Method and device for contactless sensing rotation and angular position using orientation tracking
Granted: July 5, 2016
Patent Number:
9383186
Method and device for contactless sensing rotation and angular position using orientation tracking. 2.1 To improve the accuracy and possible resolution of a magnetic positioning system, a method and a device using a special tracking technique is proposed. 2.2 The method and the device are using multiple magnetic field sensing elements at different positions below a magnetic target. The sensed signals are used to select or combine the sensing elements for a best approach to the actual…
Controlling DC-to-DC converter duty cycle by shifting PWM ramp
Granted: June 21, 2016
Patent Number:
9374000
A system includes a pulse width modulator and a shift generator. The pulse width modulator receives a saw-tooth signal and generates pulse width modulated pulses based on the saw-tooth signal to regulate an output voltage of a DC-to-DC converter. The shift generator generates a DC voltage in response to a change in an input voltage of the DC-to-DC converter and shifts the saw-tooth signal by the DC voltage to regulate the output voltage of the DC-to-DC converter.
Circuits for active eyewear
Granted: June 21, 2016
Patent Number:
9372351
A circuit includes a front-end circuit, a receiver stage and a controller. An example front-end circuit includes a common base input device, a first current mirror and a second current mirror, where the common base input device has its emitter coupled to a photodiode, its collector coupled to an input of the first current mirror, and its base coupled to a reference voltage to reverse bias the photodiode and where an output of the first current mirror is input into the second current…
Proximity sensor device
Granted: June 21, 2016
Patent Number:
9372264
Proximity sensor devices are described that integrate a light emitting diode with a light sensor assembly in a single, compact package. The proximity sensor devices comprise a substrate having a surface. The light emitting diode and light sensor assembly are mounted to the substrate proximate to the surface. The light emitting diode is configured to emit electromagnetic radiation in a limited spectrum of wavelengths, while the light sensor assembly is configured to detect electromagnetic…
Glass based multichip package
Granted: June 21, 2016
Patent Number:
9371982
In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed…
Communication methods and apparatus and power supply controllers using the same
Granted: June 14, 2016
Patent Number:
9367502
Communication methods and apparatus and power supply controllers using the same. The method includes transferring information over a line from a first location to a second location as a voltage signal while simultaneously transferring information over the same line from the second location to the first location as a current signal. Further, digital information may be transmitted over the same line. When applied to a power supply controller system, a master controller may control a…
System and method to securely transfer data
Granted: June 14, 2016
Patent Number:
9369447
Various embodiments of the invention achieve optimal data security by adding a security layer to data at the point of generation. Some embodiments add a security feature to data that controls or configures a device at a physical interface.
Interconnect structures for minimizing clock and output timing skews in a high speed current steering DAC
Granted: June 14, 2016
Patent Number:
9369141
A system includes a clock interconnect network having an input node and a plurality of output nodes. The clock interconnect network receives a clock input at the input node and distributes, based on the clock input, a plurality of clock signals via respective ones of the plurality of output nodes. A propagation delay of each of the plurality of clock signals distributed by the clock interconnect network is approximately equal to respective propagation delays of others of the plurality of…
Method and apparatus for generating piezoelectric transducer excitation waveforms using a boost converter
Granted: June 14, 2016
Patent Number:
9369127
Transducers formed as part of a touchscreen system emulate the motion of a pushbutton or other mechanical elements. A touchscreen system positions a transducer adjacent to an icon displayed on the touchscreen surface. When a user touches the icon, the transducer senses the touch and is then deformed in a pattern that emulates a mechanical motion, giving the user the sensation of touching a mechanical button. An excitation signal applied to the transducer is compared to a target…
Bump I/O contact for semiconductor device
Granted: June 14, 2016
Patent Number:
9368466
A bump contact electrically connects a conductor on a substrate and a contact pad on a semiconductor device mounted to the substrate. The first end of an electrically conductive pillar effects electrical contact and mechanical attachment of the pillar to the contact pad with the pillar projecting outwardly from the semiconductor device. A solder crown reflowable at a predetermined temperature into effecting electrical contact and mechanical attachment with the conductor is positioned in…
Systems and methods to extend ROM functionality
Granted: June 14, 2016
Patent Number:
9367482
Various embodiments allow for flexible and secure updates of drivers for numerous types of external memory devices by utilizing an address-selection mechanism within a simple and secure ROM code to enable the loading of a dynamic routine from an external source into a dynamic memory. In certain embodiments, the routine enables a simple and trusted framework to access and modify the content of any number of complex memory devices via simple commands without affecting existing security…
System and method to reduce power consumption in a multi-sensor environment
Granted: June 14, 2016
Patent Number:
9367119
Various embodiments of the invention provide for fully-integrated, low-latency power reduction in multi-sensor systems. In certain embodiments, power consumption is minimized by modulating power and mode of operation of gyroscopes, magnetometers, and accelerometers under certain conditions. Certain embodiments provide for reduction of power consumption by the use of emulated gyroscope data.
Planar diffractive optical element lens and method for producing same
Granted: June 14, 2016
Patent Number:
9366877
A planar diffractive optical element (DOE) lens is described herein. The planar DOE lens includes a substrate. The planar DOE lens further includes a first layer, the first layer being formed upon the substrate. The planar DOE lens further includes a diffractive optical element, the diffractive optical element being formed upon the first layer. The planar DOE lens further includes a second layer, the second layer being formed upon the first layer. The second layer is also formed over the…
System characteristic identification systems and methods
Granted: June 7, 2016
Patent Number:
9362942
A digital to analog converter samples a first digital signal to produce first digital values and that outputs a first analog signal corresponding to the first digital values to a system. A mixer mixes a second analog signal output by the system in response to the first analog signal with a periodic signal to produce a mixed signal. An integrator integrates the mixed signal and generates an integrator signal based on the integration. An analog to digital converter converts samples of the…
SAS expander with non-blocking virtual phy architecture
Granted: June 7, 2016
Patent Number:
9361256
A SAS expander includes a switch core, a number of SAS expander phys coupled to the switch core, an SMP originator coupled to the switch core and an SMP receptor coupled to the switch core. In an embodiment, the SMP originator is configured to only send connection requests and the SMP receptor is configured to only receive connection requests. Program instructions stored in non-transient digital storage media include code segments detecting a new connection request, code segments…
MEMS pressure sensor with improved insensitivity to thermo-mechanical stress
Granted: May 31, 2016
Patent Number:
9352955
This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention improve pressure sensor performance (e.g., absolute and relative accuracy) by increasing pressure insensitivity to changes in thermo-mechanical stress. The pressure insensitivity can be achieved by using the array of pressure sensing membranes, suspended…
Optical isolator preventive measure indicator
Granted: May 31, 2016
Patent Number:
9356693
A system includes a light emitting device on a first side of electrically isolated circuitry for transmitting an optical signal to a second side of the electrically isolated circuitry. The system also includes an optical receiver on the second side of the electrically isolated circuitry for receiving the optical signal from the light emitting device. The system further includes a sensor coupled with the optical receiver for sampling the intensity of the optical signal received by the…
Highly integrated flex sensor package
Granted: May 31, 2016
Patent Number:
9356003
Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an adhesive layer window, and a stiffener assembly with a stiffener window on a first side of the flex printed circuit and a semiconductor die on a second side of the flex printed circuit. In implementations, fabricating the flex sensor package includes receiving a flex printed circuit including at least one flex window, placing an…
Silicon shield for package stress sensitive devices
Granted: May 31, 2016
Patent Number:
9355968
A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit…
Wafer level lens in package
Granted: May 31, 2016
Patent Number:
9354111
A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for…
