KLA-Tencor Patent Grants

Back-illuminated sensor with boron layer

Granted: October 15, 2019
Patent Number: 10446696
An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer and a doped layer on the other surface of the epitaxial layer. The…

193nm laser and inspection system

Granted: October 8, 2019
Patent Number: 10439355
An optical inspection system that utilizes sub-200 nm incident light beam to inspect a surface of an object for defects is described. The sub-200 nm incident light beam is generated by combining first light having a wavelength of about 1109 nm with second light having a wavelength of approximately 234 nm. An optical system includes optical components configured to direct the incident light beam to a surface of the object, and image relay optics are configured to collect and relay at…

Spectral reflectometry for in-situ process monitoring and control

Granted: October 8, 2019
Patent Number: 10438825
Methods and systems for performing in-situ, selective spectral reflectometry (SSR) measurements of semiconductor structures disposed on a wafer are presented herein. Illumination light reflected from a wafer surface is spatially imaged. Signals from selected regions of the image are collected and spectrally analyzed, while other portions of the image are discarded. In some embodiments, a SSR includes a dynamic mirror array (DMA) disposed in the optical path at or near a field plane…

Array-based characterization tool

Granted: October 8, 2019
Patent Number: 10438769
A scanning electron microscopy (SEM) system includes a plurality of electron beam sources configured to generate a primary electron beam. The SEM system includes an electron-optical column array with a plurality of electron-optical columns. An electron-optical column includes a plurality of electron-optical elements. The plurality of electron-optical elements includes a deflector layer configured to be driven via a common controller shared by at least some of the plurality of…

183 nm CW laser and inspection system

Granted: October 1, 2019
Patent Number: 10429719
An inspection system/method in which first optics direct continuous wave (CW) light at 181-185 nm to an inspected article, and second optics redirect image information affected by the article to detectors. A laser assembly generates the CW light by generating fourth harmonic light from first fundamental CW light having a first wavelength between 1 and 1.1 ?m, generating fifth harmonic light by mixing the fourth harmonic light with the first fundamental CW light, and mixing the fifth…

Apparatus for high-speed imaging sensor data transfer

Granted: October 1, 2019
Patent Number: 10429321
An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver…

Method for auto-learning tool matching

Granted: October 1, 2019
Patent Number: 10429320
The present disclosure is directed to a method of tool matching that employs an auto-learning feedback loop to update a library of key parameters. According to the method, measurements are performed on a control wafer to collect a set of parameters associated with the process/analysis tool that is being matched. When deviated parameters correlate to a correctable tool condition (i.e. a tool matching event), the parameters are added to the library of key parameters. These key or critical…

Inspection system including parallel imaging paths with multiple and selectable spectral bands

Granted: October 1, 2019
Patent Number: 10429319
The present disclosure is directed to a system for inspecting a sample with multiple wavelengths of illumination simultaneously via parallel imaging paths. The system may include at least a first detector or set of detectors configured to detect illumination reflected, scattered, or radiated along a first imaging path from a selected portion of the sample in response to the first wavelength of illumination and a second detector or set of detectors configured to concurrently detect…

Multilayer film metrology using an effective media approximation

Granted: October 1, 2019
Patent Number: 10429296
A metrology system includes a controller coupled to a detector to generate a detection signal based on the reflection of an illumination beam from a multilayer film stack. The multilayer film stack may include one or more zones with a repeating pattern of two or more materials. The controller may generate a model of reflection of the illumination beam by modeling the zones as thick films having zone thicknesses and effective permittivity values using an effective medium model relating…

System and method for spectral tuning of broadband light sources

Granted: September 24, 2019
Patent Number: 10422508
A tunable spectral filter includes a first tunable dispersive element, a first optical element, a spatial filtering element located at the focal plane, a second optical element, and a second dispersive element. The first tunable dispersive element introduces spectral dispersion to an illumination beam with an adjustable dispersion. The first optical element focuses the illumination beam at a focal plane in which a distribution of a spectrum of the spectrally-dispersed illumination beam…

Virtual inspection systems with multiple modes

Granted: September 17, 2019
Patent Number: 10416088
Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a…

Systems and methods for defect detection using image reconstruction

Granted: September 17, 2019
Patent Number: 10416087
An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The…

Estimating and eliminating inter-cell process variation inaccuracy

Granted: September 17, 2019
Patent Number: 10415963
Metrology methods and targets are provided, for estimating inter-cell process variation by deriving, from overlay measurements of at least three target cells having different designed misalignments, a dependency of a measured inaccuracy on the designed misalignments (each designed misalignment is between at least two overlapping periodic structures in the respective target cell). Inaccuracies which are related to the designed misalignments are reduced, process variation sources are…

Dispersion model for band gap tracking

Granted: September 10, 2019
Patent Number: 10410935
Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical models of semiconductor structures capable of accurate characterization of defects in high-K dielectric layers and embedded nanostructures are presented. In one example, the optical dispersion…

Method and system for correlating optical images with scanning electron microscopy images

Granted: September 10, 2019
Patent Number: 10410338
The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by…

Overlay control with non-zero offset prediction

Granted: September 10, 2019
Patent Number: 10409171
A process control system may include a controller configured to receive after-development inspection (ADI) data after a lithography step for the current layer from an ADI tool, receive after etch inspection (AEI) overlay data after an exposure step of the current layer from an AEI tool, train a non-zero offset predictor with ADI data and AEI overlay data to predict a non-zero offset from input ADI data, generate values of the control parameters of the lithography tool using ADI data and…

Quality estimation and improvement of imaging metrology targets

Granted: September 10, 2019
Patent Number: 10408602
Methods are provided, which estimate a quality of a metrology target by calculating a noise metric of its ROI kernels, derived from application of a Fourier filter on the measured kernel with respect to a periodicity of the target's periodic structure(s); and using the calculated noise metric to indicate the target quality. An additional Fourier filter may be applied perpendicularly on the measured kernel with respect to a periodicity of a perpendicular segmentation of the periodic…

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

Granted: September 3, 2019
Patent Number: 10401279
Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced…

Overlay metrology using multiple parameter configurations

Granted: September 3, 2019
Patent Number: 10401738
An overlay metrology system includes an overlay metrology tool configurable to generate overlay signals with a plurality of recipes and further directs an illumination beam to an overlay target and collects radiation emanating from the overlay target in response to the at least a portion of the illumination beam to generate the overlay signal with the particular recipe. The overlay metrology system further acquires two or more overlay signals for a first overlay target using two or more…

Time-varying intensity map generation for reticles

Granted: September 3, 2019
Patent Number: 10401305
An optical reticle inspection tool is used during a first inspection to obtain, for each set of one or more patch areas of the reticle, a reference average of multiple reference intensity values corresponding to light measured from sub-areas of each patch area. After using the reticle in photolithography processes, the optical reticle inspection tool is used during a second inspection to obtain, for each set of one or more patch areas, an average of multiple test intensity values…