Interfacing application programs and motion sensors of a device
Granted: November 7, 2017
Patent Number:
9811174
Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is…
Capacitive sensing structure with embedded acoustic channels
Granted: November 7, 2017
Patent Number:
9809451
A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
Device and method for sensor calibration
Granted: October 31, 2017
Patent Number:
9804007
A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.
Method for MEMS structure with dual-level structural layer and acoustic port
Granted: October 31, 2017
Patent Number:
9802815
A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive…
Method and apparatus for using map information aided enhanced portable navigation
Granted: October 24, 2017
Patent Number:
9797732
This disclosure is directed to enhancing the navigation solution of a portable device using map information. Sensor data for the portable device may be used to derive a navigation solution. Position information for the device may be estimated using the navigation solution. Map information for an area encompassing a current location of the user may also be obtained. Multiple hypotheses regarding possible positions of the portable device may be generated using the estimated position…
Method and apparatus for determination of misalignment between device and vessel using acceleration/deceleration
Granted: October 24, 2017
Patent Number:
9797727
The present disclosure relates to a method and apparatus for determining the misalignment between a device and a platform (such as for example a vessel or vehicle) using acceleration and/or deceleration of the platform, wherein the device can be strapped or non-strapped to the platform, wherein in case of non-strapped the mobility of the device may be constrained or unconstrained within the platform. In case of non-strapped, the device may be moved or tilted to any orientation within the…
CMOS-MEMS-CMOS platform
Granted: October 24, 2017
Patent Number:
9796580
A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the…
Integrated audio amplification circuit with multi-functional external terminals
Granted: October 10, 2017
Patent Number:
9787267
The present invention relates in one aspect to an audio amplification circuit comprising an input terminal for receipt of an input signal from a transducer. A signal processor is operatively coupled to the input terminal for receipt and processing of the input signal to generate a processed digital audio signal in accordance with a programmable configuration setting of the signal processor. A serial data transmission interface is configured for receipt of the processed digital audio…
Method and apparatus for navigation with nonlinear models
Granted: October 10, 2017
Patent Number:
9784582
A navigation module and method for providing an INS/GNSS navigation solution for a device that can either be tethered or move freely within a moving platform is provided, comprising a receiver for receiving absolute navigational information from an external source (e.g., such as a satellite), an assembly of self-contained sensors capable of obtaining readings (e.g. such as relative or non-reference based navigational information) about the device, and further comprising at least one…
Compressed firmware update
Granted: October 3, 2017
Patent Number:
9778928
It may be determined that a payment reader requires a firmware update, which may be transmitted to the payment reader as compressed firmware update blocks. The payment reader may receive a first portion of set of the compressed firmware update blocks. The payment reader may decompress the first portion and determine a partial firmware offset associated with the first portion. If the firmware update is incomplete, the payment reader may transmit that partial firmware offset to a second…
Microphone system with non-orthogonally mounted microphone die
Granted: September 19, 2017
Patent Number:
9769562
A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one…
Anchor-tilt cancelling accelerometer
Granted: September 19, 2017
Patent Number:
9766264
Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be…
CMOS-MEMS integration by sequential bonding method
Granted: September 12, 2017
Patent Number:
9761557
Methods for bonding two wafers are disclosed. In one aspect, a first wafer includes an integrated circuit and the second wafer including a MEMS device. The method comprises depositing a bond pad on a metal on the first wafer and sequentially bonding the first wafer to the second wafer utilizing first and second temperatures. The second wafer is bonded to the bond pad at the first temperature and the bond pad and the metal are bonded at the second temperature. In another aspect, a first…
3D integration using Al—Ge eutectic bond interconnect
Granted: September 5, 2017
Patent Number:
9754922
Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second CMOS wafer. The eutectic bond includes combinations where the eutectic bonding temperature is lower than the maximum temperature a CMOS circuit can withstand without being damaged during processing.
System and method for estimating heading misalignment
Granted: September 5, 2017
Patent Number:
9752879
This disclosure relates to heading misalignment estimation with a portable device and more specifically to estimating misalignment between a portable device having a sensor assembly and a platform transporting the portable device when the platform is undergoing motion having periodic characteristics. In one aspect, a suitable method includes obtaining inertial sensor data for the portable device and determining an effective frequency characteristic of the inertial sensor data…
Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
Granted: September 5, 2017
Patent Number:
9751752
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS…
Signal processing for an acoustic sensor bi-directional communication channel
Granted: August 29, 2017
Patent Number:
9749736
Signal processing for an acoustic sensor bi-directional communication channel is presented herein. The acoustic sensor can comprise a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, a signal…
Reduction of chipping damage to MEMS structure
Granted: August 22, 2017
Patent Number:
9738511
A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with…
Transducer with enlarged back volume
Granted: August 22, 2017
Patent Number:
9738515
A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first…
CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
Granted: August 22, 2017
Patent Number:
9738512
An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two…
