Xilinx Patent Grants

Network interface device

Granted: November 21, 2023
Patent Number: 11824830
A network interface device having a hardware module comprising a plurality of processing units. Each of the plurality of processing units is associated with its own at least one predefined operation. At a compile time, the hardware module is configured by arranging at least some of the plurality of processing units to perform their respective at least one operation with respect to a data packet in a certain order so as to perform a function with respect to that data packet. A compiler is…

Identifying alignment markers using partial correlators

Granted: November 21, 2023
Patent Number: 11824761
Methods and apparatus for detecting alignment markers in received data streams received via a plurality of data lanes are disclosed. Corresponding data streams may be received via respective data lanes in the plurality of data lanes, where each data stream includes alignment markers delineating data frames, and each alignment marker has a predefined bit pattern. For each respective data lane, a determination is made whether a specified portion of the received data stream has at least a…

Lossless compression using subnormal floating point values

Granted: November 21, 2023
Patent Number: 11824564
A disclosed compression method includes inputting a data set of floating point values from an input circuit to a compression circuit and detecting non-zero values and sequences of zero values in the data set. The compression circuit outputs, in response to detection of a non-zero value in the data set, the non-zero value to an output circuit. The compression circuit generates, in response to detection of a sequence of zero values in the data set, a subnormal floating point value having…

Pulse generator for injection locked oscillator

Granted: November 21, 2023
Patent Number: 11824548
A multiplication injection locked oscillator (MIILO) circuitry includes a ring injection locked oscillator (ILO) circuitry that outputs clock signals, a first switching circuitry and a second switching circuitry. The ring ILO circuitry includes a first path having first delay stages, and a second path having a second delay stages. The first switching circuitry is connected to the first path and a voltage supply node. The first switching circuitry receives a first control signal and a…

Transmit driver architecture with a jtag configuration mode, extended equalization range, and multiple power supply domains

Granted: November 21, 2023
Patent Number: 11824534
A transmit driver architecture with a test mode (e.g., a JTAG configuration mode), extended equalization range, and/or multiple power supply domains. One example transmit driver circuit generally includes one or more driver unit cells having a differential input node pair configured to receive an input data signal and having a differential output node pair configured to output an output data signal; a plurality of power switches coupled between the differential output node pair and one…

High-throughput regular expression processing with capture using an integrated circuit

Granted: November 14, 2023
Patent Number: 11816335
A system includes a first multi-port RAM storing an instruction table. The instruction table specifies a regular expression for application to a data stream and a second multi-port RAM configured to store a capture table having capture entries decodable for tracking position information for a sequence of characters matching a capture sub-expression of the regular expression. The system includes a regular expression engine processing the data stream to determine match states by tracking…

Breakout structure for an integrated circuit device

Granted: November 7, 2023
Patent Number: 11812544
Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second…

Programmed input/output mode

Granted: November 7, 2023
Patent Number: 11809367
A data processing system and method are provided. A host computing device comprises at least one processor. A network interface device is arranged to couple the host computing device to a network. The network interface device comprises a buffer for receiving data for transmission from the host computing device. The processor is configured to execute instructions to transfer the data for transmission to the buffer. The data processing system further comprises an indicator store configured…

Wafer-scale large programmable device

Granted: October 31, 2023
Patent Number: 11803681
The embodiments herein rely on cross reticle wires (also referred to as cross die wires) to provide communication channels between programmable dies already formed on a wafer. Using cross reticle wires to facilitate x-die communication can be three to four orders of magnitude faster than using general purpose I/O. With a wafer containing cross reticle wires, various device geometries can be generated at dicing time by cutting across different reticle boundaries. This allows up to full…

Predicting a performance metric based on features of a circuit design and explaining marginal contributions of the features to the prediction

Granted: October 17, 2023
Patent Number: 11790139
A design tool determines features of a circuit design and applies a first model to the features. The first model indicates a predicted value of a metric based on the plurality of features. The design tool applies an explanation model to the features, and the explanation model indicates levels of contributions by the features to the predicted value of the metric, respectively. The design tool selects a feature of the plurality of features based on the respective levels of contributions…

Chip bump interface compatible with different orientations and types of devices

Granted: October 10, 2023
Patent Number: 11784149
Embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. Each die has a bump interface structure that is connected to the other structure using traces in the interposer. However, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. Directly connecting the corresponding signals defined by the structures to each other may…

Expansion card with mezzanine level connector

Granted: October 3, 2023
Patent Number: 11778743
An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the…

Programmable device having hardened circuits for predetermined digital signal processing functionality

Granted: October 3, 2023
Patent Number: 11777503
An example programmable device includes a configuration memory configured to store configuration data; a programmable logic having a configurable functionality based on the configuration data in the configuration memory; a signal conversion circuit; a digital processing circuit; an endpoint circuit coupled to the signal conversion circuit through the digital processing circuit; wherein the digital processing circuit includes a first one or more digital processing functions implemented as…

Voltage sensing and biasing for wide supply range integrated circuit transceivers

Granted: October 3, 2023
Patent Number: 11777489
A disclosed circuit arrangement detects the supply voltage level to the “device” (SoC, chip, SiP, etc.) and adjusts bias voltages to receiver and transmitter circuits of the device to levels suitable for the device in response to the supply voltage ramping-up during a power-on reset (“POR”) sequence. The circuitry holds the receiver output at a constant logic value while the supply voltage is ramping up and the POR signal is asserted. The disclosed circuitry also protects the…

Command pattern sequencer for memory calibration

Granted: October 3, 2023
Patent Number: 11775457
In one example, a command pattern sequencer includes a set of registers to store values used to configure a command sequence for configuring a memory. The command pattern sequencer further includes state machine circuitry coupled to the set of registers, the state machine circuitry configured to generate and execute the command sequence. The command pattern sequencer still further includes timing circuitry configured to manage timing between commands of the command sequence.

Heterogeneous integration module comprising thermal management apparatus

Granted: September 26, 2023
Patent Number: 11769710
Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second…

Compaction of multiplier and adder circuits

Granted: September 26, 2023
Patent Number: 11768663
Approaches for logic compaction include inputting an optimization directive that specifies one of area optimization or speed optimization to a synthesis tool executing on a computer processor. The synthesis tool identifies a multiplier and/or an adder specified in a circuit design and synthesizing the multiplier into logic having LUT-to-LUT connections between LUTs on separate slices of a programmable integrated circuit (IC) in response to the optimization directive specifying speed…

Integrated circuit device with edge bond dam

Granted: September 19, 2023
Patent Number: 11765836
An electronic device and methods for fabricating the same are disclosed herein that utilize a dam formed on a printed circuit board (PCB) that is positioned to substantially prevent edge bond material, utilized to secure a chip package to the PCB, from interfacing with the solder balls transmitting signals between the PCB and chip package.

Markov decision process based recipe generation for multi-chip apparatus

Granted: September 19, 2023
Patent Number: 11762958
Examples described herein provide for determining a recipe for identifying from which buckets integrated circuit chips are taken to form units of a multi-chip apparatus. In an example, a method uses a processor-based system and uses a Markov Decision Process. Buckets are defined based on respective characteristics of manufactured chips. Each of the manufactured chips is binned into a respective one of the buckets based on the characteristic of the respective manufactured chip. A recipe…

Static and automatic inference of inter-basic block burst transfers for high-level synthesis

Granted: September 19, 2023
Patent Number: 11762762
Static and automatic realization of inter-basic block burst transfers for high-level synthesis can include generating an intermediate representation of a design specified in a high-level programming language, wherein the intermediate representation is specified as a control flow graph, and detecting a plurality of basic blocks in the control flow graph. A determination can be made that plurality of basic blocks represent a plurality of consecutive memory accesses. A sequential access…