Detecting Defects on a Wafer Using Defect-Specific and Multi-Channel Information
Granted: August 7, 2014
Application Number:
20140219544
Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a…
APPARATUS AND METHOD FOR OPTICAL INSPECTION, MAGNETIC FIELD AND HEIGHT MAPPING
Granted: August 7, 2014
Application Number:
20140218503
A metrology system is configured to provide visual inspection of a workpiece, three-dimensional magnetic field map, and height measurement. A stage is configured to bring points of interest at the workpiece under the desired tool for measurement. The optical field, magnetic field, and height information can be used independently or together in order to correlate defects in the manufacturing process of the workpiece. This abstract is provided to comply with rules requiring an abstract…
SPECTRAL PURITY FILTER AND LIGHT MONITOR FOR AN EUV ACTINIC RETICLE INSPECTION SYSTEM
Granted: August 7, 2014
Application Number:
20140217298
An extreme ultraviolet (EUM) mask inspection system, comprising a light source to project EUV light along an optical axis, an illumination system to receive the EUV light from the source, the illumination system comprising a spectral purity filter (SPF), the SPF transmits a first portion of the EUV light along the optical axis toward a mask and the SPF comprising a plurality of at least partially reflective elements, said elements reflects a second portion of the EUV light off the…
CONTOUR-BASED ARRAY INSPECTION OF PATTERNED DEFECTS
Granted: July 31, 2014
Application Number:
20140212024
One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and…
RETICLE DEFECT INSPECTION WITH SYSTEMATIC DEFECT FILTER
Granted: July 24, 2014
Application Number:
20140205179
Disclosed are methods and apparatus for inspecting a photolithographic reticle. A stream of defect data is received from a reticle inspection system, wherein the defect data identifies a plurality of defects that were detected for a plurality of different portions of the reticle. Before reviewing the defect data to determine whether the reticle passes inspection and as the stream of defect data continues to be received, some of the defects are automatically grouped with other most…
193NM Laser And Inspection System
Granted: July 24, 2014
Application Number:
20140204963
A laser for generating an output wavelength of approximately 193.4 nm includes a fundamental laser, an optical parametric generator, a fourth harmonic generator, and a frequency mixing module. The optical parametric generator, which is coupled to the fundamental laser, can generate a down-converted signal. The fourth harmonic generator, which may be coupled to the optical parametric generator or the fundamental laser, can generate a fourth harmonic. The frequency mixing module, which is…
APPARATUS AND METHOD FOR MULTIPLEXED MULTIPLE DISCHARGE PLASMA PRODUCED SOURCES
Granted: July 17, 2014
Application Number:
20140197733
An apparatus for producing EUV light, including: a plate with pluralities of through-bores; at least one power system; and a plurality of discharge plasma devices disposed in the through-bores. Each device includes: a respective plasma electrode forming at least part of a respective plasma-producing region; a respective magnetic core embedded in the plate and aligned with the respective plasma electrode in a radial direction and configured to create a respective magnetic field within the…
Method and System for Universal Target Based Inspection and Metrology
Granted: July 17, 2014
Application Number:
20140199791
Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a…
METHODS OF MEASURING OVERLAY ERRORS IN AREA-IMAGING E-BEAM LITHOGRAPHY
Granted: July 17, 2014
Application Number:
20140199618
One embodiment relates to a method of measuring overlay errors for a programmable pattern, area-imaging electron beam lithography apparatus. Patterned cells of an overlay measurement target array may be printed in swaths such that they are superposed on patterned cells of a first (base) array. In addition, the overlay array may have controlled-exposure areas distributed within the swaths. The superposed cells of the overlay and base arrays are imaged. The overlay errors are then measured…
Alleviation Of Laser-Induced Damage In Optical Materials By Suppression Of Transient Color Centers Formation And Control Of Phonon Population
Granted: July 17, 2014
Application Number:
20140198818
Laser-induced damage in an optical material can be mitigated by creating conditions at which light absorption is minimized. Specifically, electrons populating defect energy levels of a band gap in an optical material can be promoted to the conduction band—a process commonly referred to as bleaching. Such bleaching can be accomplished using a predetermined wavelength that ensures minimum energy deposition into the material, ideally promoting electron to just inside the conduction band.…
Determining a Position of Inspection System Output in Design Data Space
Granted: July 10, 2014
Application Number:
20140195992
Systems and methods for determining a position of output of an inspection system in design data space are provided. One method includes merging more than one feature in design data for a wafer into a single feature that has a periphery that encompasses all of the features that are merged. The method also includes storing information for the single feature without the design data for the features that are merged. The information includes a position of the single feature in design data…
Detecting Defects on a Wafer Using Template Image Matching
Granted: July 10, 2014
Application Number:
20140193065
Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.
HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PLASMA
Granted: July 10, 2014
Application Number:
20140192840
Aspects of the present disclosure disclose a component module in a process condition measuring device comprises a support for supporting a component, one or more legs configured to suspend the support in a spaced-apart relationship with respect to a substrate. An electrically conductive or low-resistivity semiconductor enclosure is configured to enclose the component, the support and the legs between the substrate and the enclosure. It is emphasized that this abstract is provided to…
Detecting Defects on a Wafer
Granted: July 3, 2014
Application Number:
20140185919
Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the…
MULTI DIRECTIONAL ILLUMINATION FOR A MICROSCOPE AND MICROSCOPE
Granted: July 3, 2014
Application Number:
20140185136
A dome illumination for a microscope and a microscope are disclosed. At least one objective lens carries a dome at a free end, wherein the free end of the objective lens is facing a surface of the object. At least one light source is arranged such that an illumination is provided to the dome when the objective lens is positioned in an optical axis or working position of the microscope.
ADAPTABLE ILLUMINATING APPARATUS, SYSTEM, AND METHOD FOR EXTREME ULTRA-VIOLET LIGHT
Granted: June 26, 2014
Application Number:
20140175308
An apparatus for focusing light in a semi-conductor inspection system, including: a first mirror arranged to reflect extreme ultra-violet (EUV) generated by a plasma source; and a second mirror arranged to focus the EUV light, reflected from the first mirror, onto a first intermediate focus plane. A homogenizing tunnel, including: a first aperture having a first shape and a first size and arranged to receive extreme ultra-violet (EUV) light; a second aperture having a second shape and a…
APPARATUS, SYSTEM, AND METHOD FOR SEPARATING GASES AND MITIGATING DEBRIS IN A CONTROLLED PRESSURE ENVIRONMENT
Granted: June 19, 2014
Application Number:
20140166051
An assembly, including: a nozzle including a first chamber with a first orifice arranged to receive a stream of gas; a second chamber with a second orifice to emit the stream; a throat connecting the nozzle chambers; and a collector including: top and bottom walls with first and second openings; a third chamber bounded by the top and bottom walls and including a third opening connected to the second orifice to receive the stream; and a fourth opening. The first chamber tapers from the…
Generating an Array of Spots on Inclined Surfaces
Granted: June 19, 2014
Application Number:
20140168774
A system which may be used to generate a plurality of spots on a surface is provided. The spots may be aligned with the incident plane of oblique illumination. The system may include a diffractive optical element configured to split a beam into a plurality of beams by generating a plurality of diffraction orders. The system may also include a focusing lens configured to focus at least some of the plurality of beams on the surface in the plurality of spots. At least some of the plurality…
CARBON AS GRAZING INCIDENCE EUV MIRROR AND SPECTRAL PURITY FILTER
Granted: June 19, 2014
Application Number:
20140168758
A mirror for reflecting extreme ultraviolet light (EUV) comprising: a substrate layer; and an upper layer above the substrate layer, that reflects EUV wavelengths and refracts longer wavelengths, said upper layer being dense and hard carbon having an Sp2 to Sp3 carbon bond ratio of 0 to about 3 and a normal incidence EUV mirror comprising an optical coating on an uppermost surface which permits transmission of EUV and protects the surface from environmental degradation, said coating…
DELTA DIE INTENSITY MAP MEASUREMENT
Granted: June 19, 2014
Application Number:
20140168418
With an optical inspection tool, images of a plurality of patches of a plurality of dies of a reticle are obtained. The patch images are obtained so that each patch image is positioned relative to a same reference position within its respective die as another die-equivalent one of the patch images in each the other ones of the dies. For each patch image, an integrated value is determined for an image characteristic of sub-portions of such patch image. For each patch image, a reference…
