Mattson Technology Profile

Mattson Technology Patent Grants

Plasma reactor with inductive excitation of plasma and efficient removal of heat from the excitation coil

Patent Number 10090134 - October 2, 2018

The plasma reactor of the invention is intended for treating the surfaces of objects such as semiconductor wafers and large display panels, or…

Implanted photoresist stripping process

Patent Number 10078266 - September 18, 2018

Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a…

System and method for protection of vacuum seals in plasma processing systems

Patent Number 10049858 - August 14, 2018

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber…

Inductive plasma source with high coupling efficiency

Patent Number 10037867 - July 31, 2018

A method and apparatus are provided for processing a substrate with a radiofrequency inductive plasma in the manufacture of a device. The…

Substrate breakage detection in a thermal processing system

Patent Number 9941144 - April 10, 2018

Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation,…

Mattson Technology Patent Applications

System and Method for Protection of Vacuum Seals in Plasma Processing Systems

Application Number 20160013025 - January 14, 2016

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber…

APPARATUS AND METHODS FOR GENERATING ELECTROMAGNETIC RADIATION

Application Number 20150035436 - February 5, 2015

An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of…

Heating Configuration for Use in Thermal Processing Chambers

Application Number 20140246422 - September 4, 2014

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear…

LOW COST HIGH THROUGHPUT PROCESSING PLATFORM

Application Number 20140151195 - June 5, 2014

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

METHODS, APPARATUS AND MEDIA FOR DETERMINING A SHAPE OF AN IRRADIANCE PULSE TO WHICH A WORKPIECE IS TO BE EXPOSED

Application Number 20130306871 - November 21, 2013

A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are…