Alpha & Omega Semiconductor Profile

Alpha & Omega Semiconductor Patent Grants

Semiconductor package having wettable lead flanks and tie bars and method of making the same

Patent Number 12261101 - March 25, 2025

A semiconductor package includes a lead frame, a chip, and a molding encapsulation. The lead frame comprises a die paddle, a first plurality…

Intelligent power module containing exposed surfaces of transistor die supporting elements

Patent Number 12249562 - March 11, 2025

An intelligent power module (IPM) comprises a first transistor die supporting element, a second transistor die supporting element, a third…

Chip scale package (CSP) semiconductor device having thin substrate

Patent Number 12243808 - March 4, 2025

A semiconductor device comprises a semiconductor substrate, a plurality of metal layers, an adhesive layer, a compound layer, and a plurality…

Switch mode power converter with synchronous rectifier implementing adaptive gate voltage regulation for fast turn-off

Patent Number 12218602 - February 4, 2025

A power converter incorporating a synchronous rectifier implements adaptive gate voltage regulation for fast turn-off of the synchronous…

Low capacitance transient voltage suppressor with high holding voltage

Patent Number 12211834 - January 28, 2025

A transient voltage suppressor (TVS) device includes a silicon controlled rectifier (SCR) as the clamp device between a high-side steering…

Alpha & Omega Semiconductor Patent Applications

APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFECT TRANSISTORS

Application Number 20250118638 - April 10, 2025

A semiconductor package comprises a first device and a second device. The structure of the first semiconductor device is similar to that of…

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS

Application Number 20250112132 - April 3, 2025

A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises a top plate, a plurality of…

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

Application Number 20250096081 - March 20, 2025

A semiconductor package comprising a lead frame, a low side field-effect transistor (FET), a high side FET, a metal clip, an interposer, an…

CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND RAISED FRONT SIDE PAD AND METHOD OF MAKING THE SAME

Application Number 20250069973 - February 27, 2025

A chip scale semiconductor package comprises a silicon layer, a back side metal layer, and a plurality of front side pads. Each of the…

SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME

Application Number 20250070049 - February 27, 2025

A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a seed layer, a first thick metal layer, a second…

Alpha & Omega Semiconductor Federal District Court Decisions

Alpha and Omega Semiconductor Limited et al v. Force MOS Technology Co., Ltd.

California Northern District Court - December 13, 2023

ORDER denying 59 Motion to Strike. Signed by Judge P. Casey Pitts on 12/13/2023. (nmc, COURT USER) (Filed on 12/13/2023)

Third Dimension Semiconductor, Inc v. Alpha and Omega Semiconductor, Inc. et al

California Northern District Court - August 13, 2012

ORDER TERMINATING SEAN N. HSU AS COUNSEL. Signed by Judge Edward M. Chen on 8/13/12. (bpf, COURT STAFF) (Filed on 8/13/2012)

Third Dimension Semiconductor, Inc v. Alpha and Omega Semiconductor, Inc. et al

California Northern District Court - July 2, 2012

STANDING ORDER. Signed by Judge Edward M. Chen on 7/2/12. (bpf, COURT STAFF) (Filed on 7/2/2012)

Alpha & Omega Semiconductor State Court Decisions

Alpha and Omega Semiconductor Limited et al v. Force MOS Technology Co., Ltd.

California California Northern District Court - December 13, 2023

ORDER denying 59 Motion to Strike. Signed by Judge P. Casey Pitts on 12/13/2023. (nmc, COURT USER) (Filed on 12/13/2023)