Multichannel digital audio interface
Granted: October 4, 2016
Patent Number:
9461601
A multichannel input device with automatic number-of-channels detection includes an automatic channel and bit depth detector, a digital audio interface (DAI), an analog device, and a digital-to-analog converter (DAC) coupling the DAI to the analog device. The automatic number-of-channels and bit depth detector has a BCLK input, a LRCLK input, a number of channels NCHAN output, and a bit depth B output. The DAI has a data DIN input, the BCLK input, the LRCLK input, an NCHAN input and a B…
System and method with specific ordered execution over physical elements
Granted: October 4, 2016
Patent Number:
9459833
The invention relates to semiconductor devices, and more particularly, to systems, devices and methods of utilizing inherent differences among physical elements in an electrical component to generate unique and non-duplicable numbers that are statistically random and repeatable. These bits may be applied as identifications, random number seeds or encryption keys in many security applications, e.g., a financial terminal. An integrator is coupled to a plurality of physical elements,…
Method and apparatus for sensing capacitance value and converting it into digital format
Granted: October 4, 2016
Patent Number:
9459298
A capacitive sensing system are configured to sense a capacitance value and convert the sensed capacitance value to a digital format. The capacitive sensing system provides good selectivity and immunity to noise and interference, which can be further enhanced by enabling spread spectrum excitation. In some embodiments, the capacitive sensing system utilizes a sinusoidal excitation signal that results in low electromagnetic emissions, limited to narrow frequency band. In some embodiments,…
LDMOS with field plate connected to gate
Granted: September 20, 2016
Patent Number:
9450074
Semiconductor devices, such as laterally diffused metal oxide semiconductor (LDMOS) devices, are described that have a field plate connected to a gate of the device. In one or more implementations, the semiconductor devices include a substrate having a source region of a first conductivity type and a drain region of the first conductivity type. A gate is positioned over the surface and between the source region and the drain region. The gate is configured to receive a voltage so that a…
Embedded radio frequency identification (RFID) package
Granted: September 20, 2016
Patent Number:
9449264
A radio frequency identification (RFID) device is described. In one or more implementations, the RFID device includes an integrated circuit (IC) die electrically connected to a radio frequency (RF) antenna winding for transmitting electronically stored information via the RF antenna winding. The RFID device also includes a substrate comprising a first core laminated to a second core. The RF antenna winding is routed through the first core and the second core. The first core defines a…
Systems, methods and apparatus for voltage clamping
Granted: September 13, 2016
Patent Number:
9444434
A voltage clamping system includes: (a) a first electronic device connected to a first power source and having a signal output node, a voltage clamp high node, and a voltage clamp low node, wherein the voltage clamp high node and the voltage clamp low node are coupled to a second power source different than the first power source; and (b) a second electronic device powered by the second power source and having a signal input node coupled to the signal output node of the first electronic…
Systems and methods to calibrate switching regulators
Granted: September 13, 2016
Patent Number:
9444338
Various embodiments of the invention provide for a double measurement technique to enable auto-calibration of a switching regulator. In certain embodiments, calibration is performed using a digital conversion circuit that adjusts an internal slope of an on-time generator by adjusting the peak value of a ramp to a desired peak voltage value. Auto-calibration allows for an optimal dynamic response across the entire switching frequency range of the switching regulator even in noisy…
Embedded die redistribution layers for active device
Granted: September 13, 2016
Patent Number:
9443815
Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional…
Embedded secure element for authentication, storage and transaction within a mobile terminal
Granted: September 6, 2016
Patent Number:
9436940
Various embodiments of the present invention relate to incorporating an embedded secure element into a mobile device, and more particularly, to systems, devices and methods of incorporating the embedded secure element into a mobile device for identity authentication, data storage and processing in trusted transactions. These trusted transactions require a high security level to protect sensitive data or programs in bank account management, purchasing orders, contactless payment, passport…
Systems and methods for feed-forward control of load current in DC to DC buck converters
Granted: September 6, 2016
Patent Number:
9438110
A system for controlling load current in a voltage converter includes a current normalization module that receives a first measurement corresponding to the load current, receives a second measurement corresponding to an inductor current, and matches a first gain of the first measurement corresponding to the load current to a second gain of the second measurement corresponding to the inductor current to generate a normalized load current. A feed-forward generation module receives the…
Light sensing device for detecting gestures having a casing with a lens receiving aperture disposed immediately adjacent to a display screen
Granted: September 6, 2016
Patent Number:
9435910
Light sensing devices are described that have a lens to focus light. In one or more implementations, the light sensing devices include a substrate having a photodetector formed thereon. The photodetector is capable of detecting light and providing a signal in response thereto. The devices also include a display screen that allows light to at least substantially pass through the display screen. An optical baffle extends above a surface of the substrate to display screen and is configured…
Optical sensor
Granted: August 30, 2016
Patent Number:
9431440
An integrated circuit device includes an active semiconductor substrate comprising an array of photodiodes. The integrated circuit device also includes a dielectric layer disposed adjacent to the active semiconductor substrate proximate to the array of photodiodes. The dielectric layer has a first side adjacent to the active semiconductor substrate and a second side opposite from the active semiconductor substrate. The dielectric layer includes a layer of at least substantially opaque…
Wafer-level package device with solder bump reinforcement
Granted: August 23, 2016
Patent Number:
9425160
Wafer-level package (semiconductor) devices are described that have a reinforcement layer formed on an adhesion layer and/or a semiconductor substrate and covering at least a portion of at least one solder bump. Additionally, the reinforcement layer may cover at least a portion of a semiconductor device (e.g., a die) mounted on the semiconductor substrate. In an implementation, the wafer-level package (semiconductor) device may include an integrated circuit chip with an attached die,…
SAS expander with non-blocking virtual phy architecture
Granted: August 23, 2016
Patent Number:
9424218
A SAS expander includes a switch core, a number of SAS expander phys coupled to the switch core, an SMP originator coupled to the switch core and an SMP receptor coupled to the switch core. In an embodiment, the SMP originator is configured to only send connection requests and the SMP receptor is configured to only receive connection requests. Program instructions stored in non-transient digital storage media include code segments detecting a new connection request, code segments…
2-phase threshold detector based circuits
Granted: August 9, 2016
Patent Number:
9413228
A switched capacitor circuit includes a threshold detector to generate a threshold detection signal when a difference between first and second input signals crosses a predetermined level. A variable current source produces a varying amount of current in response to the difference between the input signals. A voltage measurement means produce a measurement signal in response to the difference between the input signals. A correction means produces a correction signal in response to the…
Formation of a thermopile sensor utilizing CMOS fabrication techniques
Granted: August 9, 2016
Patent Number:
9412927
Techniques are described to form an absorption stack proximate to a thermopile sensor. In one or more implementations, a thermopile sensor is formed proximate to a semiconductor wafer. An absorption stack is formed proximate to the semiconductor wafer and includes a first layer, a second layer, and a third layer. The first layer may be a material having absorption and/or reflective characteristics. The second layer may be a material having wave phase shift characteristic characteristics.…
Method and apparatus for an isolating structure
Granted: August 9, 2016
Patent Number:
9409765
The present invention relates to a method and apparatus for an isolating structure. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.
Sacrificial pad on semiconductor package device and method
Granted: July 19, 2016
Patent Number:
9397027
A semiconductor package device, electronic device, and fabrication methods are described that include at least one sacrificial contact pad as a portion of the semiconductor package device for preventing and reducing stress on the semiconductor package device and increasing board level reliability. In implementations, the semiconductor package device includes a lead frame substrate including at least one lead frame contact pad and at least one sacrificial contact pad, an integrated…
Method and device for contactless sensing rotation and angular position using orientation tracking
Granted: July 5, 2016
Patent Number:
9383186
Method and device for contactless sensing rotation and angular position using orientation tracking. 2.1 To improve the accuracy and possible resolution of a magnetic positioning system, a method and a device using a special tracking technique is proposed. 2.2 The method and the device are using multiple magnetic field sensing elements at different positions below a magnetic target. The sensed signals are used to select or combine the sensing elements for a best approach to the actual…
Dynamic speaker management for multichannel audio systems
Granted: July 5, 2016
Patent Number:
9385674
A multiband limiter with selective sideband linking includes first and second frequency band splitters, a first and second plurality of limiters, first and second summers, and a plurality of selectable links coupling the first plurality of limiters to the second plurality of limiters. The first plurality of limiters each have a band input coupled to one of the first plurality of band outputs, a link port and a limiter output, and the first summer is receptive to the limiter outputs of…
