Systems and methods for electrically testing electromigration in an electromigration test structure
Granted: December 25, 2018
Patent Number:
10161994
Systems and methods for electrically testing electromigration in an electromigration test structure are disclosed herein. The systems include a voltage control portion, a current control portion, and a current regulating structure. The systems further include an electric current detector, a first system connection, and a second system connection. The systems also include a voltage detector, and a controller. In some embodiments of the methods, a voltage control portion regulates a…
Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates
Granted: November 20, 2018
Patent Number:
10132833
A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. In some configurations, the probe assembly can include one or more…
Probe head assemblies and probe systems for testing integrated circuit devices
Granted: November 6, 2018
Patent Number:
10120020
Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting…
High voltage chuck for a probe station
Granted: August 28, 2018
Patent Number:
10062597
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges
Granted: August 28, 2018
Patent Number:
10060963
Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe systems are programmed to perform the methods. The storage media include computer-readable instructions that direct a probe system to perform the methods.
Shielded probe systems
Granted: August 28, 2018
Patent Number:
10060950
Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the…
Probes with programmable motion
Granted: June 26, 2018
Patent Number:
10006938
The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body moves in the guide hole in response to a force on a tip of the probe. As the patterned region rides the contact region, the tip moves in a lateral pattern that is a function of the surface(s) of the patterned region.
Floating nest for a test socket
Granted: May 1, 2018
Patent Number:
9958476
A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test…
Wiring substrate with filled vias to accommodate custom terminals
Granted: January 16, 2018
Patent Number:
9869697
A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal…
Non-linear vertical leaf spring
Granted: July 11, 2017
Patent Number:
9702904
An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first…
Automated attaching and detaching of an interchangeable probe head
Granted: June 27, 2017
Patent Number:
9689915
A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while…
Probe card assembly for testing electronic devices
Granted: March 7, 2017
Patent Number:
9588139
A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can…
Wiring substrate with filled vias to accommodate custom terminals
Granted: December 20, 2016
Patent Number:
9523715
A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal…
Multiple contact probes
Granted: April 19, 2016
Patent Number:
9316670
The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.
Probe retention arrangement
Granted: April 12, 2016
Patent Number:
9310428
A retention arrangement that includes one or more templates for securing and aligning probes for testing a device under test.
Vertical probe array arranged to provide space transformation
Granted: March 1, 2016
Patent Number:
9274143
Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less…
Hybrid electrical contactor
Granted: January 5, 2016
Patent Number:
9229029
An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.
Probes with offset arm and suspension structure
Granted: September 1, 2015
Patent Number:
9121868
A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a…
Layered probes with core
Granted: August 4, 2015
Patent Number:
9097740
A probe for testing an electrical device under test. The probe has at least two outer layers and a core layer that is highly conductive. The core layer is disposed between the outer layers.
Attachment of an electrical element to an electronic device using a conductive material
Granted: July 14, 2015
Patent Number:
9081037
An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach…
