EMBEDDED CAPACITIVE STACK
Granted: September 11, 2008
Application Number:
20080216298
A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive…
Micro-Laboratory
Granted: March 6, 2008
Application Number:
20080056962
A compact module capable of performing one or more laboratory tests in nano-scale and/or micro-scale structures is provided. Such compact module may be made on silicon substrates by using manufacturing techniques typically applied to electronic and/or semiconductor manufacturing/fabrication. One aspect of the invention applies curling film technology to create and link three-dimensional elements that allow miniaturization of laboratory components and functions.
PRINTED CIRCUIT BOARDS AND THE LIKE WITH IMPROVED SIGNAL INTEGRITY FOR DIFFERENTIAL SIGNAL PAIRS
Granted: December 27, 2007
Application Number:
20070294890
A printed circuit board with improved signal integrity for one or more differential signal pairs incorporates one or more conductive regions. In an exemplary embodiment, via structures for the differential pair that interconnect signal traces are isolated from the conductive region by an antipad area around the via structures and a conductive bridge. In alternate embodiment, an antipad area around the via structures includes a bridge between the via structures. The antipad area may…
Method and process for embedding electrically conductive elements in a dielectric layer
Granted: August 16, 2007
Application Number:
20070187237
A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded…
Secure content delivery device
Granted: August 16, 2007
Application Number:
20070191975
A small form-factor electronic device is provided which is configured to store audio, text, and/or video content and control delivery of such content from a user interface on the electronic device. Such device may be coupled to an audio/visual playback device to receive and output the delivered content to users. The electronic device may also provide a security mechanism that inhibits unauthorized copying of the content stored in the electronic device. The electronic device may provide a…
Inline system for collecting stage-by-stage manufacturing metrics
Granted: July 26, 2007
Application Number:
20070173970
A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing…
Self-tuning radio frequency identification antenna system
Granted: April 26, 2007
Application Number:
20070091006
A self-tuning antenna that automatically adjusts its input impedance to compensate for externally induced impedance variations is provided. A variable impedance is adjusted by a control circuit to reconfigure the input impedance of than antenna to compensate for different environmental situations and different transponder mismatch situations. A negative-feedback signal is employed to determine or infer impedance mismatches and reconfigure the antenna input impedance (e.g., capacitance…
APPARATUS FOR STIFFENING A CIRCUIT BOARD
Granted: February 10, 2005
Application Number:
20050028360
A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective…
Temperature-controlled flexible optical circuit for use in an erbium-doped fiber amplifier and method for fabricating the flexible optical circuit
Granted: January 27, 2005
Application Number:
20050018950
A temperature-controlled flexible optical circuit includes a length of pre-fabricated optical fiber secured to a partially flexible heater circuit for heating and maintaining the optical fiber at a substantially constant temperature. Heater circuit may also comprise temperature sensors.
Circuit Board Threadplate
Granted: December 23, 2004
Application Number:
20040258500
A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount Technology robotic placement machines. Such circuit board threadplate comprises a hollow substantially cylindrical member forming an extruded neck having an elongated section and a substantially flat surface at a first end of…
Circuit board standoff
Granted: November 4, 2004
Application Number:
20040218371
A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required…
Method for optimizing high frequency performance of via structures
Granted: September 9, 2004
Application Number:
20040176938
A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. The method may involve the use of the S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC…
Current mode coupler having a unitary casing
Granted: November 28, 2002
Application Number:
20020175797
A current mode coupler includes a unitary casing, a stub cable connector, a circuit board, a magnetic structure, a wire core holder, an enclosing lid and an E-core situated in a cavity in the unitary casing and an I-core affixed to the enclosing lid. When the enclosing lid is in a closed position, the E-core and the I-core contact, forming a transformer. When electrical current is present in a data bus that is situated within the E-core/I-core arrangement, the coupler magnetically…
