Mattson Technology Profile

Mattson Technology Patent Grants

Workpiece processing apparatus with plasma and thermal processing systems

Patent Number 11955315 - April 9, 2024

A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber…

Transmission-based temperature measurement of a workpiece in a thermal processing system

Patent Number 11955388 - April 9, 2024

A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat…

Systems and methods for workpiece processing

Patent Number 11923215 - March 5, 2024

A processing system for processing a plurality of workpieces includes a transfer chamber in process flow communication with a first processing…

Enhanced ignition in inductively coupled plasmas for workpiece processing

Patent Number 11848204 - December 19, 2023

Plasma processing apparatus and associated methods are provided. In one example, a plasma processing apparatus includes a plasma chamber. The…

Workpiece processing apparatus with plasma and thermal processing systems

Patent Number 11837447 - December 5, 2023

An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber,…

Mattson Technology Patent Applications

System and Method for Protection of Vacuum Seals in Plasma Processing Systems

Application Number 20160013025 - January 14, 2016

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber…

APPARATUS AND METHODS FOR GENERATING ELECTROMAGNETIC RADIATION

Application Number 20150035436 - February 5, 2015

An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of…

Heating Configuration for Use in Thermal Processing Chambers

Application Number 20140246422 - September 4, 2014

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear…

LOW COST HIGH THROUGHPUT PROCESSING PLATFORM

Application Number 20140151195 - June 5, 2014

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least…

METHODS, APPARATUS AND MEDIA FOR DETERMINING A SHAPE OF AN IRRADIANCE PULSE TO WHICH A WORKPIECE IS TO BE EXPOSED

Application Number 20130306871 - November 21, 2013

A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are…