DIGITAL PRE-DISTORTION IN A COMMUNICATION NETWORK
Granted: May 15, 2014
Application Number:
20140133527
A method of performing digital pre-distortion in a communication network is described. The method comprises implementing a transceiver in the communication network, the transceiver enabling the transfer of communication signals in the communication network by way of a wireless communication channel; sampling signals, at the transceiver, associated with a transmit signal which are necessary to perform digital pre-distortion; providing the sampled signals to a remote computer; and…
CONFIGURABLE EMBEDDED MEMORY SYSTEM
Granted: May 15, 2014
Application Number:
20140133246
An embodiment of a memory module is disclosed. This memory module is a configurable hard macro. A portion of this memory module includes a data input multiplexer coupled to select between cascaded data and direct/bused data. Such portion further includes, a memory coupled to receive output from the data input multiplexer for storage therein, and a register input multiplexer coupled to select between read data from the memory and the cascaded data. This memory module further includes: a…
SYSTEM AND METHOD FOR REDUCING EFFECTS OF SWITCHED CAPACITOR KICKBACK NOISE
Granted: May 15, 2014
Application Number:
20140132369
A circuit includes a first input terminal, a first transmission line, a first sampling switch coupled to the first input terminal through the first transmission line, a first sampling capacitor coupled to the sampling switch, and a first open-circuit quarter wavelength stub coupled to the first transmission line, the first open-circuit quarter wavelength stub configured to reduce kickback noise on the first transmission line. A method for reducing kickback noise in a circuit includes…
INDUCTOR STRUCTURE WITH PRE-DEFINED CURRENT RETURN
Granted: May 1, 2014
Application Number:
20140117494
An inductor structure implemented within a semiconductor integrated circuit includes a coil of conductive material including at least one turn and a current return encompassing the coil. The current return is formed of a plurality of interconnected metal layers of the semiconductor integrated circuit.
PLESIOCHRONOUS CLOCK GENERATION FOR PARALLEL WIRELINE TRANSCEIVERS
Granted: April 3, 2014
Application Number:
20140091843
A method for plesiochronous clock generation for parallel wireline transceivers, includes: inputting, into at least one decoder, at least one digital frequency mismatch number; decoding, with the at least one decoder, the at least one digital frequency mismatch number to obtain at least one digital frequency divider number that represents a transmit frequency associated with at least one signal; inputting the at least one digital frequency divider number into at least one fractional-N…
METHOD OF TESTING A SEMICONDUCTOR STRUCTURE
Granted: April 3, 2014
Application Number:
20140091819
An integrated circuit (IC) comprises routing circuitry including a plurality of signal line segments in routing layers of the IC, and a plurality of micro-bump contacts coupled to the routing circuitry. The IC includes a plurality of test circuits coupled to respective subsets of the plurality of signal line segments. Each test circuit is configured to connect micro-bump contacts in the respective subset to form first and second sets of daisy chains. Each test circuit is configured to…
CLOCK DOMAIN BOUNDARY CROSSING USING AN ASYNCHRONOUS BUFFER
Granted: March 27, 2014
Application Number:
20140089718
An apparatus includes a plurality of channels, where each of the channels includes an asynchronous buffer, a latency determination block, a tap selection circuit, and a variable delay. A latency locator is configured to identify a longest latency from among the channels and is coupled to provide the longest latency to the tap selection circuit of each of the channels. For each of the channels: the latency determination block is coupled to the asynchronous buffer to determine a latency…
REDUCING THE EFFECT OF PARASITIC MISMATCH AT AMPLIFIER INPUTS
Granted: March 27, 2014
Application Number:
20140085003
A circuit includes an amplifier including a differential input stage including a first input terminal and a second input terminal. The circuit further includes a differential input line coupled to the first input terminal and the second input terminal, and shielding at least partially encompassing the differential input line. The shielding is connected to a node of the differential input stage of the amplifier.
NOISE ATTENUATION WALL
Granted: March 27, 2014
Application Number:
20140084477
An embodiment of an apparatus is disclosed. For this embodiment of the apparatus, an interposer has first vias. First interconnects and second interconnects respectively are coupled on opposite surfaces of the interposer. A first portion of the first interconnects and a second portion of the first interconnects are spaced apart from one another defining an isolation region between them. A substrate has second vias. Third interconnects and the second interconnects are respectively coupled…
RECURSION UNIT SCHEDULING
Granted: February 20, 2014
Application Number:
20140050286
An embodiment of a decoder is disclosed. For this embodiment of the decoder, a first estimation unit and a second estimation unit are for iterative decoding. A scheduler is to receive a mode select signal to provide either an indication of first scheduling information or second scheduling information to the first estimation unit and the second estimation unit responsive to the mode select signal.
FLEXIBLE SIZED DIE FOR USE IN MULTI-DIE INTEGRATED CIRCUIT
Granted: February 20, 2014
Application Number:
20140049932
An integrated circuit (IC) structure can include a first die and a second die. The second die can include a first base unit and a second base unit. Each of the first base unit and the second base unit is self-contained and no signals pass between the first base unit and the second base unit within the second die. The IC structure can include an interposer. The interposer includes a first plurality of inter-die wires coupling the first die to the first base unit, a second plurality of…
INTEGRATED CIRCUIT HAVING IMPROVED RADIATION IMMUNITY
Granted: February 20, 2014
Application Number:
20140048887
An integrated circuit having improved radiation immunity is described. The integrated circuit comprises a substrate; an n-well formed on the substrate; a p-well formed on the substrate; and a p-tap formed in the p-well adjacent to the n-well, wherein the p-tap extends between circuit elements formed in the n-well and circuit elements formed in the p-well, and is coupled to a ground potential. A method of forming an integrated circuit having improved radiation immunity is also described.
RECEIVER HAVING A WIDE COMMON MODE INPUT RANGE
Granted: January 30, 2014
Application Number:
20140029143
In one embodiment, a differential amplifier is provided. Gates of a first differential pair of transistors, of a first conductivity type, and a second pair or transistors, of a second conductivity type are coupled to first and second input terminals of the differential amplifier. A first pair of adjustable current sources are configured to adjust respective tail currents of the first differential pair of transistors in response to a first bias current control signal. A second pair of…
METHODS FOR FLIP CHIP STACKING
Granted: January 16, 2014
Application Number:
20140017852
A method for flip chip stacking includes forming a cavity wafer comprising a plurality of cavities and a pair of corner guides, placing a through-silicon-via (TSV) interposer with solder bumps coupled to a surface of the TSV interposer on the cavity wafer, such that the solder bumps are situated in the plurality of cavities and the TSV interposer is situated between the pair of corner guides, placing an integrated circuit (IC) die on another surface of the TSV interposer, such that the…
OVERSIZED INTERPOSER
Granted: December 19, 2013
Application Number:
20130333921
An embodiment of an interposer is disclosed. For this embodiment of the interposer, a first circuit portion is created responsive to a first printing region. A second circuit portion is created responsive to a second printing region. The interposer has at least one of: (a) a length dimension greater than a maximum reticle length dimension, and (b) a width dimension greater than a maximum reticle width dimension.
DISTORTION TOLERANT CLOCK AND DATA RECOVERY
Granted: December 5, 2013
Application Number:
20130321047
A system can include a phase detector configured to generate a phase error signal indicating a phase error of an input signal compared to an output signal and a first filter coupled to the phase detector and configured to generate a first control signal derived from the phase error signal. The system can include a pattern error detector configured to generate a pattern error signal specifying a pattern error of the input signal compared to the output signal and a second filter coupled to…
CONDUCTOR STRUCTURE WITH INTEGRATED VIA ELEMENT
Granted: October 24, 2013
Application Number:
20130277099
An electrical circuit structure can include a first trace formed using a first conductive layer and a second trace formed using a second conductive layer. The first trace can be vertically aligned with the second trace. The electrical circuit structure can include a via segment formed of conductive material in a third conductive layer between the first conductive layer and the second conductive layer. The via segment can contact the first trace and the second trace forming a first…
PARALLEL ENCODING FOR NON-BINARY LINEAR BLOCK CODE
Granted: September 26, 2013
Application Number:
20130254639
An encoder module includes P/L parity shift registers that are sequentially coupled, wherein an input of a first parity shift register of the parity shift registers is coupled to the input of the encoder module, an output of the last parity shift register of the parity shift registers is coupled to the output of the encoder module, each of the parity shift registers being configured to store L parity digits. The encoder module also includes a feedback circuit comprising P/L parity…
STACKED DIE ASSEMBLY
Granted: August 22, 2013
Application Number:
20130214432
Embodiments of stacked die assemblies for an IC are disclosed. One embodiment includes a first interposer; a second interposer; a first integrated circuit die, a second integrated circuit die, and a plurality of components. The first integrated circuit die is interconnected to the first interposer and the second interposer, and the second integrated circuit die is interconnected to the second interposer. The plurality of components interconnect the first integrated circuit die to the…
HIGH VOLTAGE RC-CLAMP FOR ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Granted: August 22, 2013
Application Number:
20130215541
In accordance with some embodiments, an electrostatic discharge (ESD) protection circuit for high-voltage power rails includes an RC-triggered clamp having an RC-circuit having a resistor coupled between a first node and a second node, and a capacitor coupled between the second node and a third node. The RC-triggered clamp also has a transistor with a first source/drain, a gate, and a second source/drain, wherein the first source/drain is coupled to the first node, and the second…
