Integrated scanning electron microscopy and optical analysis techniques for advanced process control
Granted: July 23, 2019
Patent Number:
10359706
A sample analysis system includes a scanning electron microscope, an optical and/or eBeam inspection system, and an optical metrology system. The system further includes at least one controller. The controller is configured to receive a first plurality of selected regions of interest of the sample; generate a first critical dimension uniformity map based on a first inspection performed by the scanning electron microscope at the first selected regions of interest; determine a second…
Optical measurement of step size and plated metal thickness
Granted: July 23, 2019
Patent Number:
10359613
A method of generating 3D information includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across all pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of…
Beam shaping slit for small spot size transmission small angle X-ray scatterometry
Granted: July 23, 2019
Patent Number:
10359377
Methods and systems for reducing the effect of finite source size on illumination beam spot size for Transmission, Small-Angle X-ray Scatterometry (T-SAXS) measurements are described herein. A beam shaping slit having a slender profile is located in close proximity to the specimen under measurement and does not interfere with wafer stage components over the full range of angles of beam incidence. In one embodiment, four independently actuated beam shaping slits are employed to…
Determining one or more characteristics of a pattern of interest on a specimen
Granted: July 23, 2019
Patent Number:
10359371
Methods and systems for determining characteristic(s) of patterns of interest (POIs) are provided. One system is configured to acquire output of an inspection system generated at the POI instances without detecting defects at the POI instances. The output is then used to generate a selection of the POI instances. The system then acquires output from an output acquisition subsystem for the selected POI instances. The system also determines characteristic(s) of the POI using the output…
Focusing modules and methods
Granted: July 16, 2019
Patent Number:
10352766
Focusing modules and methods are provided, which use a spatial light modulator (SLM) configured to yield a circumferentially sinusoidal pattern to derive focusing signals. For example, the SLM may comprise an optical chopper wheel made of a glass disc with a circumferentially sinusoidal pattern. The circumferentially sinusoidal pattern simplifies phase derivation from the focusing signal, providing a faster and more accurate estimation of defocusing. Signal detection may be carried out…
Measurement recipe optimization based on spectral sensitivity and process variation
Granted: July 16, 2019
Patent Number:
10354929
An optimized measurement recipe is determined by reducing the set of measurement technologies and ranges of machine parameters required to achieve a satisfactory measurement result. The reduction in the set of measurement technologies and ranges of machine parameters is based on available process variation information and spectral sensitivity information associated with an initial measurement model. The process variation information and spectral sensitivity information are used to…
Multi-column scanning electron microscopy system
Granted: July 16, 2019
Patent Number:
10354832
A multi-column scanning electron microscopy (SEM) system is disclosed. The SEM system includes a source assembly. The source assembly includes two or more electron beam sources configured to generate a plurality of electron beams. The source assembly also includes two or more sets of positioners configured to actuate the two or more electron beam sources. The SEM system also includes a column assembly. The column assembly includes a plurality of substrate arrays. The column assembly also…
Run-time correction of defect locations during defect review
Granted: July 16, 2019
Patent Number:
10354405
One embodiment relates to a method for run-time correction of defect locations on a substrate during defect review. The substrate is loaded into a stage of a review apparatus, and coordinates for the defect locations on the substrate is received. The defect locations are grouped, and at least one local reference site in proximity to each group of defect locations is determined. The local reference site(s) is (are) used to determine a positional offset for the defect locations in each…
System and method for photomask alignment and orientation characterization based on notch detection
Granted: July 16, 2019
Patent Number:
10354373
A notch detection system receives images of a sample from the imaging detector, in which the sample includes a notched surface and an un-notched surface bounded by a sidewall and further includes at least one notch known notch specifications. The images are generated such that illumination unobstructed by the sample is received by the detector and the sample prevents incident illumination from reaching the detector. The system further determines whether each image includes a notch,…
Hot spot and process window monitoring
Granted: July 16, 2019
Patent Number:
10354035
Metrology overlay targets are provided, as well as method of monitoring process shortcomings. Targets comprise periodic structures, at least one of which comprising repeating asymmetric elements along a corresponding segmentation direction of the periodic structure. The asymmetry of the elements may be designed in different ways, for example as repeating asymmetric sub-elements along a direction perpendicular to the segmentation direction of the elements. The asymmetry of the…
X-ray scatterometry metrology for high aspect ratio structures
Granted: July 16, 2019
Patent Number:
10352695
Methods and systems for characterizing dimensions and material properties of high aspect ratio, vertically manufactured devices using transmission, small-angle x-ray scattering (T-SAXS) techniques are described herein. Exemplary structures include spin transfer torque random access memory (STT-RAM), vertical NAND memory (V-NAND), dynamic random access memory (DRAM), three dimensional FLASH memory (3D-FLASH), resistive random access memory (Re-RAM), and PC-RAM. In one aspect, T-SAXS…
Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
Granted: July 16, 2019
Patent Number:
10352691
Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.
Systems and methods incorporating a neural network and a forward physical model for semiconductor applications
Granted: July 9, 2019
Patent Number:
10346740
Methods and systems for training a neural network are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a neural network configured for determining inverted features of input images in a training set for a specimen input to the neural network, a forward physical model configured for reconstructing the input images from the inverted features thereby generating a set of output images corresponding to the…
Measurement library optimization in semiconductor metrology
Granted: July 9, 2019
Patent Number:
10345721
Methods and systems for optimizing a set of measurement library control parameters for a particular metrology application are presented herein. Measurement signals are collected from one or more metrology targets by a target measurement system. Values of user selected parameters of interest are resolved by fitting a pre-computed measurement library function to the measurement signals for a given set of library control parameters. Values of one or more library control parameters are…
Method for measuring positions of structures on a substrate and computer program product for determining positions of structures on a substrate
Granted: July 2, 2019
Patent Number:
10337852
A method with increased throughput for measuring positions of structures on a substrate is disclosed. The substrate is taken from a load port of a metrology machine and is placed immediately in a stage of the metrology machine. At least two measurement loops are carried out, wherein a first measurement loop is started at a time when a substrate temperature is different from the temperature at the stage, and at least one second measurement loop is started at a time after the first…
Method and system for selection of metrology targets for use in focus and dose applications
Granted: July 2, 2019
Patent Number:
10340196
The selection of metrology targets for use in a focus and dose application includes providing a FEM wafer including a plurality of fields with one or more metrology targets, measuring the one or more metrology targets within each field of the FEM wafer, performing a regression process on measurement results from the one or more selected fields of the FEM wafer to determine one or more DOI values for the one or more metrology targets of the one or more selected fields, calculating one or…
System and method for defining care areas in repeating structures of design data
Granted: July 2, 2019
Patent Number:
10339262
A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of…
Method and apparatus to detect defects in transparent solids
Granted: July 2, 2019
Patent Number:
10338009
A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple…
Methods and systems for selecting recipe for defect inspection
Granted: July 2, 2019
Patent Number:
10338002
Methods and systems for selecting optical modes suitable for defect inspection are disclosed. A method may include: scanning a full-stack wafer of the particular type utilizing a set of optical modes to obtain a set of full-stack wafer images; and de-processing the full-stack wafer to produce a de-processed wafer based on a location of a potential defect of interest indicated by the set of full-stack wafer images to facilitate selection of optical modes suitable for defect inspection of…
Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination
Granted: July 2, 2019
Patent Number:
10337991
Metrology scatterometry targets, optical systems and corresponding metrology tools and measurement methods are provided. Targets and/or optical systems are designed to enhance first order diffraction signals with respect to a zeroth order diffraction signal from the scatterometry target by creating a phase shift of 180° between zeroth order diffraction signals upon illumination of the scatterometry targets. For example, the targets may be designed to respond to polarized illumination by…
