Core configuration for in-situ electromagnetic induction monitoring system
Granted: October 1, 2024
Patent Number:
12103135
An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing…
Distortion current mitigation in a radio frequency plasma processing chamber
Granted: October 1, 2024
Patent Number:
12106938
Embodiments provided herein generally include apparatus, plasma processing systems and methods for distortion current mitigation. An example plasma processing system includes a voltage source coupled to an input node, which is coupled to an electrode disposed within a processing chamber, wherein the voltage source is configured to generate a pulsed voltage signal at the input node; a signal generator having an output, wherein the RF signal generator is configured to deliver a first RF…
Scanned angled etching apparatus and techniques providing separate co-linear radicals and ions
Granted: October 1, 2024
Patent Number:
12106936
A system may include a substrate stage, configured to support a substrate, where a main surface of the substrate defines a substrate plane. The system may include an ion source, including an extraction assembly that is oriented to direct an ion beam to the substrate along a trajectory defining a non-zero angle of incidence with respect to a perpendicular to the substrate plane. The system may include a radical source oriented to direct a radical beam to the substrate along a trajectory…
Modulation of rolling k vectors of angled gratings
Granted: October 1, 2024
Patent Number:
12106935
Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material…
Cyclotron having continuously variable energy output
Granted: October 1, 2024
Patent Number:
12106925
An apparatus may include a cyclotron to receive an ion beam as an incident ion beam at an initial energy, and output the ion beam as an accelerated ion beam at an accelerated ion energy. The apparatus may further include an RF source to output an RF power signal to the cyclotron chamber, the RF power source comprising a variable power amplifier, and a movable stripper, translatable to intercept the ion beam within the cyclotron at a continuum of different positions.
Run-to-run control at a manufacturing system using machine learning
Granted: October 1, 2024
Patent Number:
12105504
First data associated with a first process performed for a first layer of a substrate is identified. The first layer is to be further processed according to a second process. The first data is provided as input to a machine learning model that is trained to predict metrology measurement values for layers of substrates at the manufacturing system. An amount of drift of a first set of metrology measurement values for the first layer following completion of the first process and/or the…
Multi-tone scheme for maskless lithography
Granted: October 1, 2024
Patent Number:
12105424
Examples described herein provide a system, a software application, and a method of a lithography process to write multiple tones in a single pass. A system includes a stage and a lithography system. The lithography system includes image projection systems, a controller, and memory. The controller is coupled to the memory, which stores instruction code. Execution of the instruction code by the controller causes the controller to control the stage and the image projection systems to…
Mechanically-driven oscillating flow agitation
Granted: October 1, 2024
Patent Number:
12104269
Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first…
Atomic layer deposition of protective coatings for semiconductor process chamber components
Granted: October 1, 2024
Patent Number:
12104246
A method comprises depositing a first layer of aluminum oxide onto a surface of a chamber component via atomic layer deposition (ALD). The method further comprises depositing a second layer of yttrium oxide onto a surface of the chamber component via ALD, depositing a third layer of zirconium oxide onto the surface of the chamber component via ALD, and forming a corrosion and erosion resistant coating comprising a YZrxOy solid state phase of the second layer and the third layer, wherein…
Methods and apparatus for processing a substrate
Granted: October 1, 2024
Patent Number:
12104243
Methods and apparatus for processing a substrate is provided herein. For example, a method for processing a substrate comprises depositing a silicide layer within a feature defined in a layer on a substrate, forming one of a metal liner layer or a metal seed layer atop the silicide layer within the feature via depositing at least one of molybdenum (Mo) or tungsten (W) using physical vapor deposition, and depositing Mo using at least one of chemical vapor deposition or atomic layer…
Porous plug bonding
Granted: September 24, 2024
Patent Number:
12097665
Embodiments described herein generally relate to porous plugs having sealing layers for use in substrate support pedestals and methods for forming the same. In one or more embodiments, the sealing layer can be formed in-situ by applying a fluoroelastomer composition to at least one of the porous plug and the walls of a cavity of an electrostatic chuck. The fluoroelastomer composition can be cured in-situ to form the sealing layer between the porous plug and the wall of the cavity. The…
Apparatus for controlling lift pin movement
Granted: September 24, 2024
Patent Number:
12100614
Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further…
Minimal contact packaging for process chamber components
Granted: September 24, 2024
Patent Number:
12100613
Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. In some embodiments, a packaged chamber component for use in a process chamber includes: an insert having an annular trench disposed about a raised inner portion, wherein the annular trench is disposed between the raised inner portion and an outer lip, wherein a ledge couples the raised inner portion to the outer lip, wherein the ledge includes a first portion and a second portion…
Electrostatic chucking process
Granted: September 24, 2024
Patent Number:
12100609
One or more embodiments described herein generally relate to methods for chucking and de-chucking a substrate to/from an electrostatic chuck used in a semiconductor processing system. Generally, in embodiments described herein, the method includes: (1) applying a first voltage from a direct current (DC) power source to an electrode disposed within a pedestal; (2) introducing process gases into a process chamber; (3) applying power from a radio frequency (RF) power source to a showerhead;…
Metal oxide preclean chamber with improved selectivity and flow conductance
Granted: September 24, 2024
Patent Number:
12100576
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the chamber liner and extending radially inward from the chamber liner, wherein the confinement plate includes a plurality of slots; a shield ring disposed within the chamber liner and movable between the…
Adaptive settling time control for binary-weighted charge redistribution circuits
Granted: September 24, 2024
Patent Number:
12099569
A method and circuit for performing vector operations may include, for each sequentially performed operation, operating a switch that corresponds to a current bit-order. Operating the switch may cause a value corresponding to an output of the operation to be stored on a capacitor corresponding to the current bit-order. A time interval during which the switch is operated may be non-uniform with respect to time intervals for other switches, and the time interval may be based at least in…
Methods and apparatus for correcting lithography systems
Granted: September 24, 2024
Patent Number:
12099308
Aspects of the present disclosure relate to methods and apparatus for correcting lithography systems. In one implementation, a method of operating a lithography system includes directing first light beams toward a reflective surface of a first substrate using an optical module. The method includes directing the first light beams collected through at least an objective lens toward a camera, and taking a plurality of first images of the first light beams. The method includes directing…
Forming variable depth structures with laser ablation
Granted: September 24, 2024
Patent Number:
12099241
A method for forming a device structure is disclosed. The method of forming a device structure includes forming a variable-depth structure in a device material layer using a laser ablation. A plurality of device structures is formed in the variable-depth structure to define slanted device structures therein. The variable-depth structure and the slanted device structures are formed using an etch process.
Surface roughness and emissivity determination
Granted: September 24, 2024
Patent Number:
12098914
A system includes a radiation source configured to emit a radiation beam. The system further includes a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object. The system further includes a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to…
Methods of making nanopowders, nanoceramic materials and nanoceramic components
Granted: September 24, 2024
Patent Number:
12098107
Disclosed are methods of forming a chamber component for a process chamber. The methods may include filling a mold with nanoparticles or plasma spraying nanoparticles, where at least a portion of the nanoparticles include a core particle and a thin film coating over the core particle. The core particle and thin film are formed of, independently, a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride, or combinations thereof.…
