DESIGN FOR TEST (DFT) READ SPEED THROUGH TRANSITION DETECTOR IN BUILT-IN SELF-TEST (BIST) SORT
Granted: July 3, 2014
Application Number:
20140185393
A memory is disclosed that can operate in a normal mode of operation or a testing mode of operation. In the testing mode of operation, the memory can measure various benchmarks of performance, such as read speed. The memory can perform an asynchronous read operation to read a word of electronic data that corresponds to an address or a page read operation in which multiple asynchronous read operations are performed to read multiple words of electronic data, also referred to as a page of…
Phoneme Score Accelerator
Granted: June 26, 2014
Application Number:
20140180694
Embodiments of the present invention include an acoustic processing device and a method for traversing a Hidden Markov Model (HMM). The acoustic processing device can include a senone scoring unit (SSU), a memory device, a HMM module, and an interface module. The SSU is configured to receive feature vectors from an external computing device and to calculate senones. The memory device is configured to store the senone scores and HMM information, where the HMM information includes HMM IDs…
Histogram Based Pre-Pruning Scheme for Active HMMS
Granted: June 26, 2014
Application Number:
20140180693
Embodiments of the present invention include an acoustic processing device, a method for acoustic signal processing, and a speech recognition system. The speech processing device can include a processing unit, a histogram pruning unit, and a pre-pruning unit. The processing unit is configured to calculate one or more Hidden Markov Model (HMM) pruning thresholds. The histogram pruning unit is configured to prune one or more HMM states to generate one or more active HMM states. The pruning…
Hybrid Hashing Scheme for Active HMMS
Granted: June 26, 2014
Application Number:
20140180690
Embodiments of the present invention include a data storage device and a method for storing data in a hash table. The data storage device can include a first memory device, a second memory device, and a processing device. The first memory device is configured to store one or more data elements. The second memory device is configured to store one or more status bits at one or more respective table indices. In addition, each of the table indices is mapped to a corresponding table index in…
Memory Device with Internal Combination Logic
Granted: June 26, 2014
Application Number:
20140177375
Embodiments of the present invention include an apparatus, method, and system for integrating data processing logic with memory. An embodiment of a memory integrated circuit is designed to execute a task on the data in a memory array within a memory integrated circuit. The memory integrated circuit can include a memory array, a data access component, a data holding component, and a logic component. The data access component can be coupled to the memory array and configured to provide an…
Chip Positioning in Multi-Chip Package
Granted: June 26, 2014
Application Number:
20140175613
Embodiments of the present invention include a substrate package, a method for multi chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a…
Use Disposable Gate Cap to Form Transistors, and Split Gate Charge Trapping Memory Cells
Granted: June 19, 2014
Application Number:
20140167142
A semiconductor device and method of making such device is presented herein. The method includes disposing a gate layer over a dielectric layer on a substrate and further disposing a cap layer over the gate layer. A first transistor gate is defined having an initial thickness substantially equal to a combined thickness of the cap layer and the gate layer. A first doped region is formed in the substrate adjacent to the first transistor gate. The cap layer is subsequently removed and a…
Charge Trapping Split Gate Device and Method of Fabricating Same
Granted: June 19, 2014
Application Number:
20140170843
Embodiments provide a split gate device, methods for fabricating a split gate device, and integrated methods for fabricating a split gate device and a periphery device. In an embodiment, the split gate device is a charge trapping split gate device, which includes a charge trapping layer. In another embodiment, the split gate device is a non-volatile memory cell, which can be formed according to embodiments as standalone or embedded with a periphery device.
THREE DIMENSIONAL CAPACITOR
Granted: June 19, 2014
Application Number:
20140167220
Integrated capacitor structures and methods for fabricating same are provided. In an embodiment, the integrated capacitor structures exploit the capacitance that can be formed in a plane that is perpendicular to that of the substrate, resulting in three-dimensional capacitor structures. This allows for integrated capacitor structures with higher capacitance to be formed over relatively small substrate areas. Embodiments are suitable for use by charge pumps and can be fabricated to have…
METHOD FOR AMNUFACTURING A SEMICONDUCTOR DEVICE
Granted: June 19, 2014
Application Number:
20140167211
A method of manufacturing a semiconductor device includes forming a silicon nitride film having an opening portion on a semiconductor substrate, forming a silicon oxide film on the silicon nitride film and on a side face of the opening portion, performing an etching treatment to the silicon oxide film so that a sidewall is formed on the side face of the opening portion, forming a trench on the semiconductor substrate with use of the sidewall and the silicon nitride film as a mask, and…
Charge Trapping Split Gate Embedded Flash Memory and Associated Methods
Granted: June 19, 2014
Application Number:
20140167141
Semiconductor devices and methods of manufacturing such devices are described herein. According to embodiments, the semiconductor device can be made by forming an dielectric layer at a first region and at a second region of a semiconductor substrate. A gate conductor layer is disposed over the dielectric formed in the first and the second regions of the semiconductor substrate, and the second region is masked. A split gate memory cell is formed in the first region of the semiconductor…
Memory First Process Flow and Device
Granted: June 19, 2014
Application Number:
20140167140
Semiconductor devices and methods of manufacturing such devices are described herein. According to embodiments, a semiconductor device includes a memory gate disposed in a first region of the semiconductor device. The memory gate may include a first gate conductor layer disposed over a charge trapping dielectric. A select gate may be disposed in the first region of the semiconductor device adjacent to a sidewall of the memory gate. A sidewall dielectric may be disposed between the…
Integrated Circuits With Non-Volatile Memory and Methods for Manufacture
Granted: June 19, 2014
Application Number:
20140167139
Semiconductor devices and the manufacture of such semiconductor devices are described. According to various aspects of the disclosure, a semiconductor device can include a memory region, a first logic region, and a second logic region. A select gate can be formed in the memory region of the device and a first logic gate formed in the logic region. A charge trapping dielectric can then be disposed and removed from a second logic region. A gate conductor layer can then be disposed on the…
HTO OFFSET FOR LONG LEFFECTIVE, BETTER DEVICE PERFORMANCE
Granted: June 19, 2014
Application Number:
20140167138
Memory devices having an increased effective channel length and/or improved TPD characteristics, and methods of making the memory devices are provided. The memory devices contain two or more memory cells on a semiconductor substrate and bit line dielectrics between the memory cells. The memory cell contains a charge trapping dielectric stack, a poly gate, a pair of pocket implant regions, and a pair of bit lines. The bit line can be formed by an implant process at a higher energy level…
High Voltage Gate Formation
Granted: June 19, 2014
Application Number:
20140167137
Embodiments described herein generally relate to methods of manufacturing charge-trapping memory by patterning the high voltage gates before other gates are formed. One advantage of such an approach is that a thin poly layer may be used to form memory and low voltage gates while protecting high voltage gates from implant penetration. One approach to accomplishing this is to dispose the layer of poly, and then dispose a mask and a thick resist to pattern the high voltage gates. In this…
Charge Trapping Device with Improved Select Gate to Memory Gate Isoloation
Granted: June 19, 2014
Application Number:
20140167136
Embodiments described herein generally relate to charge-trapping memory with improved isolation between a select gate and a memory gate. The isolation is improved because the charge trapping layer is not present in the junction between the select gate and the memory gate. The methods described herein additionally allow insulation to be disposed between the select gate and the memory gate.
Process Charging Protection for Split Gate Charge Trapping Flash
Granted: June 19, 2014
Application Number:
20140167135
A semiconductor device and method of making such device is presented herein. The semiconductor device includes a plurality of memory cells, a plurality of p-n junctions, and a metal trace of a first metal layer. Each of the plurality of memory cells includes a first gate disposed over a first dielectric, a second gate disposed over a second dielectric and adjacent to a sidewall of the first gate, a first doped region in the substrate adjacent to the first gate, and a second doped region…
Memory Gate Landing Pad Made From Dummy Features
Granted: June 19, 2014
Application Number:
20140167128
Embodiments described herein generally relate to landing gate pads for contacts and manufacturing methods therefor. A bridge is formed between two features to allow a contact to be disposed, at least partially, on the bridge. Landing the contact on the bridge avoids additional manufacturing steps to create a target for a contact.
GATE FRINGINE EFFECT BASED CHANNEL FORMATION FOR SEMICONDUCTOR DEVICE
Granted: June 12, 2014
Application Number:
20140159138
Methods and structures for forming semiconductor channels based on gate fringing effect are disclosed. In one embodiment, a NAND flash memory device comprises multiple NAND strings of memory transistors. Each memory transistor includes a charge trapping layer and a gate electrode formed on the charge trapping layer. The memory transistors are formed close to each other to form a channel between an adjacent pair of the memory transistors based on a gate fringing effect associated with the…
AUTHENTICATED MEMORY AND CONTROLLER SLAVE
Granted: June 12, 2014
Application Number:
20140165217
Systems and methods that can facilitate the utilization of a memory as a slave to a host are presented. The host and memory can provide authentication information to each other and respective rights can be granted based in part on the respective authentication information. The host can determine the available functionality of the memory. The host can activate the desired functionality in the memory and can request memory to perform the desired function(s) with regard to data stored in…
