Granted: June 2, 2011
Application Number:
20110128029
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of…
METHOD AND APPARATUS FOR MULTILAYER SUPPORT SUBSTRATE
Granted: March 3, 2011
Application Number:
20110050265
Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some…
METHOD AND APPARATUS FOR THERMALLY CONDITIONING PROBE CARDS
Granted: December 30, 2010
Application Number:
20100327891
Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the…
METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM
Granted: October 28, 2010
Application Number:
20100271062
Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some…
Method and apparatus for Terminating A Test Signal Applied To Multiple Semiconductor Loads Under Test
Granted: October 7, 2010
Application Number:
20100253374
Apparatus for terminating a test signal applied to multiple semiconductor loads under test is described—for example apparatus for interfacing a test signal between a tester and a semiconductor device under test (DUT). In some examples, a probe card assembly may include at least one probe substrate each having test probes configured to contact test features of a DUT; a wiring substrate, coupled to the at least one probe substrate, having a connector configured for coupling with a source…
BIASED GAP-CLOSING ACTUATOR
Granted: July 1, 2010
Application Number:
20100164323
A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in a desired direction with respect to the stator. The non-capacitive bias is different from a capacitive force generated between the first and second electrodes when the gap-closing actuator is in operation.
MICROSPRING ARRAY HAVING REDUCED PITCH CONTACT ELEMENTS
Granted: June 10, 2010
Application Number:
20100141290
Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining…
Process For Manufacturing Contact Elements For Probe Card Assembles
Granted: June 10, 2010
Application Number:
20100140793
A process for making contact elements for a probe card assembly includes steps of forming a first continuous trench in a substrate along a first direction, and forming simultaneously a plurality of tip structures adjacent one to another in the first continuous trench in a second direction substantially normal to the first direction, each of the tip structures being part of, or adapted to be part of at least one corresponding contact element capable of forming an electrical contact with a…
METHOD AND APPARATUS FOR PROVIDING A TESTER INTEGRATED CIRCUIT FOR TESTING A SEMICONDUCTOR DEVICE UNDER TEST
Granted: April 1, 2010
Application Number:
20100079159
Methods and apparatus for providing a tester integrated circuit (IC) for testing a semiconductor device under test (DUT) are described. Examples of the invention can relate to an apparatus for testing a semiconductor device under test (DUT). In some examples, the apparatus can include an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic…
Method And Apparatus For Testing Semiconductor Devices With Autonomous Expected Value Generation
Granted: February 25, 2010
Application Number:
20100050029
Method and apparatus for testing semiconductor devices with autonomous expected value generation is described. Examples of the invention can relate to apparatus for interfacing a tester and a semiconductor device under test (DUT). An apparatus can include output processing logic configured to receive test result signals from the DUT responsive to testing by the tester, the output processing logic voting a logic value of a majority of the test result signals as a correct logic value; and…
PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES
Granted: February 18, 2010
Application Number:
20100039133
A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first…
PROBE CARD THERMAL CONDITIONING SYSTEM
Granted: November 26, 2009
Application Number:
20090289050
Embodiments of apparatus for thermally conditioning probe cards prior to use in a testing system are provided herein. In some embodiments, a probe card thermal conditioning system may include an enclosure configured to support a probe card and a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober. The heat transfer element may be a heating and/or cooling element. A controller may be provided for…
MULTI-STAGE SPRING SYSTEM
Granted: October 22, 2009
Application Number:
20090261517
Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and…
SELF-MONITORING SWITCH
Granted: October 22, 2009
Application Number:
20090260962
Methods and apparatus for switching electrical signals are provided herein. In some embodiments a smart switch is provided, the smart switch may include a switch having a wipe capability; a monitor coupled to the switch for monitoring a performance characteristic thereof; and a controller configured to provide a stepped change in wipe applied by the switch between closing cycles thereof in response to the monitored performance characteristic. In some embodiments, an electronic device may…
SWITCH FOR USE IN MICROELECTROMECHANICAL SYSTEMS (MEMS) AND MEMS DEVICES INCORPORATING SAME
Granted: October 22, 2009
Application Number:
20090260960
Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings…
Self-Referencing Voltage Regulator
Granted: October 8, 2009
Application Number:
20090251123
A voltage regulator includes an input terminal for receiving a power input having a first voltage level, and an output terminal for generating a power output. A reference signal having a second voltage level is derived from the first voltage level adjusted with a predetermined offset value for controlling the power output to be at a third voltage level proportional to the second voltage level.
METHOD AND APPARATUS FOR PROCESSING FAILURES DURING SEMICONDUCTOR DEVICE TESTING
Granted: September 17, 2009
Application Number:
20090235131
Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first failures of failures detected on output pins of the DUT during a test for storage in the memory.
Method And Apparatus For Designing A Custom Test System
Granted: September 10, 2009
Application Number:
20090224793
Methods, apparatus, and computer readable media for designing a custom test system are described. Examples of the invention can relate to a method of generating test system software for a semiconductor test system. In some examples, a method can include obtaining a configuration of the semiconductor test system, the configuration including a description of a device under test (DUT) and a description of test hardware; and generating an application programming interface (API) specific to…
APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES
Granted: August 20, 2009
Application Number:
20090206860
A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting…
Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
Granted: June 25, 2009
Application Number:
20090164931
Methods, apparatus, and computer readable media for managing test result data generated by a semiconductor test system are described. Examples of the invention can relate to managing test result data generated by a semiconductor test system. In some examples, test result data is obtained from the semiconductor test system responsive to testing of a device under test (DUT). The test result data is processed for storage in a relational database using an interface generated in part based on…
