Testing techniques for through-device vias
Granted: November 25, 2014
Patent Number:
8896336
Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair…
Method and apparatus for testing devices using serially controlled intelligent switches
Granted: October 28, 2014
Patent Number:
8872534
Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.
Wafer test cassette system
Granted: October 28, 2014
Patent Number:
8872532
Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.
Elastic encapsulated carbon nanotube based electrical contacts
Granted: October 28, 2014
Patent Number:
8872176
Contacts of an electrical device can be made of carbon nanotube columns. Contact tips can be disposed at ends of the columns. The contact tips can be made of an electrically conductive paste applied to the ends of the columns and cured (e.g., hardened). The paste can be applied, cured, and/or otherwise treated to make the contact tips in desired shapes. The carbon nanotube columns can be encapsulated in an elastic material that can impart the dominant mechanical characteristics, such as…
Fine pitch guided vertical probe array having enclosed probe flexures
Granted: September 9, 2014
Patent Number:
8829937
Probes suitable for use with densely packed fine-pitch 2-D contact arrays are provided by use of an electrically insulating guide plate in connection with vertical probes, where the vertical probes have probe flexures that are either vertically folded sections, or coils having a horizontal axis. Preferably, the probes are configured such that the probe flexures are inside the guide plate holes, and the parts of the probes extending past the guide plate are relatively rigid. This…
Methods and apparatuses for dynamic probe adjustment
Granted: July 15, 2014
Patent Number:
8781779
An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of…
Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
Granted: June 24, 2014
Patent Number:
8756802
A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
Probe card stiffener with decoupling
Granted: May 27, 2014
Patent Number:
8736294
A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can…
Pre-aligner search
Granted: April 22, 2014
Patent Number:
8706289
Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first vacuum suction between the warped flexible wafer and the first mechanism. The warped flexible wafer is positioned to define a gap between the warped flexible wafer and the second mechanism. Methods and systems for closing the gap incrementally between the warped flexible wafer and the second…
Fuel cell using carbon nanotubes
Granted: April 15, 2014
Patent Number:
8697301
A fuel cell comprises an anode, a cathode, and a proton exchange membrane. The anode and cathode can include a catalyst layer which includes a plurality of generally aligned carbon nanotubes. Methods of making a fuel cell are also disclosed.
Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
Granted: January 28, 2014
Patent Number:
8638113
A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive…
Multi-stage spring system
Granted: September 10, 2013
Patent Number:
8528885
Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and…
Compliance control methods and apparatuses
Granted: August 27, 2013
Patent Number:
8519728
Methods and apparatuses for modifying a stage position and measuring at least one parameter of a motor connected with a stage during a commanded stage position are described. In one embodiment of one aspect of the invention, the motor is configured to move the stage in a first direction in response to the at least one parameter and determine whether the at least one parameter is within a threshold range.
Apparatus and method of testing singulated dies
Granted: August 20, 2013
Patent Number:
8513969
An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
Method and apparatus for providing active compliance in a probe card assembly
Granted: August 20, 2013
Patent Number:
8513965
A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.
Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby
Granted: August 20, 2013
Patent Number:
8513942
A probe head can comprise a substrate and electrically conductive structures extending from opposite surfaces of the substrate. The probe head can be made by forming frame structures each comprising a frame to which a row of the conductive structures is coupled. The frame structures can be placed in a stack. A compressible shim or a curable adhesive can be provided between adjacent frames in the stack to control a distance between the contact ends of the conductive structures in adjacent…
Space transformers employing wire bonds for interconnections with fine pitch contacts
Granted: August 6, 2013
Patent Number:
RE44407
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch…
Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
Granted: July 16, 2013
Patent Number:
8485418
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various…
Wiring substrate with customization layers
Granted: July 2, 2013
Patent Number:
8476538
One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically…
Probe element having a substantially zero stiffness and applications thereof
Granted: April 23, 2013
Patent Number:
8427186
A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to…
