Prediction based chucking and lithography control optimization
Granted: July 31, 2018
Patent Number:
10036964
Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters…
Plasma-based light source
Granted: July 24, 2018
Patent Number:
10034362
The present disclosure is directed to plasma-based light sources. Systems and methods are described for protecting components of the light source from plasma generated debris which can include target material gas, atomic vapor, high energy ions, neutrals, micro-particles, and contaminants. Particular embodiments include arrangements for reducing the adverse effects of plasma generated ions and neutrals on light source components while simultaneously reducing in-band light attenuation due…
Broadband light source including transparent portion with high hydroxide content
Granted: July 24, 2018
Patent Number:
10032620
A laser-sustained plasma light source includes a plasma lamp configured to contain a volume of gas and receive illumination from a pump laser in order to generate a plasma. The plasma lamp includes one or more transparent portions transparent to illumination from the pump laser and at least a portion of the broadband radiation emitted by the plasma. The one or more transparent portions are formed from a transparent material having elevated hydroxide content above 700 ppm.
High brightness laser-sustained plasma broadband source
Granted: July 24, 2018
Patent Number:
10032619
A high brightness laser-sustained broadband light source includes a gas containment structure and a pump laser configured to generate a pump beam including illumination of a wavelength at least proximate to a weak absorption line of a neutral gas contained in the gas containment structure. The broadband light source includes one or more anamorphic illumination optics configured to focus the pump beam into an approximately elliptical beam waist positioned in or proximate to the center of…
Model-based hot spot monitoring
Granted: July 24, 2018
Patent Number:
10030965
Methods and systems for monitoring parameters characterizing a set of hot spot structures fabricated at different locations on a semiconductor wafer are presented herein. The hot spot structures are device structures that exhibit sensitivity to process variations and give rise to limitations on permissible process variations that must be enforced to prevent device failures and low yield. A trained hot spot measurement model is employed to receive measurement data generated by one or more…
Substrate transporter
Granted: July 17, 2018
Patent Number:
10022865
Aspects of the present disclosure describe a robot which has a controller, actuators, encoders, and mechanical components. The robot may produce motion about an X, Z, RU, RL, and Theta axes. Movements of the robot are controlled by the controller. The repeatability of the robot is improved by designing the robot such that a control cycle frequency of the controller is 50 times or more greater than a vibrational frequency of one or more of the mechanical components. In order to reduce the…
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
Granted: July 17, 2018
Patent Number:
10025894
Systems and methods for prediction of in-plane distortions (IPD) due to wafer shape in semiconductor wafer chucking process is disclosed. A series of Zernike basis wafer shapes process to emulate the non-linear finite element (FE) contact mechanics model based IPD prediction is utilized in accordance with one embodiment of the present disclosure. The emulated FE model based prediction process is substantially more efficient and provides accuracy comparable to the FE model based IPD…
Selection and use of representative target subsets
Granted: July 17, 2018
Patent Number:
10025756
Methods and respective modules which reduce sample size and measurement duration of metrology parameters by selecting a relatively small subset of measured targets to represent a distribution of parameter measurements of a large number of targets. The subset is selected by sampling a substantially equal number of measurements from each of a selected number of quantiles of the distribution. The methods and modules allow identification of targets which represent correctly the whole target…
On-product derivation and adjustment of exposure parameters in a directed self-assembly process
Granted: July 17, 2018
Patent Number:
10025285
Methods and metrology tool modules embodying the methods are provided. Methods comprise measuring characteristics of intermediate features such as guiding lines in a directed self-assembly (DSA) process, deriving exposure parameters from the measured characteristics; and adjusting production parameters for producing consecutive target features according to the derived exposure parameters. The methods and modules enhance the accuracy of the DSA-produced structures and related…
Method and system for determining in-plane distortions in a substrate
Granted: July 17, 2018
Patent Number:
10024654
The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and…
Laser produced plasma light source having a target material coated on a cylindrically-symmetric element
Granted: July 10, 2018
Patent Number:
10021773
The present disclosure is directed to laser produced plasma light sources having a target material, such as Xenon, that is coated on the outer surface of a drum. Embodiments include bearing systems for rotating the drum that have structures for reducing leakage of contaminant material and/or bearing gas into the LPP chamber. Injection systems are disclosed for coating and replenishing target material on the drum. Wiper systems are disclosed for preparing the target material surface on…
System and method for fabricating metrology targets oriented with an angle rotated with respect to device features
Granted: July 10, 2018
Patent Number:
10018919
A lithography system includes an illumination source including two illumination poles separated along a first direction and symmetrically distributed around an optical axis, a pattern mask to receive illumination from the illumination source, and a set of projection optics to generate an image corresponding to the pattern mask onto a sample. The pattern mask includes a metrology target pattern mask and device pattern mask elements. The device pattern mask elements are distributed along…
System and method for cathodoluminescence-based semiconductor wafer defect inspection
Granted: July 10, 2018
Patent Number:
10018579
A system for measuring cathodoluminescence from a substrate includes an electron beam source configured to generate an electron beam, a sample stage configured to secure a sample and an electron-optical column including a set of electron-optical elements to direct at least a portion of the electron beam through onto a portion of the sample. The system also includes a set of guide optics located at a position within or below the electron-optical column and a set of collection optics,…
Front quartersphere scattered light analysis
Granted: July 10, 2018
Patent Number:
10018572
A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing…
System and method for dynamic care area generation on an inspection tool
Granted: July 10, 2018
Patent Number:
10018571
A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The…
System and method for hyperspectral imaging metrology
Granted: July 10, 2018
Patent Number:
10018560
A metrology system includes an illumination source configured to generate an illumination beam, one or more illumination optics configured to direct the illumination beam to a sample, one or more collection optics configured to collect illumination emanating from the sample, a detector, and a hyperspectral imaging sub-system. The hyperspectral imaging sub-system includes a dispersive element positioned at a pupil plane of the set of collection optics configured to spectrally disperse the…
Optical die to database inspection
Granted: July 3, 2018
Patent Number:
10012599
Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical…
Generating a wafer inspection process using bit failures and virtual inspection
Granted: July 3, 2018
Patent Number:
10014229
Methods and systems for generating a wafer inspection process are provided. One method includes storing output of detector(s) of an inspection system during scanning of a wafer regardless of whether the output corresponds to defects detected on the wafer and separating physical locations on the wafer that correspond to bit failures detected by testing of the water into a first portion of the physical locations at which the defects were not detected and a second portion of the physical…
Model building and analysis engine for combined X-ray and optical metrology
Granted: July 3, 2018
Patent Number:
10013518
Structural parameters of a specimen are determined by fitting models of the response of the specimen to measurements collected by different measurement techniques in a combined analysis. Models of the response of the specimen to at least two different measurement technologies share at least one common geometric parameter. In some embodiments, a model building and analysis engine performs x-ray and optical analyses wherein at least one common parameter is coupled during the analysis. The…
X-ray based metrology with primary and secondary illumination sources
Granted: July 3, 2018
Patent Number:
10012606
Methods and systems for performing relatively high energy X-ray Fluorescence (XRF) measurements and relatively low energy X-ray photoelectron spectroscopy (XPS) measurements over a desired inspection area of a specimen are presented. Combined XPS and XRF measurements of a specimen are achieved with illumination tailored to each respective metrology technique. A high brightness, high energy x-ray illumination source is employed in combination with one or more secondary fluorescence…
