Single chamber flowable film formation and treatments
Granted: November 12, 2024
Patent Number:
12142459
Exemplary processing methods may include forming a plasma of a silicon-containing precursor. The methods may include depositing a flowable film on a semiconductor substrate with plasma effluents of the silicon-containing precursor. The semiconductor substrate may be housed in a processing region of a semiconductor processing chamber. The processing region may be defined between a faceplate and a substrate support on which the semiconductor substrate is seated. The methods may include…
Conductive oxide overhang structures for OLED devices
Granted: November 12, 2024
Patent Number:
12144206
Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of…
Resonator, linear accelerator configuration and ion implantation system having rotating exciter
Granted: November 12, 2024
Patent Number:
12144101
An exciter for a high frequency resonator. The exciter may include an exciter coil inner portion, extending along an exciter axis, an exciter coil loop, disposed at a distal end of the exciter coil inner portion. The exciter may also include a drive mechanism, including at least a rotation component to rotate the exciter coil loop around the exciter axis.
Monolithic modular microwave source with integrated temperature control
Granted: November 12, 2024
Patent Number:
12144090
Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem…
Replacement contact process
Granted: November 12, 2024
Patent Number:
12142534
Processing methods may be performed to expose a contact region on a semiconductor substrate. The methods may include selectively removing a first region of a silicon material between source/drain regions of a semiconductor substrate to expose a first region of oxide material. The methods may include forming a liner over the first region of oxide material and contacting second regions of the silicon material proximate the source/drain regions of the semiconductor substrate. The methods…
Factory interface robots usable with integrated load locks
Granted: November 12, 2024
Patent Number:
12142508
A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.
Sensor-based correction of robot-held object
Granted: November 12, 2024
Patent Number:
12142503
A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error…
Stress treatments for cover wafers
Granted: November 12, 2024
Patent Number:
12142468
Exemplary methods of manufacturing a semiconductor cover wafer may include sintering aluminum nitride particles into a substrate characterized by a thickness and characterized by a disc shape. The methods may include grinding a surface of the substrate to reduce the thickness to less than or about 2 mm. The methods may include polishing the surface of the substrate to reduce a roughness. The methods may include annealing the substrate at a temperature of greater than or about 800° C.…
Self-assembled monolayer deposition from low vapor pressure organic molecules
Granted: November 12, 2024
Patent Number:
12142467
The present disclosure generally relates to a substrate processing chamber, a substrate processing apparatus, and a substrate processing method for self-assembled monolayer (SAM) deposition of low vapor pressure organic molecules (OM) followed by further substrate processing, such as atomic layer deposition.
Control and prediction of multiple plasma coupling surfaces and corresponding power transfer
Granted: November 12, 2024
Patent Number:
12142461
Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.
Processing system and method of delivering a reactant gas
Granted: November 12, 2024
Patent Number:
12139790
Embodiments described herein generally relate to a processing system and a method of delivering a reactant gas. The processing system includes a substrate support system, an injection cone, and an intake. The injection cone includes a linear rudder. The linear rudder is disposed such that the flow of reactant gas through the injection cone results in film growth on a specific portion of a substrate. The method includes flowing the gas through the injection cone and delivering the gas…
Symmetric plasma source to generate pie-shaped treatment
Granted: November 12, 2024
Patent Number:
12142458
Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
Crested barrier device and synaptic element
Granted: November 12, 2024
Patent Number:
12141688
A crested barrier memory device may include a first electrode, a first self-rectifying layer, and a combined barrier and active layer. The first self-rectifying layer may be between the first electrode and the active layer. A conduction band offset between the first self-rectifying layer and the combined barrier and active layer may be greater than approximately 1.5 eV. A valence band offset between the first self-rectifying layer and the combined barrier and active layer may be less…
Use of adaptive replacement maps in digital lithography for local cell replacement
Granted: November 12, 2024
Patent Number:
12141517
Embodiments described herein relate to a system, software, and a method of using the system to edit a design to be printed by a lithography system. The system and methods utilize a server of a maskless lithography device. The server includes a memory. The memory includes a virtual mask file. The virtual mask file includes cells and the cells include sub-cells that form one or more polygons. The server further includes a controller coupled to the memory. The controller is configured to…
Process abnormality identification using measurement violation analysis
Granted: November 12, 2024
Patent Number:
12141230
The subject matter of this specification can be implemented in, among other things, a method, system, and/or device to receive current metrology data for an operation on a current sample in a fabrication process. The metrology data includes a current value for a parameter at each of one or more locations on the current sample. The method further includes determining a current rate of change of the parameter value for each of the one or more locations. The current rate of change is…
Gray tone uniformity control over substrate topography
Granted: November 12, 2024
Patent Number:
12140871
Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the…
Large area seamless master and imprint stamp manufacturing method
Granted: November 12, 2024
Patent Number:
12140864
Embodiments of the present disclosure generally relate to pattern replication, imprint lithography, and more particularly to methods and apparatuses for creating a large area imprint without a seam. Methods disclosed herein generally include filling seams between pairs of masters with a filler material such that the seams are flush with a surface of the masters having a plurality of features disposed thereon.
Method to measure light loss of optical films and optical substrates
Granted: November 12, 2024
Patent Number:
12140494
A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the…
Filter isolation for equipment front end module
Granted: November 12, 2024
Patent Number:
12140339
Disclosed herein are systems and methods for reducing startup time of an equipment front end module (EFEM). The EFEM may include an EFEM chamber formed between a plurality of walls, an upper plenum above the EFEM chamber, the upper plenum in fluid communication with the EFEM chamber, a plurality of ducts that provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum, one or more filters that separate the upper plenum from the EFEM chamber, an…
Flat head units for heavy load alignment
Granted: November 12, 2024
Patent Number:
12140168
A mask frame support unit includes a case, a protruding body extending below the case, and a station having a flat head disposed above the case. The protruding body includes a tapered region and a cylindrical region. The tapered region includes a first end having a first diameter coupled to the case and comprising a second end having a second diameter opposite the first end. The second diameter is less than the first diameter, and the tapered region is coupled to the cylindrical region…
