Contact length trimming or vernier resistor trimming of a semiconductor laser source contact to change the source applied current density and resulting operational wavelength
Granted: January 27, 2005
Application Number:
20050018720
A laser source or a plurality of laser sources in a photonic integrated circuit (PIC) are provided with an electrical contact that is either segmented or is connected to a series of vernier resistor segments for supply of current to operate the laser source. In either case, at least one segment of the laser contact or at least one vernier resistor segment can be trimmed in order to vary the amount of current supplied to the laser source resulting in a change to its current density and,…
Method of operating an array of laser sources integrated in a monolithic chip or in a photonic integrated circuit (PIC)
Granted: January 27, 2005
Application Number:
20050018721
A method of operating an array of laser sources integrated as an array in a single monolithic chip where the steps include designing the laser sources to have different target emission wavelengths so that together they form a spectral emission wavelength grid, coupling outputs from the laser sources to an array of gain/loss elements also integrated on the single monolithic chip, one each receiving the output from a respective laser source; and adjusting the outputs with the gain/loss…
Method of tuning optical components integrated on a monolithic chip
Granted: January 20, 2005
Application Number:
20050013330
A method of tuning optical components integrated on a monolithic chip, such as an optical transmitter photonic integrated circuit (TxPIC), is disclosed where a group of first optical components are each fabricated to have an operating wavelength approximating a wavelength on a standardized or predetermined wavelength grid and are each included with a local wavelength tuning component also integrated in the chip. Each of the first optical components is wavelength tuned through their local…
Method of tuning integrated laser sources with integrated wavelength tuning elements on the same substrate or in a monolithic photonic integrated circuit (PIC)
Granted: January 20, 2005
Application Number:
20050013331
A method of operating an array of integrated laser sources formed as an integrated array on a single substrate in a photonic integrated circuit (PIC) where the laser sources are designed for operation at different targeted emission wavelengths which, in toto, at least approximate a grid of spatial emission wavelengths. A first wavelength tuning element is associated with each laser source and is adjusted over time so that each laser source maintains its targeted emission wavelength. As…
Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)
Granted: January 20, 2005
Application Number:
20050013332
A method and apparatus operates an array of laser sources as an integrated array on a single substrate or as integrated in an optical transmitter photonic integrated circuit (TxPIC) maintaining the emission wavelengths of such integrated laser sources at their targeted emission wavelengths or at least to more approximate their desired respective emission wavelengths. Wavelength changing elements may accompany the laser sources to bring about the change in their operational or emission…
Optical probe and method of testing employing an interrogation beam or optical pickup
Granted: January 20, 2005
Application Number:
20050014300
An optical probe and a method for testing an optical chip or device, such as an photonic integrated circuit (PIC), to provide for testing of such devices or circuits while they are still in their in-wafer form and is accomplished by using a an optical probe for interrogation of the circuit where an access is provided in the wafer to one or more of such in-wafer devices or circuits. As one example, the interrogation may be an interrogation beam provided at the access input to the in-wafer…
Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
Granted: December 23, 2004
Application Number:
20040258422
A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity…
Electrical isolation of optical components in photonic integrated circuits (PICs)
Granted: November 4, 2004
Application Number:
20040218850
A method of electrically isolating and operating electro-optical components integrated in a monolithic semiconductor photonic chip, such as an EML or PIC chip. A bias, VC, is applied to the isolation region so that any parasitical current path developed between adjacent active or passive optical components, now separated by an isolation region, is established through the electrical isolation region and clamped to the bias, VC. The applied bias, VC, may be a positive bias, a negative…
