Method for correcting position measurements for optical errors and method for determining mask writer errors
Granted: July 11, 2017
Patent Number:
9704238
A method for correcting optical errors occurring in coordinates of positions of a plurality of targets measured via an imaging system comprising a field of view. The plurality of targets includes a first array of targets and a second array of targets overlapping the first array of targets, and a portion of the plurality of targets are outside of the field of view. The method broadly includes the following steps: a) placing the first array of targets in the field of view of the imaging…
Adaptive local threshold and color filtering
Granted: July 11, 2017
Patent Number:
9704234
Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also…
System and method for reducing dynamic range in images of patterned regions of semiconductor wafers
Granted: July 11, 2017
Patent Number:
9703207
The present invention includes generating illumination, providing a spatial light modulator (SLM) configured to selectably illuminate one or more portions of a surface of a wafer using the generated illumination, receiving a sets of wafer pattern data indicative of one or more patterns of the wafer, translating the wafer along a direction, selectably controlling a pixel configuration of the SLM to control an illumination pattern on the surface of the wafer, a first pixel configuration…
Systems and methods for wafer surface feature detection and quantification
Granted: July 11, 2017
Patent Number:
9702829
Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore,…
Optical mode analysis with design-based care areas
Granted: July 11, 2017
Patent Number:
9702827
Methods and systems for selecting one or more modes of an inspection subsystem or system for inspection of a specimen are provided. The systems described herein are configured to acquire output for all of the modes to be considered at a location of a known defect on the specimen by aligning output, which is generated at the location with a mode known to generate output in which patterned features on the specimen are resolved to a degree that allows the output to be aligned to design…
Apparatus for measuring overlay errors
Granted: July 11, 2017
Patent Number:
9702693
A metrology system for determining overlay is disclosed. The system includes an optical assembly for capturing images of an overlay mark and a computer for analyzing the captured images to determine whether there is an overlay error. The mark comprises first and second regions that each include at least two separately generated working zones, juxtaposed relative to one another, configured to provide overlay information in a first direction, and include a periodic structure having…
Automated decision-based energy-dispersive x-ray methodology and apparatus
Granted: July 4, 2017
Patent Number:
9696268
One embodiment relates to a method for automated review of defects detected in a defective die on the target substrate. The method includes: performing an automated review of the defects using an secondary electron microscope (SEM) so as to obtain electron-beam images of the defects; performing an automated classification of the defects into types based on morphology of the defects as determined from the electron-beam images; selecting defects of a specific type for automated…
Apparatus and methods for determining defect depths in vertical stack memory
Granted: July 4, 2017
Patent Number:
9696264
Disclosed are methods and apparatus for inspecting a vertical semiconductor stack of a plurality of layers is disclosed. The method includes (a) on a confocal tool, repeatedly focusing an illumination beam at a plurality of focus planes at a plurality of different depths of a first vertical stack, wherein a defect is located at an unknown one of the different depths and the illumination beam has a wavelength range between about 700 nm and about 950 nm, (b) generating a plurality of…
Linear Stage for reflective electron beam lithography
Granted: June 27, 2017
Patent Number:
9690213
A linear stacked stage suitable for REBL may include a first upper fast stage configured to translate a first plurality of wafers in a first direction along a first axis, the first upper fast stage configured to secure a first plurality of wafers; a second upper fast stage configured to translate a second plurality of wafers in a second direction along the first axis, the second upper fast stage configured to secure the second plurality of wafers, the second direction opposite to the…
High brightness liquid droplet X-ray source for semiconductor metrology
Granted: June 27, 2017
Patent Number:
9693439
Methods and systems for realizing a high brightness liquid metal droplet based x-ray source suitable for high throughput x-ray metrology are presented herein. A high power laser bombards a solid target material to generate liquid metal droplets. The laser generated liquid metal droplets are excited with a focused, high power excitation beam such as an electron or laser beam. The excitation beam is synchronized with the stream of liquid metal droplets stimulated by the high power laser to…
Adaptive electrical testing of wafers
Granted: June 27, 2017
Patent Number:
9689923
A method and a system for determining one or more parameters for electrical testing of a wafer are provided. One method includes determining electrical test paths through a device being formed on a wafer and physical layout components in different layers of the device corresponding to each of the electrical test paths. The method also includes determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the electrical test paths. In…
Multi-channel backside wafer inspection
Granted: June 27, 2017
Patent Number:
9689804
A system for inspecting a backside surface of a wafer with multi-channel focus control includes a set of inspection sub-systems including a first inspection sub-system positioned and an additional inspection sub-system. The first and additional inspection sub-systems include an optical assembly, an actuation assembly, where the optical assembly is disposed on the actuation assembly, and a positional sensor configured to sense a position characteristic between a portion of the optical…
Apparatus and methods for inspecting extreme ultra violet reticles
Granted: June 13, 2017
Patent Number:
9679372
Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle is disclosed. An inspection tool for detecting electromagnetic waveforms is used to obtain a phase defect map for the EUV reticle before a pattern is formed on the EUV reticle, and the phase defect map identifies a position of each phase defect on the EUV reticle. After the pattern is formed on the EUV reticle, a charged particle tool is used to obtain an image of each reticle portion that is…
Photoresist simulation
Granted: June 13, 2017
Patent Number:
9679116
A processor based method for measuring dimensional properties of a photoresist profile by determining a number acid generators and quenchers within a photoresist volume, determining a number of photons absorbed by the photoresist volume, determining a number of the acid generators converted to acid, determining a number of acid and quencher reactions within the photoresist volume, calculating a development of the photoresist volume, producing with the processor a three-dimensional…
Target element types for process parameter metrology
Granted: June 13, 2017
Patent Number:
9678421
Metrology targets, target design methods and metrology methods are provided. Metrology targets comprise target elements belonging to two or more target element types. Each target element type comprises unresolved features which offset specified production parameters to a specified extent and thus provide sensitivity monitoring and optimization tools for process parameters such as focus and dose.
Laser with integrated multi line or scanning beam capability
Granted: June 13, 2017
Patent Number:
9678350
A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination.
Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device
Granted: June 6, 2017
Patent Number:
9669550
A pick and place device, a method and a computer program product for automatic pick-up-height adjustment. A first pneumatic system has a first and second controllable valves. The second controllable valve is connected with its input port to a vacuum source. An output port of the first controllable valve and an output port of the second controllable valve are connected to a common tube in fluid communication with at least one vacuum nozzle of the pick and place device. A second pneumatic…
Apparatus and method for cross-flow purge for optical components in a chamber
Granted: May 30, 2017
Patent Number:
9662688
An apparatus for cross-flow purging for optical components in a chamber, including: a housing with first and second axial ends, a side wall extending in an axial direction and connecting the first and second axial ends, and the chamber formed by the first and second axial ends and the side wall; an optical component disposed within the chamber and fixed with respect to the housing via at least one connecting point on the optical component; an inlet port aligned with the side wall,…
Virtual ground for target substrate using floodgun and feedback control
Granted: May 30, 2017
Patent Number:
9666411
One embodiment relates to an apparatus for virtual grounding of a target substrate in a charged-particle beam apparatus. A primary gun generates charged particles for a process beam that is focused on a frontside surface of the target substrate, and the target substrate is held by a stage. An electrostatic voltmeter measures a voltage potential of the target substrate, and a charge-control gun impinges a beam of charged particles to the target substrate. A feedback control loop is used…
Multi-oscillator, continuous Cody-Lorentz model of optical dispersion
Granted: May 30, 2017
Patent Number:
9664734
Methods and systems for monitoring band structure characteristics and predicting electrical characteristics of a sample early in a semiconductor manufacturing process flow are presented herein. High throughput spectrometers generate spectral response data from semiconductor wafers. In one example, the measured optical dispersion is characterized by a Gaussian oscillator, continuous Cody-Lorentz model. The measurement results are used to monitor band structure characteristics, including…
