Wafer level packaging using a lead-frame
Granted: July 22, 2014
Patent Number:
8785248
Wafer level packaging using a lead-frame. When used to package two or more chips, a final product having QFN package-like finish. The final product will also have a performance rivaling or exceeding that of a corresponding monolithic chip because of the very close connection of the two or more chips and the ability to tailor the fabrication processing of each chip to only that required for the devices on that chip. The wafer level packaging can also be used to package monolithic chips,…
System and method for transmitting audio data over serial link
Granted: July 15, 2014
Patent Number:
8780939
System and method for transmitting video and audio data words via a serial data link. A transmitting device includes a first module for generating an audio data frame comprising an audio data word and a frame separation code; and a second module for generating high speed data frames each comprising at least a portion of a video data word and only a portion of the audio data frame, and for transmitting the high speed data frames via the serial data link. A receiving device includes a…
System and method for applying multi-tone OFDM based communications within a prescribed frequency range
Granted: July 15, 2014
Patent Number:
8780691
According to one embodiment of the invention, an integrated circuit comprises an encoding module, a modulation module and a spectral shaped module. The encoding module includes an interleaver that adapted to operate in a plurality of modes including a first mode and a second mode. The interleaver performs repetitive encoding when placed in the second mode. The modulation module is adapted to compensate for attenuations that are to be realized during propagation of a transmitted signal…
Multi-LO band switched-core frequency mixer
Granted: July 15, 2014
Patent Number:
8779834
A frequency mixer is disclosed. In an implementation, the multi-LO band switched-core includes a single field-effect transistor (FET) ring having a first mixer core and a second mixer core. The first mixer core and the second mixer core configured to connect to a radio frequency (RF) port and an intermediate frequency (IF) port. The frequency mixer also includes a first local oscillator (LO) transformer and a second LO transformer. The first LO transformer is configured to furnish a…
Light sensor having transparent substrate with lens formed therein
Granted: July 15, 2014
Patent Number:
8779540
Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured…
Micro gyroscope for determining rotational movements about three spatial axes which are perpendicular to one another
Granted: July 15, 2014
Patent Number:
8776599
A micro gyroscope determine three-dimensional rotational movements is mounted on a substrate on which a plurality of masses tangentially oscillate about the z axis perpendicular to the substrate. The oscillating masses are fastened to the substrate by springs and bolts. Driving elements maintain oscillating tangential vibrations of the masses about the z axis. Upon rotation of the substrate about any spatial axis, the masses are subjected to deflections caused by Corolis forces that are…
Analog to digital address detector circuit
Granted: July 1, 2014
Patent Number:
8766842
An analog to digital detector circuit includes a comparator circuit and a counter that generates a digital counter value. A digital to analog converter receives an inverse of the digital counter value of the counter and generates a first voltage. A variable current source receives the digital counter value of the counter and generates a first current.
Electronic transformer compatibility for light emitting diode systems
Granted: July 1, 2014
Patent Number:
8766557
Various embodiments of the invention provide power factor correction in solid state lighting applications. In certain embodiments, an LED driver for an LED array is controlled for power factor correction by a control circuit block. The control circuit block comprises electronic circuitry that enables the input current to the LED driver to be measured and controlled. This control circuit block comprises at least one switching device that enables an alternating form of current at a…
Ambient light based gesture detection
Granted: July 1, 2014
Patent Number:
8766162
A gesture sensing device includes one or more sensors and a processor for processing sensed voltages output from the sensors based on ambient light and/or reflected light received by the sensors. The processor determines an ambient light level and/or a distance between the target and the sensors such that, if the ambient light level exceeds an ambient light threshold and/or the distance is less than a distance threshold, the processor determines the motion of a target relative to the…
Light sensor having transparent substrate and diffuser formed therein
Granted: June 10, 2014
Patent Number:
8749007
A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is…
Semiconductor device having a through-substrate via
Granted: June 10, 2014
Patent Number:
8748232
Semiconductor devices are described that include a via that extends only partially through the substrate. Through-substrate vias (TSV) furnish electrical interconnectivity to electronic components formed in the substrates. In implementations, the semiconductor devices are fabricated by first bonding a semiconductor wafer to a carrier wafer with an adhesive material. The semiconductor wafer includes an etch stop disposed within the wafer (e.g., between a first surface a second surface of…
Integrated circuit with precision current source
Granted: June 3, 2014
Patent Number:
8742800
An integrated circuit with precision current source includes a first MOSFET, a second MOSFET, an op-amp and a resistor formed on a common semiconductor substrate. The first MOSFET is characterized by a first multiplier (xM1) and the second MOSFET is characterized by a second multiplier (xM2) where a ratio of xM2 to xM1 is greater than one. An inverting input of the op-amp is coupled to a drain of the first MOSFET and an output of the op-amp is coupled to a gate of the first MOSFET.
Magnetic amplifier assisted LED constant current sink overhead voltage regulation
Granted: June 3, 2014
Patent Number:
8742685
A power circuit include a plurality of LED strings, each LED string having multiple LEDs connected in series. A plurality of magnetic amplifiers, reset current sources, and a control circuit are used to drive each LED string with equal current and to independently regulate the amount of voltage supplied to each LED to maximize efficiency. One magnetic amplifier, one reset current source, and one current sink are dedicated to each LED string. The control circuit measures the voltage drop…
Semiconductor device having a through-substrate via
Granted: June 3, 2014
Patent Number:
8742574
Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a top wafer and a bottom wafer bonded together with a patterned adhesive material. The top wafer and the bottom wafer include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the top and bottom wafers. A via is formed through the top wafer…
Voltage controlled variable attenuator
Granted: May 27, 2014
Patent Number:
8736344
Voltage controlled variable attenuators are described that are configured to be coupled to a transmission path to furnish variable attenuation of a signal, such as a radio frequency signal. In one or more implementations, the voltage controlled variable attenuator includes at least one transistor. The transistor has an open configuration for at least substantially preventing the flow of current through the transistor, and a closed configuration for at least partially allowing the flow of…
Method and device for contactless sensing rotation and angular position using orientation tracking
Granted: May 27, 2014
Patent Number:
8736258
1. Method and device for contactless sensing rotation and angular position using orientation tracking. 2.1 To improve the accuracy and possible resolution of a magnetic positioning system, a method and a device using a special tracking technique is proposed. 2.2. The method and the device are using multiple magnetic field sensing elements at different positions below a magnetic target. The sensed signals are used to select or combine the sensing elements for a best approach to the actual…
Single-wire data interface for programming, debugging and testing a programmable element
Granted: May 20, 2014
Patent Number:
8732526
Various embodiments of the present invention relate to systems, devices and methods of employing a single-wire data interface to program, debug and test a programmable element. A 1-WireLoader system comprises a programming entity, a physical-layer interface device, a single signal wire and the programmable element. The programming entity generates a command sequence comprising a plurality of commands. Each command in the plurality of commands is associated with a data in a plurality of…
Analog front end protocol converter/adapter for SLPI protocol
Granted: May 20, 2014
Patent Number:
8730978
In an embodiment, an analog front end (AFE) bridge for a SLPI PHY includes: an AFE LINK-side circuit having at least one pair of differential LINK-side nodes which does not conform to SLPI PHY specifications; an AFE PHY-side circuit having a pair of differential PHY-side nodes conforming to SLPI PHY specifications, wherein the AFE PHY-side circuit is coupled to the AFE LINK-side circuit; and a termination control circuit coupled to the AFE PHY-side circuit. A method of bridging a legacy…
USB dedicated charger identification circuit
Granted: May 13, 2014
Patent Number:
8723476
In an embodiment, set forth by way of example and not limitation, a USB dedicated charger identification circuit includes a USB D+ port, a USB D? port, a first circuit conforming to a first identification protocol, a second circuit conforming to a second identification protocol, and logic selectively coupling one of the first circuit and the second circuit to the USB D+ port and the USB D? port. In an alternate embodiment set forth by way of example and not limitation, a method to…
Systems and methods for feed-forward control of load current in DC to DC buck converters
Granted: May 13, 2014
Patent Number:
8723499
A feed-forward control system for load current in a direct current (DC) to DC converter includes a current normalization module, a feed-forward generation module, and a duty cycle generation module. The current normalization module generates a normalized load current by matching a gain of a measured load current to a gain of an inductor current. The feed-forward generation module that generates a load current feed-forward (LCFF) signal based on the normalized load current. The duty cycle…
