Mattson Technology Profile

Mattson Technology Patent Grants

Substrate breakage detection in a thermal processing system

Patent Number 9941144 - April 10, 2018

Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation,…

Inductively coupled plasma source for plasma processing

Patent Number 9653264 - May 16, 2017

Plasma processing apparatus and methods are disclosed. Embodiments of the present disclosure include a processing chamber having an interior…

Selective reflectivity process chamber with customized wavelength response and method

Patent Number 9633876 - April 25, 2017

A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer…

Methods and systems for supporting a workpiece and for heat-treating the workpiece

Patent Number 9627244 - April 18, 2017

Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece…

Low cost high throughput processing platform

Patent Number 9493306 - November 15, 2016

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

Mattson Technology Patent Applications

System and Method for Protection of Vacuum Seals in Plasma Processing Systems

Application Number 20160013025 - January 14, 2016

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber…

APPARATUS AND METHODS FOR GENERATING ELECTROMAGNETIC RADIATION

Application Number 20150035436 - February 5, 2015

An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of…

Heating Configuration for Use in Thermal Processing Chambers

Application Number 20140246422 - September 4, 2014

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear…

LOW COST HIGH THROUGHPUT PROCESSING PLATFORM

Application Number 20140151195 - June 5, 2014

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

METHODS, APPARATUS AND MEDIA FOR DETERMINING A SHAPE OF AN IRRADIANCE PULSE TO WHICH A WORKPIECE IS TO BE EXPOSED

Application Number 20130306871 - November 21, 2013

A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are…