SYSTEMS AND METHODS TO IMPROVE SPATIAL RESOLUTION ON BACK AND FORTH SCANNING DISPLAY DEVICES
Granted: September 12, 2013
Application Number:
20130235266
Methods, systems and devices described herein improve vertical resolution at sides of a four cornered image produced by a scanning projector display device. In accordance with an embodiment, a first plurality of frames (e.g., odd frames) of the image are scanned back and forth from side to side starting at a first line level, in one of the corners. Additionally, a second plurality of frames (e.g., even frames) of the image are scanned back and forth from side to side, starting at a…
DISCRETE MULTI-TONE SYSTEMS FOR HALF-DUPLEX IP LINKS
Granted: August 29, 2013
Application Number:
20130223550
A DMT system for a half-duplex two-way link carries Internet protocol encoded video stream on a coaxial cable that also carries a baseband rendition of the same video stream. A plurality of downlink symbols modulated on a subband of subcarriers in a downlink signal are decoded. The symbols may carry data encoded on a subband using a constellation of QAM symbols assigned to the subband. Other subbands may be associated with different QAM constellations. Lower-order constellations of QAM…
Image Processing Apparatus and Camera System
Granted: August 29, 2013
Application Number:
20130222532
An image processing apparatus or camera system comprises an image sensor 1, a geometrical position calculation device 6 for performing predetermined correction of a distortion, a first address table 10 for storing information correlating an input side address based on the calculation results of the geometrical position calculation device 6 to an output side address as a reference, a sort unit 11 for sorting the output side addresses according to the input side addresses, a second address…
OPTOELECTRONIC APPARATUSES WITH POST-MOLDED REFLECTOR CUPS AND METHODS FOR MANUFACTURING THE SAME
Granted: August 29, 2013
Application Number:
20130221380
A method for manufacturing a plurality of optoelectronic apparatuses include attaching bottom surfaces of a plurality of packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between each POSD and its one or more neighboring POSD(s). A light reflective molding compound is molded around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for…
CONFIGURABLE PHOTO DETECTOR CIRCUIT
Granted: August 22, 2013
Application Number:
20130214133
A configurable photo detector circuit comprises a photo detector array including a plurality of photo detectors coupled to a plurality of amplifiers. A method for programming a detection pattern of the configurable photo detector circuit comprises selecting a first detection pattern for the photo detector array, generating first signals to create the first selected detection pattern, and applying the first generated signals to the photo detector circuit to implement the first selected…
OPTICAL PROXIMITY SENSORS USING ECHO CANCELLATION TECHNIQUES TO DETECT ONE OR MORE OBJECTS
Granted: August 15, 2013
Application Number:
20130208257
An optical sensor includes a driver, light detector and echo canceller. The driver is adapted to selectively drive a light source. The light detector is adapted to produce a detection signal indicative of an intensity of light detected by the light detector. The echo canceller is adapted to produce an echo cancellation signal that is combined with the detection signal produced by the light detector to produce an echo cancelled detection signal having a predetermined target magnitude…
LED DRIVER SYSTEM WITH DIMMER DETECTION
Granted: August 15, 2013
Application Number:
20130207555
An LED driver system including an input receiving a rectified AC conductive angle modulated voltage on a rectified node, a converter, a low-pass filter, and AC detector, and a driver network. The converter is to the rectified node and includes a power switching device coupled to a switching node, in which the power switching device is controlled to convert the rectified AC conductive angle modulated voltage to an output voltage and output current. The low-pass filter is configured to…
OPTOELECTRONIC APPARATUSES AND METHODS FOR MANUFACTURING OPTOELECTRONIC APPARATUSES
Granted: August 15, 2013
Application Number:
20130207126
A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding…
PACKAGED SEMICONDUCTOR DEVICES, AND RELATED METHODS AND SYSTEMS
Granted: July 25, 2013
Application Number:
20130187260
A packaged semiconductor device includes at least first and second lead-fingers. A molded structure forms a cavity and is molded around portions of each of the first and second lead-fingers to thereby mechanically attach each of the first and second lead-fingers to the molded structure. A semiconductor structure (e.g., a IC, chip or die) is attached within the cavity. First and second bond wires respectively providing electrical connections between the semiconductor structure and the…
POWER OVER COAXIAL CABLE
Granted: July 25, 2013
Application Number:
20130187445
An image communication system includes a coaxial cable having first and second ends. A monitor station is coupled to the first end and a camera is coupled to the second end. The monitor station provides power to the camera through the cable, while the cable is also used to carry communication signals transmitted by the camera to the monitor station. The image communication system includes a first active inductor coupled to the first end and a second active inductor coupled to the second…
PACKAGE LEADFRAME FOR DUAL SIDE ASSEMBLY
Granted: July 18, 2013
Application Number:
20130181332
Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance interconnect and good current carrier between the bondpads on one device or between the bondpads on different devices above and/or below the leadframe.
VOLTAGE CONVERTER AND SYSTEMS INCLUDING SAME
Granted: June 27, 2013
Application Number:
20130164896
A voltage converter includes an output circuit having a high side device and a low side device which can be formed on a single die (i.e. a “PowerDie”) and connected to each other through a semiconductor substrate. Both the high side device and the low side device can include lateral diffused metal oxide semiconductor (LDMOS) transistors. Because both output transistors include the same type of transistors, the two devices can be formed simultaneously, thereby reducing the number of…
METHODS OF FORMING A SEMICONDUCTOR DEVICE
Granted: June 20, 2013
Application Number:
20130157416
A method and structure for a semiconductor device, the device including a handle wafer, a diamond layer formed directly on a front side of the handle wafer, and a thick oxide layer formed directly on a back side of the handle wafer, the oxide of a thickness to counteract tensile stresses of the diamond layer. Nitride layers are formed on the outer surfaces of the diamond layer and thick oxide layer and a polysilicon is formed on outer surfaces of the nitride layers. A device wafer is…
MULTIPLE PHASE SWITCHING REGULATOR WITH PHASE CURRENT SHARING
Granted: June 20, 2013
Application Number:
20130154585
A phase current sharing network that adjusts operation of a current mode multiphase switching regulator in which the phase current sharing network includes multiple synthetic ripple networks and a current share network. The regulator develops phase currents including ripple currents through corresponding phase inductors as controlled by corresponding pulse control signals. Each synthetic ripple networks develops a corresponding ripple voltage that simulates a corresponding phase ripple…
ISOLATED EPITAXIAL MODULATION DEVICE
Granted: June 20, 2013
Application Number:
20130154008
An isolated epitaxial modulation device comprises a substrate; a barrier structure formed on the substrate; an isolated epitaxial region formed above the substrate and electrically isolated from the substrate by the barrier structure; a semiconductor device, the semiconductor device located in the isolated epitaxial region; and a modulation network formed on the substrate and electrically coupled to the semiconductor device. The device also comprises a bond pad and a ground pad. The…
SYSTEM AND METHOD OF FEED FORWARD FOR BOOST CONVERTERS WITH IMPROVED POWER FACTOR AND REDUCED ENERGY STORAGE
Granted: June 13, 2013
Application Number:
20130148396
A controller and controlling method is disclosed for a boost converter. The controller includes a first node for receiving an output sense signal indicative of an output DC voltage, a second node for receiving a boost current sense signal indicative of current through an inductor of the boost converter, a first combiner which provides an error signal based on a difference between the output sense signal and a reference signal, an integrator which integrates the error signal and which…
SYSTEMS AND METHODS FOR CABLE EQUALIZATION
Granted: June 13, 2013
Application Number:
20130148027
Provided herein are methods and systems that provide automatic compensation for frequency attenuation of a video signal transmitted over a cable. In accordance with an embodiment, a system includes an equalizer and a compensation controller. The equalizer receives a video signal that was transmitted over a cable, provides compensation for frequency attenuation that occurred during the transmission over the cable, and outputs a compensated video signal. The compensation controller…
CONTROL SYSTEM AND METHOD FOR SHARED INDUCTOR REGULATOR
Granted: June 6, 2013
Application Number:
20130141070
A control system and method for a shared inductor regulator. The regulator includes an inductor and multiple switches to selectively couple the inductor to output, reference and charge nodes. The charge node may be coupled to a battery. An input switch may be included to selectively couple the inductor to a source node. A controller controls the switches to regulate output voltage, charge current, and a source voltage when provided. The inductor current is sensed and used to regulate the…
SYSTEM AND METHOD OF MAINTAINING GAIN LINEARITY OF VARIABLE FREQUENCY MODULATOR
Granted: May 23, 2013
Application Number:
20130127557
A variable frequency modulator including a compensation network, first and second pulse control networks and a linearity controller. The compensation network is configured to provide a compensation signal indicative of an output load condition. The first pulse control network is configured to initiate pulses on a pulse control signal and to adjust operating frequency based on changes of the compensation signal. The second pulse control network is configured to terminate the pulses on the…
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
Granted: May 23, 2013
Application Number:
20130130445
A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation…
