Method of tuning integrated laser sources with integrated wavelength tuning elements on the same substrate or in a monolithic photonic integrated circuit (PIC)
Granted: January 20, 2005
Application Number:
20050013331
A method of operating an array of integrated laser sources formed as an integrated array on a single substrate in a photonic integrated circuit (PIC) where the laser sources are designed for operation at different targeted emission wavelengths which, in toto, at least approximate a grid of spatial emission wavelengths. A first wavelength tuning element is associated with each laser source and is adjusted over time so that each laser source maintains its targeted emission wavelength. As…
Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)
Granted: January 20, 2005
Application Number:
20050013332
A method and apparatus operates an array of laser sources as an integrated array on a single substrate or as integrated in an optical transmitter photonic integrated circuit (TxPIC) maintaining the emission wavelengths of such integrated laser sources at their targeted emission wavelengths or at least to more approximate their desired respective emission wavelengths. Wavelength changing elements may accompany the laser sources to bring about the change in their operational or emission…
Optical probe and method of testing employing an interrogation beam or optical pickup
Granted: January 20, 2005
Application Number:
20050014300
An optical probe and a method for testing an optical chip or device, such as an photonic integrated circuit (PIC), to provide for testing of such devices or circuits while they are still in their in-wafer form and is accomplished by using a an optical probe for interrogation of the circuit where an access is provided in the wafer to one or more of such in-wafer devices or circuits. As one example, the interrogation may be an interrogation beam provided at the access input to the in-wafer…
Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
Granted: December 23, 2004
Application Number:
20040258422
A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity…
Electrical isolation of optical components in photonic integrated circuits (PICs)
Granted: November 4, 2004
Application Number:
20040218850
A method of electrically isolating and operating electro-optical components integrated in a monolithic semiconductor photonic chip, such as an EML or PIC chip. A bias, VC, is applied to the isolation region so that any parasitical current path developed between adjacent active or passive optical components, now separated by an isolation region, is established through the electrical isolation region and clamped to the bias, VC. The applied bias, VC, may be a positive bias, a negative…
