SIGNAL PROCESSOR AND COMMUNICATION DEVICE
Granted: June 5, 2014
Application Number:
20140153589
A signal processor includes a period detection section which detects that a period is currently used for communication of a frame; a pattern detection section which detects, from the received signal, a first signal pattern by which the end of communication of the frame is recognized; and an output processing section which outputs the received signal to a controller; configured to instruct, upon detection of the first signal pattern in the period being currently used for communication of…
Memory Device Interconnects and Method of Manufacture
Granted: June 5, 2014
Application Number:
20140151887
An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines and staggered bit line contacts extend through the first inter-level dielectric layer. Each of a plurality of source line vias and a plurality of staggered bit line vias extend through the second inter-level dielectric layer to each respective one of the…
Forming Charge Trap Separation in a Flash Memory Semiconductor Device
Granted: May 29, 2014
Application Number:
20140148010
During formation of a charge trap separation in a semiconductor device, a polymer deposition is formed in a reactor using a first chemistry. In a following step, a second chemistry can be used to etch the polymer deposition in the reactor. The same or similar second chemistry can be used in a second etching step to expose a first oxide layer in each of the cells of the semiconductor device and to form a flat upper surface. This additional etch step can also be performed by the reactor,…
Forming a Substantially Uniform Wing Height Among Elements in a Charge Trap Semiconductor Device
Granted: May 29, 2014
Application Number:
20140148009
During formation of a charge trap separation in a semiconductor device, an organic material is formed over a plurality of cells. This organic material is selectively removed in order to create a flat upper surface. An etching process is performed to remove the organic material as well as a charge trap layer formed over the plurality of cells, thereby exposing underlying first oxide layers in each of the cells and forming charge trap separation. Further, because of the selective removal…
NON-VOLATILE FINFET MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Granted: May 29, 2014
Application Number:
20140148001
Methods for fabricating an electronic device and electronic devices therefrom are provided. A method includes forming one or more masking layers on a semiconducting surface of a substrate and forming a plurality of dielectric isolation features and a plurality of fin-type projections using the masking layer. The method also includes processing the masking layers and the plurality of fin-type projections to provide an inverted T-shaped cross-section for the plurality of fin-type…
PARALLEL BITLINE NONVOLATILE MEMORY EMPLOYING CHANNEL-BASED PROCESSING TECHNOLOGY
Granted: May 29, 2014
Application Number:
20140146606
Providing for a new combination of non-volatile memory architecture and memory processing technology is described herein. By way of example, disclosed is a parallel bitline semiconductor architecture coupled with a channel-based processing technology. The channel based processing technology provides fast program/erase times, relatively high density and good scalability. Furthermore, the parallel bitline architecture enables very fast read times comparable with drain-based tunneling…
Memory Device Interconnects and Method of Manufacture
Granted: May 29, 2014
Application Number:
20140145337
An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines extend through the first inter-level dielectric layer. Each of a plurality of source line vias extend through the second inter-level dielectric layer to each respective one of the plurality of source lines. Each of the plurality of staggered bit line…
Inter-Layer Insulator for Electronic Devices and Apparatus for Forming Same
Granted: May 22, 2014
Application Number:
20140138790
A semiconducting device utilizing air-gaps for inter-layer insulation and methods of producing the device are described. The device may be produced by forming a sacrificial layer between two structures. A porous membrane layer is then formed over the sacrificial layer. The membrane layer is porous to an etch product, which allows for the subsequent etching of the sacrificial layer leaving an air gap between the device structures and the membrane intact. The device may also include a cap…
DATA REFRESH IN NON-VOLATILE MEMORY
Granted: May 22, 2014
Application Number:
20140143473
A method of reducing read errors in a non-volatile memory device that result from bit-line or word-line disturb conditions generated by erase operations includes selecting a subset of a memory array for refresh after each erase operation. A pointer to the refresh target section is updated as part of the method to direct the refresh operation to the appropriate subset of the memory array. Refresh may be performed subsequent to an erase operation or concurrently therewith. By distributing…
Method to Improve Charge Trap Flash Memory Core Cell Performance and Reliability
Granted: May 22, 2014
Application Number:
20140141591
A semiconductor processing method to provide a high quality bottom oxide layer and top oxide layer in a charged-trapping NAND and NOR flash memory. Both the bottom oxide layer and the top oxide layer of NAND and NOR flash memory determines array device performance and reliability. The method describes overcomes the corner thinning issue and the poor top oxide quality that results from the traditional oxidation approach of using pre-deposited silicon-rich nitride.
Distribution of Gas Over A Semiconductor Water in Batch Processing
Granted: May 15, 2014
Application Number:
20140134332
A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from subsequent gas injections.
WEAR LEVELING IN FLASH MEMORY DEVICES WITH TRIM COMMANDS
Granted: May 8, 2014
Application Number:
20140129758
Systems and methods are provided to implement a memory device that includes a memory array having a plurality of sectors, a non-volatile memory that stores sector state information, and a memory controller that performs wear leveling according to the sector state information. The sector state information can specify respective states for respective sectors of the plurality of sectors of the memory array. The memory controller, based on the states of respective sectors, determines whether…
Recognition of Speech With Different Accents
Granted: May 8, 2014
Application Number:
20140129218
Computer-based speech recognition can be improved by recognizing words with an accurate accent model. In order to provide a large number of possible accents, while providing real-time speech recognition, a language tree data structure of possible accents is provided in one embodiment such that a computerized speech recognition system can benefit from choosing among accent categories when searching for an appropriate accent model for speech recognition.
ELECTRICALLY PROGRAMMABLE AND ERASEABLE MEMORY DEVICE
Granted: May 8, 2014
Application Number:
20140124848
The present claimed subject matter is directed to memory device that includes substrate, a tunneling layer over the substrate, a floating gate over the tunneling layer, a dielectric over the floating gate and including silicon oxynitride, and a control gate over the dielectric.
DATA WRITING METHOD AND SYSTEM
Granted: May 1, 2014
Application Number:
20140122785
A data writing method for writing data to a flash memory includes writing an initial value to the data storage area, determining whether or not the writing of the initial value is performed normally based on a write flag, writing data to the data storage area when the writing is performed normally, and erasing a block including the data storage area when the writing is not performed normally. An initial value is written to the data storage area before writing data, so that whether or not…
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Granted: May 1, 2014
Application Number:
20140120662
The present invention provides a semiconductor device with an improved yield ratio and reduced height and manufacturing cost; and a method of manufacturing the semiconductor device. According to an aspect of the present invention, there is provided a semiconductor device including a substrate, a semiconductor element that is flip-chip connected to the substrate, and a molding portion that seals the semiconductor element. The side surfaces of the semiconductor element are enclosed by the…
INTEGRATING TRANSISTORS WITH DIFFERENT POLY-SILICON HEIGHTS ON THE SAME DIE
Granted: May 1, 2014
Application Number:
20140117435
A method of fabricating an integrated circuit including a first region and a second region each having different poly-silicon gate structures is provided. The method includes depositing a first poly-silicon layer over the first and the second region and depositing, within the second region, an oxide layer over the first poly-silicon layer. A second poly-silicon layer is deposited over the first poly-silicon layer and the oxide region. A portion of the second poly-silicon layer that lies…
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
Granted: April 24, 2014
Application Number:
20140113411
A semiconductor device which includes a first semiconductor chip 10, a first electrode 12 formed on the first semiconductor chip 10, a second semiconductor chip 20 to which the first semiconductor chip 10 is mounted, a second electrode 22 with a protrusion 24, which is formed on the second semiconductor chip 20, and a solder bump 14 which bonds the first electrode 12 and the second electrode 22 to cover at least a part of a side surface of the protrusion 24, and a method for…
PARTIAL LOCAL SELF BOOSTING FOR NAND
Granted: April 17, 2014
Application Number:
20140104957
A memory system is programmed with minimal program disturb and reduced junction and channel leakage during self-boosting. Pre-charging bias signals are applied to word lines adjacent to a selected word line before a program signal is applied to the selected word line and a pass signal is applied to the remaining word lines. The pre-charging bias signals apply a pre-charge to the memory cells. The pre-charging bias signals are chosen to improve the isolation of the memory cells on word…
Output Voltage Controller, Electronic Device, and Output Voltage Control Method
Granted: April 10, 2014
Application Number:
20140097820
An output voltage controller includes a first controller which controls current supply to a inductor based on an output voltage, and a second controller which controls current supply to the inductor by controlling a period when an input end to which an input voltage is inputted, the inductor, and an output end from which the output voltage is outputted are coupled based on the input voltage.
