Collection Optics
Granted: March 1, 2012
Application Number:
20120050890
An imaging system including a back-plane reflector having a concave aspherical reflecting surface and an outer diameter that is no greater than a first distance, with an aperture formed in the back-plane reflector, the aperture for admitting light from a field of view to the imaging system, a fore-plane reflector having a concave aspherical reflecting surface and an outer diameter that is no greater than the first distance, with an aperture formed in the fore-plane reflector, the…
Detecting Defects on a Wafer
Granted: February 23, 2012
Application Number:
20120044486
Systems and methods for detecting defects on a wafer are provided.
OPTICS SYMMETRIZATION FOR METROLOGY
Granted: February 9, 2012
Application Number:
20120033226
The present invention includes an illumination source, at least one illumination symmetrization module (ISM) configured to symmetrize at least a portion of light emanating from the illumination source, a first beam splitter configured to direct a first portion of light processed by the ISM along an object path to a surface of one or more specimens and a second portion of light processed by the ISM along a reference path, and a detector disposed along a primary optical axis, wherein the…
DYNAMIC WAVEFRONT CONTROL OF A FREQUENCY CONVERTED LASER SYSTEM
Granted: February 9, 2012
Application Number:
20120032065
The present invention is directed to a laser system in which a current laser wavefront performance of the laser system may be monitored. Further, the laser system embodiments disclosed herein may be configured for correcting the laser wavefront internally via correction system(s) within the laser system. Still further, the correction system(s) disclosed herein may provide a long lifetime of performance and may be configured for having a minimal impact on photocontamination.
DYNAMIC CARE AREAS
Granted: February 2, 2012
Application Number:
20120029858
Various embodiments for determining dynamic care areas are provided.
METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES
Granted: February 2, 2012
Application Number:
20120029856
The present invention may include performing a first measurement process on a wafer of a lot of wafers, wherein the first measurement process includes measuring one or more characteristics of a plurality of targets distributed across one or more fields of the wafer, determining a set of process tool correctables for a residual larger than a selected threshold level utilizing a loss function, wherein the loss function is configured to fit a model for one or more process tools, as a…
READOUT METHODOLOGY FOR MULTI-CHANNEL ACQUISITION OF SPATIALLY DISTRIBUTED SIGNAL
Granted: February 2, 2012
Application Number:
20120029854
A readout apparatus and method for processing spatially distributed signals is disclosed. The readout apparatus and method may reduce/eliminate the impact gain variations among a plurality of sensing channels. This is done by continuously varying the dispersion properties of a signal distribution device, which may induce a spatial shift of the signal distribution during data acquisition, allowing the distributed signals to move across the sensor area. Shifting of the distributed signals…
LOW STRAY LIGHT BEAM DUMP WITH FIBER DELIVERY
Granted: February 2, 2012
Application Number:
20120026749
The present invention is directed to a beam dump which is configured for not increasing a temperature of a laser with which it may be implemented. The beam dump may include an opaque enclosure which is configured for receiving light (ex.—initial light) from a light source (ex.—a frequency-converted laser), said light being delivered through an aperture of the enclosure via one or more connected optical fibers. The received light may be scattered within the enclosure. However, the…
Multi-Spot Illumination for Wafer Inspection
Granted: February 2, 2012
Application Number:
20120026489
Illumination subsystems for multi-spot wafer inspection are provided.
ADVANCED PROCESS CONTROL OPTIMIZATION
Granted: January 26, 2012
Application Number:
20120022679
A method for automatic process control (APC) performance monitoring may include, but is not limited to: computing one or more APC performance indicators for one or more production lots of semiconductor devices; and displaying a mapping of the one or more APC performance indicators to the one or more production lots of semiconductor devices.
Inspecting a Workpiece Using Polarization of Scattered Light
Granted: January 19, 2012
Application Number:
20120013898
A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable polarization a polarizing relay assembly arranged to selectively permit the scattered light having a selected polarization orientation to pass along a detector optical axis to a…
IN-PLACE MANAGEMENT OF SEMICONDUCTOR EQUIPMENT RECIPES
Granted: January 12, 2012
Application Number:
20120010843
Systems and methods for managing optical inspection target components are disclosed. A method may include, but is not limited to: storing at least one external recipe component at an inspection tool node; associating at least one proxy component with the at least one external recipe component; associating the at least one external recipe component with at least one optical inspection target recipe; and storing the at least one optical inspection target recipe including the at least one…
Active Planar Autofocus
Granted: January 12, 2012
Application Number:
20120008137
A system for inspecting a constant layer depth relative to a particular device layer. The system has an image sensor with a fixed focal plane. A focus sensor senses the surface topography of the substrate and outputs a focus data stream. A stage moves the substrate in an XY plane, and a motor moves the substrate in a Z dimension. A controller operates the system in one of a setup mode and an inspection mode. In the setup mode the controller controls XY movement of the substrate so as to…
Selecting One or More Parameters for Inspection of a Wafer
Granted: December 29, 2011
Application Number:
20110320149
Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided.
SYSTEM AND METHOD FOR INTERFEROMETRIC AUTOFOCUSING
Granted: December 29, 2011
Application Number:
20110317168
The present invention includes a camera configured to collect light reflected from the surface of a specimen, a two beam interference optical system including: an illumination source; a reference mirror configured to reflect substantially less light from a center region than from a peripheral region; and a first beam splitter configured to direct a first portion of light from the illumination source along an object path and a second portion of light from the illumination source along a…
METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEVICE DURING POLISHING, DAMAGE TO A SPECIMEN DURING POLISHING, OR A CHARACTERISTIC OF A POLISHING PAD OR TOOL
Granted: December 22, 2011
Application Number:
20110313558
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output…
DISCRETE POLARIZATION SCATTEROMETRY
Granted: December 22, 2011
Application Number:
20110310388
Systems and methods for discrete polarization scatterometry are provided.
RETICLE DEFECT INSPECTION WITH MODEL-BASED THIN LINE APPROACHES
Granted: December 8, 2011
Application Number:
20110299759
Provided are novel inspection methods and systems for inspecting photomasks to identify various defects using a model-based approach and information obtained from modeled images. Modeled or simulation images are generated directly from test or reference images. Some examples include aerial images that represent expected patterns projected by a lithography system on a substrate as well as photoresist images that represent expected resist patterns. Test images are first represented as a…
Wafer Plane Detection of Lithographically Significant Contamination Photomask Defects
Granted: December 8, 2011
Application Number:
20110299758
Provided are novel methods and systems for inspecting photomasks to identify lithographically significant contamination defects. Inspection may be performed without a separate reference image provided from a database or another die. Inspection techniques described herein involve capturing one or more test images of a photomask and constructing corresponding test “simulation” images using specific lithographic and/or resist models. These test simulation images simulate printable…
Multi-Wavelength Pumping to Sustain Hot Plasma
Granted: December 1, 2011
Application Number:
20110291566
A method of sustaining a plasma, by focusing a first wavelength of electromagnetic radiation into a gas within a volume, where the first wavelength is substantially absorbed by a first species of the gas and delivers energy into a first region of a plasma having a first size and a first temperature. A second wavelength of electromagnetic radiation is focused into the first region of the plasma, where the second wavelength is different than the first wavelength and is substantially…
