Intel Profile
Intel Patent Grants
Enhanced virtual function capabilities in a virtualized network environment
Patent Number 10127072 - November 13, 2018
The present disclosure is directed to enhanced virtual function capabilities in a virtualized network environment. In general, devices may…
Memory device error check and scrub mode and error transparency
Patent Number 10127101 - November 13, 2018
An error check and scrub (ECS) mode enables a memory device to perform error checking and correction (ECC) and count errors. An associated…
Multi-layer package with integrated antenna
Patent Number 10128177 - November 13, 2018
Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one…
Embedded die flip-chip package assembly
Patent Number 10128205 - November 13, 2018
Embodiments of the present disclosure describe integrated circuit (IC) package assemblies and methods of fabricating IC package assemblies.…
Packet tracking techniques for communication networks
Patent Number 10128984 - November 13, 2018
Packet tracking techniques for communication networks are described. In an example embodiment, an apparatus may comprise circuitry, a tracking…
Intel Patent Applications
REFRACTORY METAL ALLOY TARGETS FOR PHYSICAL VAPOR DEPOSITION
Application Number 20180327887 - November 15, 2018
Refractory metal alloy targets for reducing particles in physical vapor deposition processing and refractory metal-based layer for integrated…
MEMORY ELEMENTS WITH SOFT-ERROR-UPSET (SEU) IMMUNITY USING PARASITIC COMPONENTS
Application Number 20180330778 - November 15, 2018
An integrated circuit is provided that includes memory elements that exhibit immunity to soft error upset (SEU) events when subjected to…
PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN PACKAGE
Application Number 20180331004 - November 15, 2018
A system in package and method of making as system in package are disclosed. The system in package has a substrate (102) with a plurality of…
PACKAGE STACKING USING CHIP TO WAFER BONDING
Application Number 20180331070 - November 15, 2018
Embodiments are generally directed to package stacking using chip to wafer bonding. An embodiment of a device includes a first stacked layer…
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FOR PLATFORM MINIATURIZATION
Application Number 20180331081 - November 15, 2018
Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described.…
Intel Federal Litigation Filings
XMTT, Inc. v. Intel Corporation
Delaware District Court - November 16, 2018
VSLI Technology LLC v. Intel Corporation et al
California Northern District Court - November 13, 2018
Sanyo Electric Co., Ltd. v. Intel Corporation
Delaware District Court - October 30, 2018
Auctus Fund, LLC v. Arias Intel Corp.
Massachusetts District Court - October 15, 2018
QBEX Computadores S.A. v. Intel Corporation
Florida Southern District Court - September 18, 2018
Intel Federal District Court Decisions
Ali v. Intel Corporation
California Northern District Court - October 31, 2018
Order by Judge Lucy H. Koh granting 8 Motion to Dismiss with Leave to Amend.(lhklc2, COURT STAFF) (Filed on 10/31/2018) E-notification…
(PS) Bruzzone v. Intel Corporation
California Eastern District Court - September 28, 2018
ORDER signed by Magistrate Judge Deborah Barnes on 9/27/18 DISMISSING with leave to amend 1 Complaint. Within 28 days from the date of…
QBEX Computadoras S.A., v. Intel Corporation
California Northern District Court - September 28, 2018
ORDER REGARDING PLAINTIFF'S SEPTEMBER 27, 2018 DISCOVERY LETTER. Signed by Judge Susan van Keulen on 9/28/18. (djmS, COURT STAFF)…
QBEX Computadoras S.A., v. Intel Corporation
California Northern District Court - September 28, 2018
RESPONSE TO QBEX'S SEPTEMBER 28, 2018 SUBMISSION; ORDER TO MEET AND CONFER; REQUEST FOR FURTHER BRIEFING. Signed by Judge Susan van…
Tabaian et al v. Intel Corporation
Oregon District Court - September 22, 2018
OPINION: Regarding disqualification of Plaintiff's expert Mike Walters. Signed on 9/22/2018 by Judge Marco A. Hernandez. (jp)
Intel State Court Decisions
VLSI Technology LLC v. Intel Corporation
Delaware Delaware District Court - October 29, 2018
MEMORANDUM OPINION. Signed by Judge Colm F. Connolly on 10/29/2018. (fms)
Intel Corporation v. Tela Innovations, Inc.
California California Northern District Court - October 5, 2018
ORDER DENYING DEFENDANT'S 43 MOTION TO DISMISS by Judge William H. Orrick also denying 42 , 53 , 57 , 67 Administrative Motions to File…
Tabaian et al v. Intel Corporation
Oregon Oregon District Court - September 22, 2018
OPINION: Regarding disqualification of Plaintiff's expert Mike Walters. Signed on 9/22/2018 by Judge Marco A. Hernandez. (jp)
Intel Corporation v. Tela Innovations, Inc.
California California Northern District Court - September 18, 2018
ORDER DENYING DEFENDANT'S 28 MOTION TO TRANSFER VENUE AND DENYING PLAINTIFF'S AND DEFENDANT'S MOTIONS TO SEAL Judge William H.…
Godo Kaisha IP Bridge 1 v. Intel Corporation
Texas Texas Eastern District Court - September 13, 2018
CLAIM CONSTRUCTION OPINION AND ORDER. Signed by Magistrate Judge Roy S. Payne on 9/12/2018. (nkl, )
Intel Federal Appellate Court Decisions
TRICIA COOPER V. INTEL CORP. LTD PLAN
US Court of Appeals for the Ninth Circuit - May 11, 2017
MICHAEL BRUZZONE V. INTEL CORPORATION
U.S. Court of Appeals for the Ninth Circuit - November 21, 2016
BARBARA SCOLES V. INTEL CORP. LTD PLAN
U.S. Court of Appeals for the Ninth Circuit - July 29, 2016
HANGARTNER v. INTEL CORPORATION
U.S. Court of Appeals for the Federal Circuit - January 8, 2016
ALLEN RUDE V. INTEL CORP LTD BENEFIT PLAN
U.S. Court of Appeals for the Ninth Circuit - November 10, 2015
