INTEGRATED CIRCUIT WITH SHIELDING STRUCTURES
Granted: March 15, 2018
Application Number:
20180076134
A semiconductor device includes an interconnect structure disposed over a semiconductor substrate. The interconnect structure includes a first device disposed in a first portion of the interconnect structure. A first shielding plane including a first conductive material is disposed in a second portion of the interconnect structure over the first portion of the interconnect structure. A second device is disposed in a third portion of the interconnect structure over the second portion of…
DYNAMIC POWER REDUCTION IN CIRCUIT DESIGNS AND CIRCUITS
Granted: March 15, 2018
Application Number:
20180075172
Reducing dynamic power consumption for a circuit can include analyzing, using a processor, a netlist specifying the circuit to determine a block of combinatorial circuitry in a first signal path with at least a threshold amount of switching activity and detecting, using the processor, a second signal path coupled to the block of combinatorial circuitry by a sequential circuit element. The second signal path has a delay that meets a target signal path requirement. Using the processor, the…
AREA-EFFICIENT HIGH-ACCURACY BANDGAP VOLTAGE REFERENCE CIRCUIT
Granted: March 15, 2018
Application Number:
20180074533
An integrated circuit includes a reference voltage circuit. The reference voltage circuit includes a bipolar junction transistor (BJT) configured to receive a first current during a first phase of a clock cycle to generate a first base-emitter junction voltage, and receive a second current during a second phase of the clock cycle to generate a second base-emitter junction voltage. The reference voltage circuit includes a switched capacitor circuit configured to provide a reference…
VERSATILE TESTING SYSTEM
Granted: March 1, 2018
Application Number:
20180059174
A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, an IC test system is provide that includes a robot, an input queuing station, an output queuing station, and a test station. The test station includes a first and second test interfaces. The first test interface is configurable to receive and communicatively connect with a first chip package assembly having one arrangement of solder ball connections. The second test…
STANDALONE INTERFACE FOR STACKED SILICON INTERCONNECT (SSI) TECHNOLOGY INTEGRATION
Granted: February 15, 2018
Application Number:
20180047663
Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to an existing qualified stacked silicon interconnect (SSI) technology programmable IC die (e.g., a super logic region (SLR)) without changing the programmable IC die (e.g., adding or removing blocks). One example integrated circuit (IC) package generally includes a package substrate; at least one interposer disposed above the package substrate and comprising a plurality of…
IMPEDANCE AND SWING CONTROL FOR VOLTAGE-MODE DRIVER
Granted: February 8, 2018
Application Number:
20180041232
A driver circuit includes a plurality of output circuits coupled in parallel between a differential input and a differential output and having a first common node and a second common node. Each of the plurality of output circuits includes a series combination of a pair of inverters and a pair of resistors, coupled between the differential input and the differential output; first source terminals of the pair of inverters coupled to the first common node; and second source terminals of the…
BINARY NEURAL NETWORKS ON PROGAMMABLE INTEGRATED CIRCUITS
Granted: February 8, 2018
Application Number:
20180039886
In an example, a circuit of a neural network implemented in an integrated circuit (IC) includes a layer of hardware neurons, the layer including a plurality of inputs, a plurality of outputs, a plurality of weights, and a plurality of threshold values, each of the hardware neurons including: a logic circuit having inputs that receive first logic signals from at least a portion of the plurality of inputs and outputs that supply second logic signals corresponding to an exclusive NOR (XNOR)…
HETEROGENEOUS BALL PATTERN PACKAGE
Granted: February 1, 2018
Application Number:
20180033753
Methods and apparatus are described for strategically arranging conductive elements (e.g., solder balls) of an integrated circuit (IC) package (and the corresponding conductive pads of a circuit board for electrical connection with the IC package) using a plurality of different pitches. One example integrated circuit (IC) package generally includes an integrated circuit die and an arrangement of electrically conductive elements coupled to the integrated circuit die. In at least one…
MODULAR TESTING SYSTEM WITH VERSATILE ROBOT
Granted: January 18, 2018
Application Number:
20180017619
A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, the testing system includes a robot disposed in an enclosure and having a range of motion operable to transfer a chip package assembly between any of a first queuing station, a second queuing station and a plurality of test stations. The system also includes an automatic identification and data capture (AIDC) device operable to read an identification tag affixed to a…
METHOD AND APPARATUS FOR CLOCK PHASE GENERATION
Granted: January 11, 2018
Application Number:
20180013435
A method, non-transitory computer readable medium, and circuit for clock phase generation are disclosed. The circuit includes an injection locked oscillator, a loop controller, and a phase interpolator. The injection locked oscillator includes an input for receiving an injected clock signal and an output for forwarding a set of fixed clock phases. The loop controller includes an input for receiving a phase separation error of the fixed clock phases and an output for forwarding a supply…
CIRCUIT FOR AND METHOD OF IMPLEMENTING A SCAN CHAIN IN PROGRAMMABLE RESOURCES OF AN INTEGRATED CIRCUIT
Granted: December 28, 2017
Application Number:
20170373692
A circuit for implementing a scan chain in programmable resources of an integrated circuit is described. The circuit comprises a programmable element configured to receive an input signal and generate an output signal based upon the input signal; a selection circuit configured to receive the output signal generated by the programmable element at a first input and to receive a scan chain input signal at a second input, wherein the selection circuit generates a selected output signal in…
STACKED SILICON PACKAGE ASSEMBLY HAVING CONFORMAL LID
Granted: December 28, 2017
Application Number:
20170372979
A chip package assembly and method for fabricating the same are provided which utilize a conformal lid to improve the chip package assembly from deformation. In one example, a chip package assembly is provided that includes integrated circuit (IC) dies, a packaging substrate, and a lid. The packaging substrate has a die receiving area that is defined by the laterally outermost extents of the IC dies mounted to the packaging substrate. The lid a surface that includes a first region and a…
CIRCUIT FOR AND METHOD OF RECEIVING AN INPUT SIGNAL
Granted: November 30, 2017
Application Number:
20170346455
A circuit for receiving an input signal is described. The receiver comprises a first receiver input configured to receive a first input of a differential input signal; a second receiver input configured to receive a second input of a differential input signal; a differential pair having an inverting input and a non-inverting input; a first impedance matching element coupled to the differential pair, wherein the first impedance matching element provides DC impedance matching from the…
MEMORY PRE-FETCH FOR VIRTUAL MEMORY
Granted: November 30, 2017
Application Number:
20170344482
Virtual memory pre-fetch requests are generated for a virtual memory and a multiple port memory management unit (MMU) circuit. Virtual memory access requests sent to a particular port of the MMU circuit are monitored. In response to the satisfaction of a trigger condition, virtual memory pre-fetch requests are generated and transmitted to the MMU circuit using the particular port. Physical access requests from the MMU circuit are monitored for physical addresses corresponding to the…
SINGLE EVENT UPSET (SEU) MITIGATION FOR FINFET TECHNOLOGY USING FIN TOPOLOGY
Granted: October 5, 2017
Application Number:
20170287919
Front end circuits that include a FinFET transistor are described herein. In one example, the front end circuit has a FinFET transistor that includes a channel region wrapped by a metal gate, the channel region connecting a source and drain fins. At least one of the source and drain fins have a height (HTOT) and a width W. The height (HTOT) is greater than an optimal height (HOPT), wherein the height HOPT is a height that would optimize speed of a FinFET transistor having the width W.
HALF-RATE INTEGRATING DECISION FEEDBACK EQUALIZATION WITH CURRENT STEERING
Granted: September 14, 2017
Application Number:
20170264467
Apparatuses and method relating to DFE include a decision feedback equalizer with first and second integrating summers configured to receive an input differential signal. A bias current circuit is configured to alternate biasing of the first and second integrating summers. The first and second integrating summers alternately integrate, during clock signal phases of a clock signal and its complement, for transconductance of the input differential signal to a first output differential…
LINEAR GAIN CODE INTERLEAVED AUTOMATIC GAIN CONTROL CIRCUIT
Granted: August 24, 2017
Application Number:
20170244371
An example automatic gain control (AGC) circuit includes a base current-gain circuit having a programmable source degeneration resistance responsive to first bits of an AGC code word. The AGC circuit further includes a programmable current-gain circuit, coupled between an input and an output of the base current-gain circuit, having a programmable current source responsive to second bits of the AGC code word. The AGC circuit further includes a bleeder circuit, coupled to the output of the…
CHIP PACKAGE ASSEMBLY WITH POWER MANAGEMENT INTEGRATED CIRCUIT AND INTEGRATED CIRCUIT DIE
Granted: August 17, 2017
Application Number:
20170236809
A chip package assembly is provided that includes a substrate, at least one integrated circuit (IC) die and a power management integrated circuit (PMIC). In one example, the IC die of the chip package assembly is disposed on a first surface of the substrate. The PMIC die has a first surface having outputs electrically coupled to the second surface of the IC die. The PMIC die also has a second surface facing away from the first surface. The second surface of the PMIC die has inputs that…
SYSTEM-LEVEL INTERCONNECT RING FOR A PROGRAMMABLE INTEGRATED CIRCUIT
Granted: August 3, 2017
Application Number:
20170220508
An example programmable integrated circuit (IC) includes a programmable fabric having a programmable interconnect and wire tracks adjacent to at least one edge of the programmable fabric. The programmable IC further includes at least one ring node integrated with at least one edge of the programmable fabric, the at least one ring node coupled between the programmable interconnect and the wire tracks. The programmable IC further includes a system-in-package (SiP) input/output (IO) circuit…
ACTIVE-BY-ACTIVE PROGRAMMABLE DEVICE
Granted: August 3, 2017
Application Number:
20170220509
An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package…
