STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
Granted: April 30, 2009
Application Number:
20090108861
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the…
Method And Apparatus For Testing Devices Using Serially Controlled Intelligent Switches
Granted: April 2, 2009
Application Number:
20090085590
Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.
Method And Apparatus For Testing Devices Using Serially Controlled Resources
Granted: March 26, 2009
Application Number:
20090079448
Methods and apparatus for testing devices using serially controlled resources have been described. Examples of the invention can relate to an apparatus for testing a device under test (DUT). In some examples, an apparatus can include an integrated circuit (IC) having a serialized input coupled to test circuits, the test circuits selectively communicating test signals with the DUT responsive to a test control signal on the serialized input.
REDUCED SCRUB CONTACT ELEMENT
Granted: March 26, 2009
Application Number:
20090079455
Embodiments of resilient contact elements and methods for fabricating and using same are provided herein. In one embodiment, a resilient contact element includes a lithographically formed resilient beam having a plurality of openings disposed laterally therethrough; and a tip disposed proximate a first end of the beam, the tip and the beam together configured to electrically probe a device to be tested.
Making And Using Carbon Nanotube Probes
Granted: March 12, 2009
Application Number:
20090066352
Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically…
REINFORCED CONTACT ELEMENTS
Granted: October 2, 2008
Application Number:
20080238467
Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe an unpackaged semiconductor device to be tested, the resilient element having a first end and an opposing second end; and a reinforcement member having a first end affixed to the resilient element at the first end thereof or at a point disposed between the first and the second…
STIFFENING CONNECTOR AND PROBE CARD ASSEMBLY INCORPORATING SAME
Granted: September 25, 2008
Application Number:
20080231258
A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.
APPARATUS FOR TESTING DEVICES
Granted: August 7, 2008
Application Number:
20080186040
Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
Granted: July 3, 2008
Application Number:
20080157791
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of…
RESILIENT CONTACT ELEMENT AND METHODS OF FABRICATION
Granted: July 3, 2008
Application Number:
20080157799
Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central…
STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
Granted: July 3, 2008
Application Number:
20080157790
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the…
ROTATING CONTACT ELEMENT AND METHODS OF FABRICATION
Granted: July 3, 2008
Application Number:
20080157789
Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
ELECTRICAL GUARD STRUCTURES FOR PROTECTING A SIGNAL TRACE FROM ELECTRICAL INTERFERENCE
Granted: June 19, 2008
Application Number:
20080143358
A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating material and at least a portion of electrical guard conductors disposed on the component of the probe card assembly. Each signal conductor can be disposed between a pair of the guard conductors. The probe card assembly can…
REINFORCED CONTACT ELEMENTS
Granted: June 19, 2008
Application Number:
20080143359
Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe a device to be tested, the resilient element having a first end and an opposing second end; and a reinforcement member having a first end affixed to the resilient element at the first end thereof or at a point disposed between the first and the second ends of the resilient…
CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME
Granted: May 22, 2008
Application Number:
20080116927
Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which…
Method And Apparatus For Providing Active Compliance In A Probe Card Assembly
Granted: May 1, 2008
Application Number:
20080100312
A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.
METHOD AND APPARATUS FOR INDIRECT PLANARIZATION
Granted: April 3, 2008
Application Number:
20080079449
Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force…
AC coupled parameteric test probe
Granted: December 27, 2007
Application Number:
20070296435
A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can…
Sawing tile corners on probe card substrates
Granted: December 20, 2007
Application Number:
20070290705
A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being…
Stacked Guard Structures
Granted: September 6, 2007
Application Number:
20070205780
Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.
